MILPITAS, CA – October 21, 2013 – Linear Technology Corporation announces the LT8614, a 4A, 42V input capable synchronous step-down switching regulator. A unique Silent Switcher™ architecture reduces EMI/EMC emissions by more than 20dB, well … Read More → "42V, 4A (IOUT), Synchronous Step-Down Silent Switcher Needs Only 2.5µA of Quiescent Current"
MOUNTAIN VIEW, Calif., October 16, 2013 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of DSP cores and platform solutions, today introduced the CEVA-XC4500 DSP – the world’s first vector floating-point DSP specifically designed for advanced wireless infrastructure solutions. The CEVA-XC4500 incorporates a range of features that enable unrivalled performance for even the most demanding infrastructure applications, including a baseband-dedicated instruction set architecture (ISA), IEEE-compliant floating point support on full vector elements delivering up to 40 GFLOPs performance, comprehensive multi-core support, a fully cached … Read More → "CEVA Introduces the CEVA-XC4500, the World’s First Vector Floating-Point DSP for Wireless Infrastructure Solutions"
DALLAS (October 21, 2013) – Texas Instruments (TI) (NASDAQ: TXN) today introduced the first analog DC/DC step-down controller with remote bipolar junction transistor (BJT) temperature-compensated inductor current sensing that minimizes total solution footprint in high-power POL conversion. The 20-V LM27403 DC/DC synchronous buck controller provides greater than 95-percent efficiency from a 12-V input at 25 A of output current to optimize solution size and deliver fast transient response in communications infrastructure, industrial, medical and power module applications. Used in conjunction with TI’s award-winning Read More → "TI introduces industry’s first analog DC/DC controller with dynamic temperature-compensated inductor current sensing"
SAN JOSE, Calif., October 17, 2013 – Integrated Device Technology, Inc. (IDT®) (NASDAQ: IDTI), the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, today announced the third generation of its Universal Frequency Translator (UFT) family of timing devices for high-performance optical networks, wireless base stations, and 100 Gigabit Ethernet (GbE) interface applications. The new UFT devices are the industry’s only single-chip programmable solutions capable of generating … Read More → "IDT Announces Third-generation High-performance, Programmable Universal Frequency Translator for 100 Gbps Interfaces"
SAN JOSE, CA–(Marketwired – October 21, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, will give the first public demonstrations of its new IO-SSO Analysis Suite at the EPEPS conference Oct. 27 to Oct. 30 in San Jose. EPEPS (Electrical Performance of Electronic Packaging and Systems) is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of … Read More → "Cadence to Unveil New IO-SSO Analysis Suite at EPEPS Conference"
SAN JOSE, Calif. and HSINCHU, Taiwan – Oct. 21, 2013 – Xilinx Inc. (NASDAQ: XLNX) and TSMC (TWSE: 2330, NYSE: TSM) today announced production release of the Virtex®-7 HT family, the industry’s first heterogeneous 3D ICs in production. With this milestone, all Xilinx 28nm 3D IC families are now in volume production. These 28nm devices were developed on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS™) 3D IC process that produces significant silicon scaling, power and performance benefits by integrating multiple components on a single device. This achievement at 28nm positions Xilinx for further success with TSMC’s proven 20SoC and 16FinFET processes, … Read More → "Xilinx and TSMC Reach Volume Production on all 28nm CoWoS™-based All Programmable 3D IC Families"
Jonkoping, Sweden 21/10 2013 – Atollic today announced the launch of TrueSTUDIO Premium edition. Built on the well-established TrueSTUDIO Pro, a powerful IDE for embedded C/C++ development, the Premium edition extends the tool’s capabilities even further to include code testing and test quality measurement features as standard.
The TrueSTUDIO Premium edition is designed to help embedded systems developers to achieve two important, but often mutually exclusive, goals of achieving higher software quality, while at the same time, meeting ever increasing time-to-market requirements for product releases.
“By combining Atollic TrueSTUDIO Pro with … Read More → "Atollic leads industry with launch of first embedded IDE with code testing and quality management features as standard"
SAN JOSE, CA–(Marketwired – October 21, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Taiwan-based VIA Technologies has selected the Cadence® Tensilica® HiFi Audio/Voice DSP (digital signal processor) for a system-on-chip (SOC) design for set top box, tablets and mobile devices.
“ … Read More → "VIA Technologies Licenses Cadence Tensilica HiFi Audio/Voice DSP"
MEMS Technology Showcase® will give MEMS Executive Congress US® attendees an intimate look at some of the most unique and inspiring MEMS-enabled applications in the business. After a competitive application process, MEMS Industry Group (MIG) has selected five finalists that show how MEMS enhances the consumer experience, highlighting the “MEMS inside the machine.” Each finalist will get five minutes to wow the audience, who will then text-message vote for their favorite demo. Moderator Read More → "MEMS Technology Showcase Finalists Highlight “MEMS Inside the Machine”"
October 18, 2013, Depew, N.Y., USA – PCB Automotive Sensors, a division of PCB Piezotronics, Inc., introduces a miniature pressure sensor for achieving highly accurate pressure measurements in thermodynamic applications such as engine and powertrain development.
