industry news archive
Subscribe Now

New Developer Portal Supports Fast Integration of Industrial Ethernet Interfaces

Albuquerque, New Mexico, May 2010 – Innovasic Semiconductor’s new web-based Developer Portal provides access to a complete Industrial Ethernet design solution that includes development tools and personalized technical support. The portal is a secure and private workspace with tutorials, design and conformance testing resources, online access to evaluation hardware, comprehensive FAQs, and direct technical support.  Having these resources in one place allows designers to quickly assess and integrate an Industrial Ethernet interface into their product.Read More → "New Developer Portal Supports Fast Integration of Industrial Ethernet Interfaces"

Tabula’s CTO Steve Teig to Speak During DAC Luncheon Hosted by IEEE’s Council on EDA

NEW YORK –– May 25, 2010 –– Steve Teig, president and chief technology officer (CTO) of Tabula, will describe an approach to move beyond von Neumann computing during a luncheon hosted by the IEEE Council on Electronic Design Automation (CEDA) at the 47th Design Automation Conference (DAC). 

Read More → "Tabula’s CTO Steve Teig to Speak During DAC Luncheon Hosted by IEEE’s Council on EDA"

D2S CEO Aki Fujimura to Participate in 22-nm Manufacturing Panel at DAC 2010

SAN JOSE, Calif., May 25 /PRNewswire/ — D2S™, an emerging supplier of computational design platforms, today announced that Aki Fujimura, chairman and CEO of the company, will participate in a 22-nm manufacturing panel during the 47th Design Automation Conference (DAC) at the Anaheim Convention Center in Anaheim, Calif. DAC is the world’s leading technical conference and tradeshow covering the latest trends in electronic design and design automation, and will be held June 13-18. Aki Fujimura will participate in the Pavilion Panel “Hogan’s Heroes: What Design and Lithography Nightmares will 22nm Bring?” under the topic “New and Emerging … Read More → "D2S CEO Aki Fujimura to Participate in 22-nm Manufacturing Panel at DAC 2010"

Agilent Technologies to Demonstrate Enhanced HDMI Test Solution Portfolio at CEA 861/HDCP PlugFest14

SANTA CLARA, Calif., May 14, 2010 — Agilent Technologies Inc. (NYSE: A) will demonstrate its expanded High-Definition Multimedia Interface (HDMI) test solution portfolio at the CEA 861/HDCP PlugFest14, May 16-21, in Milpitas, Calif.

Agilent’s new HDMI test solution update allows engineers to test features recently introduced by the HDMI Test Specification 1.4a, such as the new 3-D video format support. In addition to the HDMI protocol compliance tests, the test solution also supports device characterization with complementary software from Agilent’s solution partner, BitifEye Digital Test Solutions.

Agilent and BitifEye have been involved with HDMI since the … Read More → "Agilent Technologies to Demonstrate Enhanced HDMI Test Solution Portfolio at CEA 861/HDCP PlugFest14"

Magma Launches Titan ALX and Titan AVP – Dramatic Layout Productivity Improvement for Analog/Mixed-Signal Designs

SAN JOSE, Calif., May 17, 2010 – Magma® Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, today announced Titan™ Analog Layout Accelerator (ALX) and Titan Analog Virtual Prototyper (AVP), new tools that accelerate the creation and optimization of new analog design layouts, and automate the reuse of existing analog layouts in new processes and technologies. 

Augmenting the comprehensive </ … Read More → "Magma Launches Titan ALX and Titan AVP – Dramatic Layout Productivity Improvement for Analog/Mixed-Signal Designs"

featured blogs
Sep 16, 2019
Most presentations at the recent HOT CHIPS conference are about actual chips, mostly processors of one kind or another. But in machine learning, there is a need to be able to compare these... [[ Click on the title to access the full blog on the Cadence Community site. ]]...
Sep 13, 2019
In the video above, Samtec’s Jignesh Shah and Kevin Burt explain that as data rate requirements approach and surpass 112 Gbps PAM4, developers are challenged with balancing increasing throughput, scalability, and density demands with concerns such as power consumption, ...