News – Page 1472 – EEJournal

Avnet Introduces New “ARTY” Xilinx Artix-7 35T FPGA Evaluation Kit

September 30, 2015

PHOENIX—September 30, 2015—Avnet, Inc. (NYSE: AVT), a leading global technology distributor, today introduced “ARTY,” a low power, low-cost Xilinx^® Artix^®-7 35T FPGA Evaluation Kit. This fully customizable evaluation kit for embedded designers provides a ?exible, expandable platform for prototyping designs based on Xilinx’s Artix-7 FPGA family. The evaluation kit offers users a complete development system for exploring FPGA designs for cost sensitive, low-power, embedded applications. The ARTY Kit is available now for $99.00.

The small form-factor ARTY board supports multiple expansion capabilities by having Arduino^™ compatible and chipKIT™ IDE header … Read More → "Avnet Introduces New “ARTY” Xilinx Artix-7 35T FPGA Evaluation Kit"

Cadence Receives Two TSMC Partner of the Year Awards for 10nm FinFET Solutions and Analog/Mixed-Signal IP

September 29, 2015

SAN JOSE, Calif., September 28, 2015—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it received two TSMC Partner of the Year awards at this year’s TSMC Open Innovation Platform® (OIP) Ecosystem Forum. Cadence was presented with awards for both joint development of the 10nm FinFET design infrastructure and analog/mixed-signal IP.

The award for joint development of the 10nm design infrastructure was given based on the early, in-depth collaboration between TSMC and Cadence on FinFET enablement and the development of this latest advanced-node technology for next-generation system-on-chip (SoC) designs. Cadence … Read More → "Cadence Receives Two TSMC Partner of the Year Awards for 10nm FinFET Solutions and Analog/Mixed-Signal IP"

ASML ships new TWINSCAN NXT immersion lithography platform, delivering improved performance for volume production at next-generation process nodes

September 29, 2015

VELDHOVEN, the Netherlands, 29 September 2015 – ASML Holding NV (ASML) today announced the first shipment of its new TWINSCAN™ NXT:1980Di immersion lithography system to support increasingly demanding multiple-patterning performance requirements. Demonstrating 1.2 nanometer (nm) dedicated chuck overlay and better than 10 nm focus uniformity, the NXT:1980Di features new grid calibrations and hardware that enables chipmakers to achieve tighter process windows for next-generation process nodes. The NXT:1980Di also improves throughput by 10% to 275 wafers per hour.

“Whether our customers face increased process complexity due to multiple patterning or plan to add Extreme Ultraviolet lithography, an improved level of immersion patterning … Read More → "ASML ships new TWINSCAN NXT immersion lithography platform, delivering improved performance for volume production at next-generation process nodes"

Dual-Die Hall sensors from Micronas combine multidimensional measurement with in-package redundancy

September 29, 2015

Freiburg, September 29, 2015 – Micronas today announces the extension of its direct-angle Hall-effect sensor family HAL 37xy with its dual-die variant HAR 37xy. It integrates two fully automotive-qualified silicon dies in a single SOIC8 package for high-precision direct-angle and linear position measurements for the most demanding automotive and industrial applications. HAR 37xy sensors follow the trend of enabling true redundancy within a small package to support safety-critical automotive applications according to ISO 26262 rules.

The sensors are well suited for angle measurement, as well as for linear position detection in automotive and industrial applications and operate in a junction temperature … Read More → "Dual-Die Hall sensors from Micronas combine multidimensional measurement with in-package redundancy"

Renesas Electronics Delivers R-Car W2R 5.9 GHz Band Automotive Wireless Communication SoC for Vehicle-to-Vehicle and Vehicle-to-Infrastructure Communication

September 29, 2015

Düsseldorf, September 29, 2015 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced the R-Car W2R system-on-a-chip (SoC), the first member of the new Renesas R-Car Family of devices developed specifically for V2X applications. The new automotive wireless communication SoC is designed for Vehicle-to-Vehicle (V2V) and Vehicle-to-Infrastructure (V2I) communication in the 5.9-gigahertz (GHz) band.

The R-Car W2R delivers top-class performance when using Renesas’ exclusive radio frequency (RF) system design technology. It is the first device of this type capable of reducing out-of-band transmit emissions to less than ?65 decibel-milliwatts (dBm) (Note 1), achieving … Read More → "Renesas Electronics Delivers R-Car W2R 5.9 GHz Band Automotive Wireless Communication SoC for Vehicle-to-Vehicle and Vehicle-to-Infrastructure Communication"

Indium Corporation Releases New Water-Soluble Solder Paste Indium6.4R

September 29, 2015

Indium Corporation’s Indium6.4R is a versatile, water-soluble solder paste flux that enables a low cost of ownership for PCB assembly customers through an all-around, balanced performance.

Available in both SAC and Pb-based alloys, Indium6.4R achieves superior stencil printing performance and demonstrates excellent response-to-pause.

“Indium6.4R is the recommended water-soluble paste for most applications because it outperforms other pastes in all categories,” said Glen Thomas, Product Manager, PCB Solder Paste. “This paste allows for wetting and solderability on multiple surface finishes; results in low voiding on QFNs, … Read More → "Indium Corporation Releases New Water-Soluble Solder Paste Indium6.4R"

Synopsys Announces Industry’s First Security IP Solutions for New SHA-3 Cryptographic Hash Standard

September 29, 2015

Synopsys, Inc. (Nasdaq:SNPS) has announced the industry’s first security IP solutions compliant to the Secure Hash Algorithm-3 (SHA-3) cryptographic standard from the National Institute of Standards and Technology (NIST). Synopsys’ DesignWare® SHA-3 Cryptography IP solutions enable developers to protect the integrity of electronic information in applications such as message authentication and digital signatures, random number generation and key derivation functions. By providing security IP that is compliant to the SHA-3 standard, Synopsys enables developers to have the latest hash algorithm readily available for integration into their next-generation system-on-chips (SoCs).

Hash algorithms transform digital messages into … Read More → "Synopsys Announces Industry’s First Security IP Solutions for New SHA-3 Cryptographic Hash Standard"

3D Systems Supports “Inspired Minds” Education Program at TCT + Personalize

September 28, 2015

3D Systems (NYSE:DDD) announced today that, for the third consecutive year, it is supporting the Inspired Minds education program at TCT + Personalize, to be held in Birmingham, UK on September 30 – October 1, 2015. As part of its commitment to promoting and advancing digital literacy in K-12 education, 3DS will provide its flagship Cube(R) desktop 3D printers and Sense(TM) 3D scanners for the program, enabling students to experience real world design and manufacturing thinking.

“We are excited to partner once again with … Read More → "3D Systems Supports “Inspired Minds” Education Program at TCT + Personalize"

TSMC Recognizes Synopsys with Partner Awards for Interface IP and Joint Development of 10-nm FinFET Design Infrastructure

September 28, 2015

Synopsys, Inc. (Nasdaq: SNPS), today announced that TSMC is recognizing Synopsys with two “2015 Partner of the Year” awards for Interface IP and Joint Development of 10-nanometer (nm) FinFET Design Infrastructure. Synopsys and TSMC have been collaborating for more than 15 years, most recently to accelerate the adoption of FinFET technology for optimum power, performance and area for the 10-nm process. This is the 5th consecutive year Synopsys has received both IP and electronic design automation (EDA) accolades from TSMC.

“TSMC and Synopsys share a common goal to provide an extensive portfolio of proven IP and design tools supporting … Read More → "TSMC Recognizes Synopsys with Partner Awards for Interface IP and Joint Development of 10-nm FinFET Design Infrastructure"

Identiv Releases Connected IOT Premises Access Control Solution With Its Global Partners

September 28, 2015

FREMONT, Calif., Sept. 28, 2015 (GLOBE NEWSWIRE) — Identiv, Inc. (NASDAQ:INVE) today announced the launch of the Identiv Connected Physical Access Manager (ICPAM) solution. ICPAM is a distributed intelligent premises access control solution, providing state-of-the-art secure access to facilities using standards-based networking, and is backwards compatible for legacy wiring topologies and devices.

ICPAM software is tightly integrated with industry-leading Cisco technology, including routers, switches, Cisco Video Surveillance Manager, and Cisco IP Telephony. ICPAM has a low cost of ownership and </ … Read More → "Identiv Releases Connected IOT Premises Access Control Solution With Its Global Partners"

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