industry news
Subscribe Now

512Kbyte STM32F3 MCUs from STMicroelectronics Raise the Bar in System Integration

Geneva, January 29, 2015 – STMicroelectronics has extended its STM32F3 microcontroller series for applications that require high performance and innovative features at affordable cost. The new devices add larger memory densities up to 512Kbyte Flash and 80KB SRAM, as well as richer peripherals for high-speed control and off-chip storage.

The STM32F3 series defines the entry point to ST’s ARM® Cortex®-M4 microcontroller portfolio. The proven M4 core with DSP and floating-point unit, running up to 72MHz, executes deterministic routines such as motor-control loops up to 43% faster with the unique ST “Routine Booster” based on core-coupled memory (CCM-SRAM). Positioned in the performance spectrum immediately above ST’s STM32F1 Cortex-M3 series, STM32F3 devices are part of the STM32 portfolio that comprises more than 600 devices delivering the advantages of extensive hardware and software commonalities, easy-to-use design tools, and development ecosystem.

Now with up to 512KByte Flash memory in the STM32F303 and STM32F302 devices, the F3 series can support even more sophisticated applications. New features include extra SPI and I2C communication interfaces, and a Flexible Memory Controller (FMC) with 36MHz access on 8/16bit bus for various off-chip storage and LCD modules. There are also up to three 144MHz 16-bit motor-control timers for multi-motor products found in home appliances, power tools, and industrial equipment. In addition, ST’s new Motor Ecosystem for STM32, which comprises a software-development kit (STSW-STM32100) and new hardware, provides further support for a faster and easier motor-control development experience.

The enhanced features are added to the already rich peripherals offered for the STM32F3 series. These include 12-bit ADCs each with class-leading 5Msample/s performance, true 16-bit Sigma-Delta ADCs, fast comparators (25ns), agile High-Resolution Timers (217ps) with complex-Waveform Builder, and uncommitted Programmable-Gain Amplifier (PGA). LQFP, BGA or WLCSP options are offered, covering 32 to 144 pins.

These new devices can be evaluated on two different hardware boards: NUCLEO-F303RE  featuring a 64-pin device for fast prototyping and sampling, and STM32303E-EVAL featuring a 100-pin device for evaluation. The full embedded software package is also provided, covering not only peripherals drivers, but also libraries and stacks (CubeF3). The associatedSTM32CubeMX tool simplifies configuration and initialization to ensure an easy start-up.

The STM32F302 with 512KByte Flash is available now, priced $3.38 for orders of 10,000 pieces in the LQFP64 package.

 

For further information please visit: www.st.com/stm32f3

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Intel AI Update
Sponsored by Mouser Electronics and Intel
In this episode of Chalk Talk, Amelia Dalton and Peter Tea from Intel explore how Intel is making AI implementation easier than ever before. They examine the typical workflows involved in artificial intelligence designs, the benefits that Intel’s scalable Xeon processor brings to AI projects, and how you can take advantage of the Intel AI ecosystem to further innovation in your next design.
Oct 6, 2023
25,813 views