News – Page 1519 – EEJournal

Buck Converter from Diodes Incorporated Raises Portable Efficiency

June 2, 2015

Plano, Texas – June 2nd, 2015 – Achieving typical efficiencies greater than 95%, the miniature AP3403 step-down DC-DC converter from Diodes Incorporated helps lengthen the battery lifetime of smartphones and other low-voltage portable products. This converter is a synchronous PWM device that drives a load at up to 600mA, with high efficiency maintained through a configuration of external resistor, capacitor and inductor components.

To support mini Li-Ion battery operation, the input voltage range is low at 2.7V to 5V, with no-load current being only 34µA. The … Read More → "Buck Converter from Diodes Incorporated Raises Portable Efficiency"

Embedded Focus at the 52nd DAC: Keynotes, SKY Talks, Conference Sessions, Panels, Workshops, Tutorials and Co-located Conference Embedded TechCon

June 2, 2015

LOUISVILLE, Colo. –– June 2, 2015 –– The Embedded Systems and Software (ESS) track at the 52^nd Design Automation Conference (DAC) offers embedded system designers and industry professionals the opportunity to connect through an engaging technical program that addresses all aspects of the embedded development ecosystem. DAC 2015 will be held at Moscone Center in San Francisco, Calif. from June 7- 11, 2015. Embedded TechCon, co-located with DAC, provides practical, hands-on education from June 8-10. Complementing the technical programs of each conference, the … Read More → "Embedded Focus at the 52nd DAC: Keynotes, SKY Talks, Conference Sessions, Panels, Workshops, Tutorials and Co-located Conference Embedded TechCon"

Fujifilm and imec demonstrate full-color organic light-emitting diodes with photoresist technology for organic semiconductors

June 2, 2015

June 2, 2015 – Leuven (Belgium) – FUJIFILM Corporation (President: Shigehiro Nakajima) (hereafter, “Fujifilm”) and nano-electronics research institute, imec (CEO: Luc Van den hove), have demonstrated full-color organic light-emitting diodes (OLED)*1 by using their jointly-developed photoresist technology*2 for organic semiconductors, a technology that enables submicron*3 patterning. This breakthrough result paves the way to producing high-resolution and large organic Electroluminescent (EL) displays and establishing cost-competitive manufacturing methods.

Organic EL displays are increasingly used for televisions, mobile devices including smartphones as well as wearable devices. Since they can be made … Read More → "Fujifilm and imec demonstrate full-color organic light-emitting diodes with photoresist technology for organic semiconductors"

Laird Puts Connected Vehicles Through Real-World Testing

June 2, 2015

June 2, 2015 – Global technology leader Laird (LRD: London) helps develop products and standards for future Vehicle-to-Vehicle and Vehicle-to-Infrastructure applications by joining the U.S. Department of Transportation’s (DOT) Affiliated Test Bed program.

The Connected Vehicle Test Bed is a federally funded, operational test site established to determine the feasibility and technical limitations of Dedicated Short Range Communication (DSRC). Laird was accepted to … Read More → "Laird Puts Connected Vehicles Through Real-World Testing"

Movimento Launches First OTA Platform to Update Every Car Module, Including Legacy Vehicles

June 2, 2015

TU-Automotive Detroit – June 2, 2015 – The Software-Defined Car™, those intelligent vehicles we are now increasingly driving, took a giant step forward in functionality and security through today’s introduction of the new Movimento Over-the-Air (OTA) Platform. The platform marks the first time that the three key elements of data, security and OTA software management are brought together in a single platform. The news was unveiled at the TU-Automotive Detroit 2015, taking place Read More → "Movimento Launches First OTA Platform to Update Every Car Module, Including Legacy Vehicles"

Microchip’s New Smart Hub with FlexConnect Broadens Application Space of USB3.0 Hubs

June 2, 2015

CHANDLER, Ariz., June 2, 2015 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced from Computex Taipei the first USB3.0 Smart Hub that enable host and device port swapping, I/O bridging, and various other serial communication interfaces. The USB5734 and USB5744feature an integrated microcontroller that enables new functionality for USB hubs while lowering overall BOM costs and reducing software complexity. The USB5734/44 family is USB-IF logo certified (TID 330000058) and features … Read More → "Microchip’s New Smart Hub with FlexConnect Broadens Application Space of USB3.0 Hubs"

I²C Bus Address Translators Resolve Address Conflicts with No Additional Software Coding or I²C Multiplexers

June 2, 2015

MILPITAS, CA – June 2, 2015 – Linear Technology Corporation introduces the LTC4316/Read More → "I²C Bus Address Translators Resolve Address Conflicts with No Additional Software Coding or I²C Multiplexers"

IAR Systems adds powerful code analysis possibilities for Atmel 8-bit AVR developers

June 2, 2015

Uppsala, Sweden—June 2, 2015—IAR Systems® presents version 6.60 of its development tools IAR Embedded Workbench® for AVR. The update extends code analysis possibilities with the integration of static code analysis tools as well as stack usage analysis.

Version 6.60 of IAR Embedded Workbench for AVR adds support for IAR Systems’ static analysis add-on product C-STAT®. Completely integrated in the IAR Embedded Workbench IDE, C-STAT can perform numerous checks for compliance with rules as defined by the coding standards MISRA C:2004, MISRA C++:2008 and MISRA C:2012, as well as rules … Read More → "IAR Systems adds powerful code analysis possibilities for Atmel 8-bit AVR developers"

Brite Collaborates with SMIC and CEVA on Configurable IoT Solution Roadmap: Ultra Low-Power 55nm eFlash process and wireless baseband form basis for a China IoT ASIC Platform

June 2, 2015

Shanghai, China—June 2, 2015— Brite Semiconductor, an emerging ASIC design services firm headquartered in Shanghai, China, announced today the collaborative development of a design platform roadmap with key industry partners, including Semiconductor Manufacturing International Corporation (“SMIC”). The platform is designed to support Internet-of-Things (“IoT”) IC’s addressing the China market’s emerging needs for smart devices, wirelessly-connected to Cloud infrastructure.

Brite is developing its China IoT ASIC Platform based on SMIC’s 55nm low-leakage (LL) and ultra-low-power (ULP) process roadmap,which includes embedded flash (eFlash) memory. Over the design platform’s lifetime, these processes can significantly reduce operating … Read More → "Brite Collaborates with SMIC and CEVA on Configurable IoT Solution Roadmap: Ultra Low-Power 55nm eFlash process and wireless baseband form basis for a China IoT ASIC Platform"

Docea Power Reveals Aceplorer 4.0 and Thermal Profiler 4.0 to Speed Up Power and Thermal Management Policies Development and Validation at DAC52

June 1, 2015

Grenoble, France and San Jose, CA – May 29, 2015– Docea Power, the provider of virtual prototyping solutions for power and thermal, will reveal at the 52^nd Design Automation Conference (DAC) the latest releases of its Aceplorer and Thermal Profiler software tools. Docea Power will demonstrate new advances in power and thermal management modeling and simulation with Aceplorer 4.0 and Thermal Profiler 4.0 new solvers to speed up thermal verification.

Aceplorer 4.0 features a new programming interface, the PTM-API (Power and Thermal Management Application Programming Interface) for … Read More → "Docea Power Reveals Aceplorer 4.0 and Thermal Profiler 4.0 to Speed Up Power and Thermal Management Policies Development and Validation at DAC52"