News – Page 1526 – EEJournal

HUBER+SUHNER provides live demonstrations of termination techniques affiliated with “EACON” field-mountable cable assembly products at IMS 2015

May 19, 2015

Live demonstrations of EACON field-mountable cable assembly preparation and termination techniques will occur within Booth 3647 intermittently throughout the show at this week’s International Microwave Symposium event in Phoenix. The company is once again proving its extensive expertise in RF and microwave applications, providing customers with unique integration options for ruggedized applications requiring flexibility and performance.

Visitors at the event will be able to see live demonstrations of how to prepare and terminate HUBER+SUHNER’s EACON series cable assembly products. These field-mountable microwave cables and connectors are lightweight, highly flexible, and waterproofed to IP 68 standards, yet … Read More → "HUBER+SUHNER provides live demonstrations of termination techniques affiliated with “EACON” field-mountable cable assembly products at IMS 2015"

Cree 12GHz GaN HEMT-based MMICs Now at Mouser

May 19, 2015

May 18, 2015 – Mouser Electronics, Inc., the global authorized distributor with the newest semiconductors and electronic components, is now stocking the Gallium Nitride High Electron Mobility Transistor (HEMT) Monolithic Microwave Integrated Circuits (MMICs) from Read More → "Cree 12GHz GaN HEMT-based MMICs Now at Mouser"

Fairchild’s Tiny, Low-Power USB Type-C Solution Makes Debut in LeTV’s New Smartphone Family

May 18, 2015

SAN JOSE, Calif. – May 18, 2015 – Fairchild (NASDAQ: FCS), a leading global supplier of high-performance semiconductor solutions, today announced that its first commercial USB Type-C devices are shipping in LeTV’s newly launched Le 1, Le 1 Pro and Le MAX series smartphones. Fairchild’s latest USB solution integrates all key features of the new Type-C connector in an amazingly tiny 1.2mm x 1.2mm WLCSP package. Small footprint and extremely low standby power operation makes the solution ideal for the next wave of mobile products, dongles, travel adapters, PCs, accessories, and wearables which will … Read More → "Fairchild’s Tiny, Low-Power USB Type-C Solution Makes Debut in LeTV’s New Smartphone Family"

Easy-to-Configure Controllers from STMicroelectronics Simplify Digital Power Conversion

May 18, 2015

Geneva, May 18, 2015 – The STNRG digital-controller family, new from STMicroelectronics, helps designers maximize the advantages of digital power conversion, including high efficiency under all load conditions, enhanced safety, rich diagnostics, and convenient network connectivity.

Rugged enough for high-end industrial applications as well as outdoor equipment such as solar-power converters, EV charging stations, and industrial switched-mode power supplies (SMPS), the STNRG ICs contain ST’s unique State Machine Event Driven (SMED) high-resolution pulse-width modulation (PWM) generator, in … Read More → "Easy-to-Configure Controllers from STMicroelectronics Simplify Digital Power Conversion"

ADLINK Introduces New 4-CH 12-bit 80 MS/s PCI Express Digitizer

May 15, 2015

ADLINK Technology, Inc., a leading global provider of cloud-based services, intelligent gateways, and embedded building blocks for edge devices that enable the Internet of Things (IoT), today announced the release of its new high-speed PCI Express digitizer, the PCIe-9814 , featuring four simultaneously sampled 80 MS/s input channels with 12-bit resolution, 40 MHz bandwidth, and up to 1 GB DDR3 onboard memory.

JSR and imec Partner to Enable Next Generation EUV Lithography Resist Solutions

May 15, 2015

TOKYO, Japan and Leuven, Belgium – May 12, 2015 – JSR Corporation, a leading materials company and imec, a world-leading nanoelectronics R&D center, today signed a Letter of Intent (LOI) to partner in enabling manufacturing and quality control of EUV lithography materials for the semiconductor industry. This partnership will be formalized by establishing a joint venture with imec as minority shareholder. The signing ceremony was held at the Embassy of the Kingdom of Belgium in Tokyo (Japan).

EUV lithography is considered as one of the main drivers to extend Moore’s law towards single digit nanometer technology nodes. Imec … Read More → "JSR and imec Partner to Enable Next Generation EUV Lithography Resist Solutions"

QLogic and Cavium Collaborate to Deliver Accelerated Performance for Enterprise and Cloud Storage Applications

May 15, 2015

ALISO VIEJO, Calif. – May 14, 2015 – QLogic Corp. (Nasdaq:QLGC), a leading supplier of high performance network infrastructure solutions, today announced that it has developed a joint solution with Cavium Inc. (NASDAQ:CAVM), a leading provider of products that enable secure and intelligent processing for enterprise, data center, wired and wireless networking. The big data infrastructure solution utilizes low-latency QLogic^® 25Gb Ethernet (25GbE) RDMA-enabled NICs (RNICs), a massively scalable cluster of compute nodes based on high-performance 48 core ThunderX processors optimized for … Read More → "QLogic and Cavium Collaborate to Deliver Accelerated Performance for Enterprise and Cloud Storage Applications"

Express Logic X-Ware Platform Supports AndesCore™ Development Platforms

May 15, 2015

San Diego, CA, May 13, 2015—Express Logic, Inc., the worldwide leader in royalty-free real-time operating systems (RTOSes), has expanded its support for X-Ware Platform to include the AndesCore™ Development Platforms. The X-Ware platform is Express Logic’s integrated run-time software that combines all X-Ware components (ThreadX®, NetX™, USBX™, FileX®, GUIX™, and TraceX®) pre-ported and fully integrated for use on specific development boards. The X-Ware Platform helps developers avoid the significant development and integration work ordinarily associated with the use of generic software products on a specific board.

“The Express Logic X-Ware platform aligns perfectly with our efforts to … Read More → "Express Logic X-Ware Platform Supports AndesCore™ Development Platforms"

Rugged, Industrial-Strength 4-Port USB Hub Features Extended Temperature and 3.5 Inch Drive Bay Front Panel Mounting

May 15, 2015

May 13, 2015—SAN DIEGO, CA — ACCES I/O Products, Inc., is pleased to announce the availability of a rugged, industrial-strength 4-port USB hub that mounts in a 3.5 inch drive bay—model USB-3.5-HUB. This small industrial/military grade hub features extended temperature operation (-40°C to 85°C), high retention USB connectors, and an industrial steel drive bay mounting bracket for shock and vibration mitigation. The 3.5? front panel drive bay mounting provision allows for easy installation in rack-mount industrial and military grade style chassis, as well as in home or office PCs.

The USB-3.5-HUB now brings four high-performance … Read More → "Rugged, Industrial-Strength 4-Port USB Hub Features Extended Temperature and 3.5 Inch Drive Bay Front Panel Mounting"

High-Speed A/D Converters from Microchip Feature High Integration Integration Low-Power 14-/12-bit, 200 Msps Stand-Alone ADCs

May 15, 2015

CHANDLER, Ariz., May 14, 2015 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced two families of new high-speed A/D converters in the MCP37DX0-200 and MCP372X0-200 families. These families feature 12- and 14- bit pipelined A/D converters with a maximum sampling rate of 200 Mega samples per … Read More → "High-Speed A/D Converters from Microchip Feature High Integration Integration Low-Power 14-/12-bit, 200 Msps Stand-Alone ADCs"