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HeliaFilm® on concrete façade

Herne, Germany – 19th of May 2015 — Europe´s first solar concrete wall was inaugurated today at RECKLI’s headquarter in Herne, Germany. The façade, designed by RECKLI to fit the solar film from Heliatek (HeliaFilm®), represents a novel approach to BIOPV – Building Integrated Organic PV. RECKLI, the world leader in the design and manufacture of elastomeric formliners, and Heliatek are demonstrating the next step towards a sustainable, net-zero energy building.

This solar active concrete wall is the result of a joint development project of RECKLI and Heliatek. With an installed power of 1kWp, the south-west oriented wall … Read More → "HeliaFilm® on concrete façade"

Excelsys Xsolo Power Supplies Meet Medical Performance Specifications

Cork, Ireland—May 21, 2015 — Excelsys Technologies announced today that its Xsolo power supplies have been designed and tested to meet both the B and BF type requirements per the IEC 60601 standard.  This makes them suitable for applications that need these levels of performance for power supplies used in medical applications. Excelsys’ testing procedures were performed in accordance with requirements for B (body) and BF (body floating) medical end products. The goal of the testing was to help manufacturers optimize their … Read More → "Excelsys Xsolo Power Supplies Meet Medical Performance Specifications"

Agnisys Unveils Software to Automate Register Verification Process for SoC, IP, FPGA Designs

Lowell, MA. May 21, 2015 – Agnisys, Inc. announces immediate availability of ARV™ – Automatic Register Verification, an add-on product to IDesignSpec™, that enhances an already powerful register specification solution with capability to automate the register verification process for SoCs, IP and FPGA semiconductor projects. ARV saves semiconductor teams time and improves quality by enabling complete verification for design registers / memories that are the key integration point for semiconductor design, IP and software.

ARV comes in two configurations: ARV-Formal™ and ARV-Sim™
ARV-Formal is a complete solution that takes the register specification and RTL design as input and performs a formal … Read More → "Agnisys Unveils Software to Automate Register Verification Process for SoC, IP, FPGA Designs"

Applied Materials’ Breakthrough Patterning Hardmask Enables Copper Interconnect Scaling

SANTA CLARA, Calif., May 19, 2015 – Applied Materials, Inc. today announced its Applied Endura® Cirrus HTX PVD* system with breakthrough technology for patterning copper interconnects at 10nm and beyond. As chip features continue to shrink, innovations in hardmask are required to preserve the pattern integrity of tightly packed, tiny interconnect structures. With the introduction of this technology, Applied enables scaling of the TiN* metal hardmask – the industry’s material of choice – to meet the patterning needs of copper interconnects in advanced microchips.

“Precision engineering of metal hardmask films is key to addressing the patterning challenges for advanced interconnects,” said … Read More → "Applied Materials’ Breakthrough Patterning Hardmask Enables Copper Interconnect Scaling"

Synopsys Announces Industry’s Lowest Power PCI Express 3.1 IP Solution for Mobile SoCs

MOUNTAIN VIEW, Calif., May 21, 2015 /PRNewswire/ —

Highlights:

  • Power management features such as L1 sub-states and use of power gating, power islands and retention cells cut standby power to less than 10 uW/lane
  • Support for supply under drive, a novel transmitter design and equalization bypass schemes reduce active power consumption to less than 5 mW/Gb/lane
  • Offers small area, built-in at-speed production testing and optional wirebond packaging to lower overall BOM cost
  • Reduces active power while … Read More → "Synopsys Announces Industry’s Lowest Power PCI Express 3.1 IP Solution for Mobile SoCs"

Imagination’s OmniShield enables next-generation SoC security

LONDON, UK – 20th May, 2015 – Imagination Technologies (IMG.L) introduces OmniShield™ technology designed to provide the industry’s most scalable and secure solutions for protection of next-generation SoCs. With OmniShield-ready hardware and software IP, Imagination is ensuring that customers’ SoCs and OEMs’ products are designed for security, reliability and dynamic software management, as use models and services evolve across a wide range of connected devices.

Connected products such as Internet of Things (IoT), gateway routers, IPTVs, mobile devices and automotive systems must increasingly be designed to support numerous unique applications, various content sources, and in-the-field software updates from … Read More → "Imagination’s OmniShield enables next-generation SoC security"

Imec and Tokyo Electron Demonstrate Electrical Advantages of Direct Cu Etch Scheme for Advanced Interconnects

IEEE IITC, Grenoble, (France) – May 20, 2015 – Today, at the IEEE IITC conference, nano-electronics research center imec and Tokyo Electron Limited (TEL) presented a direct Cu etch scheme for patterning Cu interconnects. The new scheme has great potential to overcome resistivity and reliability issues that occur while scaling conventional Cu damascene interconnects for advanced nodes.

Aggressive scaling of damascene Cu interconnects leads to a drastic increase in the resistivity of the Cu wires, due to the fact that grain size is limited by the damascene trenches, which results in increased grain boundary and surface scattering. Additionally, the grain boundary … Read More → "Imec and Tokyo Electron Demonstrate Electrical Advantages of Direct Cu Etch Scheme for Advanced Interconnects"

Sensoria Partners With Athletes for Charity on Clothing Drive for Disadvantaged Youth in Haiti

SAN DIEGO, May 20, 2015 (GLOBE NEWSWIRE) — Health and Fitness Expo — Sensoria, Inc., a leading developer of IoE (Internet of Everyone) wearable solutions, today announces a partnership with Athletes for Charity to host a clothing drive for disadvantaged youth at the Rock’n’Roll San Diego Marathon and Health and Fitness Expo on May 29-30th.

Runners will be able to take advantage of a Free Running Form assessment provided by Sensoria’ … Read More → "Sensoria Partners With Athletes for Charity on Clothing Drive for Disadvantaged Youth in Haiti"

STMicroelectronics and Paradox Engineering Present Smart City Technologies at TECHNO-FRONTIER 2015

Tokyo, May 20, 2015 – Ready for the Internet-of-Things (IoT) age when everything is expected to be connected to the Internet, STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Paradox Engineering SA, a Swiss technology company designing and developing IoT-ready wireless sensor network solutions, will be demonstrating wireless mesh network technologies for Smart City at TECHNO-FRONTIER 2015 (May 20-22, 2015).

A domestic, urban, or industrial environment can only be smart when devices and sensors installed in various locations or objects are part of a network that is managed coherently and cohesively. In a Smart … Read More → "STMicroelectronics and Paradox Engineering Present Smart City Technologies at TECHNO-FRONTIER 2015"

Latest version of Java SE 8 now available for MIPS

LONDON, UK – 18th May, 2015 – Imagination Technologies (IMG.L) announces the availability of Java SE 8 for the MIPS architecture. This new release is part of an ongoing collaboration between Imagination and Oracle intended to enhance Java for embedded and Internet of Things (IoT) applications and optimize Java for the MIPS CPU architecture.

Java is the foundation for a broad range of networked applications and is a global standard for developing and delivering embedded, web-based and enterprise content, and applications. It is also playing an increasing role in the IoT.

Read More → "Latest version of Java SE 8 now available for MIPS"

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