Geneva, March 10, 2015 – STMicroelectronics’ new DLPF-GP-01D3 integrated dual differential filter can replace up to 16 discrete surface-mount components and save 35mm² of pc-board area in ZigBee^® RF4CE^[1] remotes and equipment such as set-top boxes, TVs, home gateways, alarms, and lighting. The extra space gives designers freedom to simplify board layout, reduce product size, or add new functions.

The DLPF-GP-01D3 is … Read More → "Market’s Smallest Single-Chip Dual-Channel Filter from STMicroelectronics Streamlines Design of ZigBee® Remotes for Consumer and IoT Devices"

Heerbrugg, Switzerland – 9 March 2015 – ESCATEC, one of Europe’s leading providers of contract and manufacturing services, has invested in the next generation of ultra small needles for bed of nails testing of high density, micro-scale PCBs.  This will enable the company to provide customers with next generation, high density, micro-scale PCBs that are growing in popularity, especially for wearable electronics and Internet of Things (IoT) applications.  Automated bed of nails testing ensures that production costs are kept low for customers and that yields are improved as manual testing with probes is eliminated.

“PCBs are always getting smaller and … Read More → "ESCATEC investment enables it to offer manufacture and test of next generation, high density, micro-scale PCBs"