Leti Reports FinFET Feasibility and Circuit Design for Better Area, Speed and Power Trade-offs with CoolCube Technology
GRENOBLE, France – July 13, 2015 – CEA-Leti today announced its first results towards the demonstration of CoolCube’s feasibility in FinFET technology on its 300mm production line, and new CoolCubeTM circuit designs that improve the trade off between area, speed and power.
Key process steps developed on 300mm wafers show progress in closing the gap between the demonstration of a single device and taking the technology to fabrication.
CoolCubeTM is Leti’s sequential integration technology that enables the stacking of active layers of transistors in the third dimension. Under development for eight … Read More → "Leti Reports FinFET Feasibility and Circuit Design for Better Area, Speed and Power Trade-offs with CoolCube Technology"

