News – Page 1495 – EEJournal

ams launches next-generation NFC interface tag IC with advanced data and energy management features

May 20, 2015

Unterpremstaetten, Austria (May 20, 2015) — ams AG (SIX: AMS), a leading provider of high performance sensors and analog ICs, today launched the AS3955, an NFC interface chip (NFiC™) which offers unique energy harvesting and data transfer capabilities.

Like its predecessor the AS3953, the AS3955 provides a contactless bridge between an NFC reader (for instance, a smartphone or tablet) and any microcontroller. But the AS3955 can also act as a power supply for the host device, harvesting as much as 5mA at 4.5V – enough to charge a
Li-ion cell … Read More → "ams launches next-generation NFC interface tag IC with advanced data and energy management features"

IAR Systems boosts 8051 development targeting Internet of Things

May 20, 2015

Uppsala, Sweden—May 11, 2015—IAR Systems® has released a new version of its popular development toolchain IAR Embedded Workbench® for 8051. The high-performance compiler and debugger toolchain has been further improved with added support for new IoT-targeted microcontrollers as well as parallel build for shorten build times.

The 8051 technology has become very popular in low-power, sensor-dense Internet of Things (IoT) applications. To make full use of these devices, developers need powerful, easy-to-use tools that create small and smart code. Version 9.20 of IAR Embedded Workbench for 8051 adds full support for the EFM8 microcontroller series from Silicon Labs. The energy-efficient … Read More → "IAR Systems boosts 8051 development targeting Internet of Things"

Lose power, not data. New ultra-low-power FRAM microcontrollers from Texas Instruments revolutionize context save and restore.

May 20, 2015

DALLAS (May 20, 2015) – Overcoming a design hurdle that has burdened engineers for decades, Texas Instruments (TI) (NASDAQ: TXN) today announced a revolutionary Compute Through Power Loss (CTPL) technology to enable context save and restore across its MSP430™ FRAM microcontroller (MCU) family, including the new MSP430FR6972 MCU. This patent-pending technology enables instantaneous wakeup with intelligent system-state restoration after an application unexpectedly loses power. In … Read More → "Lose power, not data. New ultra-low-power FRAM microcontrollers from Texas Instruments revolutionize context save and restore."

Imec and Lam Research Corporation Develop Novel Metallization Method

May 19, 2015

IEEE IITC, Grenoble (France)—May 19, 2015—During the IEEE IITC conference in Grenoble, the nanoelectronics research center imec and Lam Research Corporation today presented a novel bottom-up prefill technique for vias and contacts. The technique, based on Electroless Deposition (ELD) of Cobalt (Co) is a highly selective method resulting in void-free filling of via and contact holes. Potentially increasing the circuit performance, it is a promising path to scaling advanced interconnects and enabling future logic and DRAM nodes at the 7 nm node and below.

MAZeT amplifies signals delivered by optoelectronic sensors

May 19, 2015

Jena, Germany, 19 May 2015. Integrated signal amplifiers and converters from MAZeT GmbH, specialized in the development and custom production of embedded systems and optoelectronics, convert sensor signals from optical sensors in high resolution and for the frequency and bandwidth required by the specific application. The extended range of signal ASICs comprises the fast MTI04 and MTI08 transimpedance amplifiers and analog converters as well as the MDDC04AQ and MCDC04EQ current-to-digital converters, featuring very high amplification and bandwidth. MAZeT’s ASICs meet the demand in the area … Read More → "MAZeT amplifies signals delivered by optoelectronic sensors"

DIN rail DC-DC converters offer a wide input and noise immunity for industrial applications

May 19, 2015

XP Power announced today the DDC15 and DDC30 series of low profile 15 Watt and 30 Watt DIN rail format DC-DC converters. The range is designed to offer additional voltages in DIN rail power systems, provide isolated outputs & noise immunity or support battery powered or battery backed applications. The single output converters accommodate the wide 4:1 input range from 9 – 36 VDC suiting a 12 or 24 VDC nominal input. Both series are available with a choice of a 5, 9, 12, 15 or 24 VDC nominal output. Additionally, the DDC15 model is available with a 3.3 VDC output. Input to output isolation is 1500 VDC.

Occupying … Read More → "DIN rail DC-DC converters offer a wide input and noise immunity for industrial applications"

Innovasic Demonstrates “In-Line” Security for the Industrial Internet of Things

May 19, 2015

Albuquerque, NM, May 2015 – Innovasic has partnered with Altera Corporation to demonstrate a novel security approach at the industrial field device level. Dubbed “Transparent In-Line Encryption”, or TILE^™, Innovasic has integrated this unique encryption approach into its fido5000 Real-time Ethernet Multi-protocol (REM) Switch using an Altera Cyclone V FPGA.

Based on the SiMON encryption engine, developed by the US Government, the TILE^™ module in the fido5000 REM Switch provides encryption as secure as AES, but at an order of magnitude lower cost in terms of silicon area. Latency is only a few cycles so … Read More → "Innovasic Demonstrates “In-Line” Security for the Industrial Internet of Things"

UltraSoC and Teledyne LeCroy collaborate to unify debug and validation for system designers

May 19, 2015

CAMBRIDGE, United Kingdom, and Santa Clara, CA, 19th May 2015 UltraSoC and Teledyne LeCroy today announce that they will collaborate on debug and validation technologies to reduce time-to-market and overall development costs in a wide range of high-tech industries, from automotive and computer peripheral manufacture, to emerging IoT applications.

Teledyne LeCroy, the worldwide leader in protocol test solutions, delivers a range of hardware and software tools that enables engineers to verify, test, debug, and validate electronic system designs. UltraSoC provides silicon IP for data acquisition and analysis that can be “baked-in” to the complex semiconductor devices (System on … Read More → "UltraSoC and Teledyne LeCroy collaborate to unify debug and validation for system designers"

STMicroelectronics First Past the Post with Automotive-Grade 1200V Thyristor for Ultra-Reliable Power Control

May 19, 2015

Geneva, May 19, 2015 – ST’s TN5050H-12WY is the world’s first high-power Silicon-Controlled Rectifier Thyristor to offer 1200V blocking voltage combined with automotive-grade production quality. With a current capability up to 80A^{^[1]} and an operating temperature range up to 150°C, the new device leverages both ST’s long-term leadership in discrete power devices and meeting the demanding requirements of the automotive semiconductor market.

The TN5050H-12WY is ideal for a wide range of AC/ … Read More → "STMicroelectronics First Past the Post with Automotive-Grade 1200V Thyristor for Ultra-Reliable Power Control"

Hoffmann-Krippner To Roll Out New Sensor Technologies at Sensors Expo

May 19, 2015

May 19, 2015 – Alpharetta, GA – Hoffmann – Krippner Inc. will be at the upcoming Sensors Expo event in Long Beach, CA – June 9 through June 11. In addition to demoing and launching their industry leading SensoFoil and SensoInk sensing technologies, they will be demonstrating high performance sensor technologies from three of their German partners.

This includes Altmann GmbH for advanced and high-quality potentiometers used for a variety of industrial equipment controls, steering and engine control for shipping, engine control for heavy equipment, and high precision wind detection.

At Sensors expo, Hoffmann-Krippner will also be showing sensor solutions from Inelta GmbH … Read More → "Hoffmann-Krippner To Roll Out New Sensor Technologies at Sensors Expo"

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