SAN FRANCISCO – July 14, 2015 – Nano-electronics research center imec and SPTS Technologies, an Orbotech company (NASDAQ: ORBK)  and supplier of advanced wafer processing solutions for the global semiconductor and related industries,  announced today at SEMICON West that they are jointly developing a highly accurate, short cycle-time dry silicon removal and low temperature passivation solution for through-silicon via-middle processing and thinning of the top-wafer in wafer-to-wafer bonding. 

Wafer backside processing is critical for 3D-IC wafer stacking. Today, through-silicon vias (TSV) formed using ‘via-middle’ processing, are … Read More → "Imec and SPTS Technologies, an Orbotech Company, Collaborate on Critical Processes for 3D IC Wafer Stacking"

GRENOBLE, France – July 13, 2015 – CEA-Leti today announced its first results towards the demonstration of CoolCube’s feasibility in FinFET technology on its 300mm production line, and new CoolCube^TM circuit designs that improve the trade off between area, speed and power.

Key process steps developed on 300mm wafers show progress in closing the gap between the demonstration of a single device and taking the technology to fabrication.

CoolCube^TM is Leti’s sequential integration technology that enables the stacking of active layers of transistors in the third dimension. Under development for eight … Read More → "Leti Reports FinFET Feasibility and Circuit Design for Better Area, Speed and Power Trade-offs with CoolCube Technology"