News – Page 1444 – EEJournal

New ‘Performance Cloning’ Techniques Designed to Boost Computer Chip Memory Systems Design

September 30, 2015

North Carolina State University researchers have developed software using two new techniques to help computer chip designers improve memory systems. The techniques rely on “performance cloning,” which can assess the behavior of software without compromising privileged data or proprietary computer code.

Computer chip manufacturers try to design their chips to provide the best possible performance. But to find the most effective designs, manufacturers need to know what sort of software their clients will be using.

“For example, programs that model protein folding use a lot of computing power, but very little data – so manufacturers know … Read More → "New ‘Performance Cloning’ Techniques Designed to Boost Computer Chip Memory Systems Design"

Inaugural Women in Drones Event at InterDrone a Huge Success

September 30, 2015

MELVILLE, N.Y., Sept. 29, 2015 (GLOBE NEWSWIRE) — BZ Media LLC announced today the success of its Women in Drones Luncheon, a special networking event at InterDrone(TM) The International Drone Conference & Exposition held on September 10 at The Rio in Las Vegas. Lisa Ellman, Partner and Global UAS Group Chair at Hogan Lovells, led the event, which brought together more than 50 leading women in the commercial drone industry to discuss challenges and triumphs faced by women in the predominantly male industry.

15Msps, 18-Bit No Latency SAR ADC Provides 20dB SNR Improvement over Pipelined ADCs

September 30, 2015

MILPITAS, CA – September 29, 2015 – Linear Technology Corporation introduces the LTC2387-18, an ultrafast 15Msps, 18-bit successive approximation register (SAR) analog-to-digital converter (ADC) with no cycle latency and no pipeline delay. The LTC2387-18 digitizes wideband analog signals up to the Nyquist frequency with very low distortion. Applications ranging from communications, high speed imaging and instrumentation that traditionally utilize fast throughput pipelined ADCs can now achieve 20dB signal-to-noise ratio (SNR) improvement compared to pipelined ADC architectures.

The LTC2387-18 achieves an SNR of 95.7dB and realizes -101dB total harmonic distortion (THD) while digitizing a 1MHz analog input signal. … Read More → "15Msps, 18-Bit No Latency SAR ADC Provides 20dB SNR Improvement over Pipelined ADCs"

High-Voltage, Wide Temperature Range Hall Effect Latch Family from Diodes Incorporated Offers Sensitivity and Output Options

September 30, 2015

Plano, Texas – September 30th, 2015 – The AH37xx family of high-voltage Hall effect latch ICs introduced by Diodes Incorporated provides various operating magnetic thresholds to address motor control, rotational position and speed sensing requirements in a wide range of applications such as controlling the commutation of brushless DC (BLDC) motors in washing machines, dishwashers, fridge-freezers, air-conditioners, food processors, power tools and cooling fans; the measurement of speed in motors, pumps and flow meters; and contactless position sensing/indexing in printers, scanners, and window blinds.

Spanning industrial and consumer applications, the AH37xx family is designed … Read More → "High-Voltage, Wide Temperature Range Hall Effect Latch Family from Diodes Incorporated Offers Sensitivity and Output Options"

Avnet Introduces New “ARTY” Xilinx Artix-7 35T FPGA Evaluation Kit

September 30, 2015

PHOENIX—September 30, 2015—Avnet, Inc. (NYSE: AVT), a leading global technology distributor, today introduced “ARTY,” a low power, low-cost Xilinx^® Artix^®-7 35T FPGA Evaluation Kit. This fully customizable evaluation kit for embedded designers provides a ?exible, expandable platform for prototyping designs based on Xilinx’s Artix-7 FPGA family. The evaluation kit offers users a complete development system for exploring FPGA designs for cost sensitive, low-power, embedded applications. The ARTY Kit is available now for $99.00.

The small form-factor ARTY board supports multiple expansion capabilities by having Arduino^™ compatible and chipKIT™ IDE header … Read More → "Avnet Introduces New “ARTY” Xilinx Artix-7 35T FPGA Evaluation Kit"

Cadence Receives Two TSMC Partner of the Year Awards for 10nm FinFET Solutions and Analog/Mixed-Signal IP

September 29, 2015

SAN JOSE, Calif., September 28, 2015—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it received two TSMC Partner of the Year awards at this year’s TSMC Open Innovation Platform® (OIP) Ecosystem Forum. Cadence was presented with awards for both joint development of the 10nm FinFET design infrastructure and analog/mixed-signal IP.

The award for joint development of the 10nm design infrastructure was given based on the early, in-depth collaboration between TSMC and Cadence on FinFET enablement and the development of this latest advanced-node technology for next-generation system-on-chip (SoC) designs. Cadence … Read More → "Cadence Receives Two TSMC Partner of the Year Awards for 10nm FinFET Solutions and Analog/Mixed-Signal IP"

ASML ships new TWINSCAN NXT immersion lithography platform, delivering improved performance for volume production at next-generation process nodes

September 29, 2015

VELDHOVEN, the Netherlands, 29 September 2015 – ASML Holding NV (ASML) today announced the first shipment of its new TWINSCAN™ NXT:1980Di immersion lithography system to support increasingly demanding multiple-patterning performance requirements. Demonstrating 1.2 nanometer (nm) dedicated chuck overlay and better than 10 nm focus uniformity, the NXT:1980Di features new grid calibrations and hardware that enables chipmakers to achieve tighter process windows for next-generation process nodes. The NXT:1980Di also improves throughput by 10% to 275 wafers per hour.

“Whether our customers face increased process complexity due to multiple patterning or plan to add Extreme Ultraviolet lithography, an improved level of immersion patterning … Read More → "ASML ships new TWINSCAN NXT immersion lithography platform, delivering improved performance for volume production at next-generation process nodes"

Dual-Die Hall sensors from Micronas combine multidimensional measurement with in-package redundancy

September 29, 2015

Freiburg, September 29, 2015 – Micronas today announces the extension of its direct-angle Hall-effect sensor family HAL 37xy with its dual-die variant HAR 37xy. It integrates two fully automotive-qualified silicon dies in a single SOIC8 package for high-precision direct-angle and linear position measurements for the most demanding automotive and industrial applications. HAR 37xy sensors follow the trend of enabling true redundancy within a small package to support safety-critical automotive applications according to ISO 26262 rules.

The sensors are well suited for angle measurement, as well as for linear position detection in automotive and industrial applications and operate in a junction temperature … Read More → "Dual-Die Hall sensors from Micronas combine multidimensional measurement with in-package redundancy"

Renesas Electronics Delivers R-Car W2R 5.9 GHz Band Automotive Wireless Communication SoC for Vehicle-to-Vehicle and Vehicle-to-Infrastructure Communication

September 29, 2015

Düsseldorf, September 29, 2015 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced the R-Car W2R system-on-a-chip (SoC), the first member of the new Renesas R-Car Family of devices developed specifically for V2X applications. The new automotive wireless communication SoC is designed for Vehicle-to-Vehicle (V2V) and Vehicle-to-Infrastructure (V2I) communication in the 5.9-gigahertz (GHz) band.

The R-Car W2R delivers top-class performance when using Renesas’ exclusive radio frequency (RF) system design technology. It is the first device of this type capable of reducing out-of-band transmit emissions to less than ?65 decibel-milliwatts (dBm) (Note 1), achieving … Read More → "Renesas Electronics Delivers R-Car W2R 5.9 GHz Band Automotive Wireless Communication SoC for Vehicle-to-Vehicle and Vehicle-to-Infrastructure Communication"

Indium Corporation Releases New Water-Soluble Solder Paste Indium6.4R

September 29, 2015

Indium Corporation’s Indium6.4R is a versatile, water-soluble solder paste flux that enables a low cost of ownership for PCB assembly customers through an all-around, balanced performance.

Available in both SAC and Pb-based alloys, Indium6.4R achieves superior stencil printing performance and demonstrates excellent response-to-pause.

“Indium6.4R is the recommended water-soluble paste for most applications because it outperforms other pastes in all categories,” said Glen Thomas, Product Manager, PCB Solder Paste. “This paste allows for wetting and solderability on multiple surface finishes; results in low voiding on QFNs, … Read More → "Indium Corporation Releases New Water-Soluble Solder Paste Indium6.4R"

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