News – Page 1403 – EEJournal

congatec industrial-grade Thin Mini-ITX boards with 6th generation Intel® Core™ processors offer high scalability

February 26, 2016

San Diego, CA, February 23, 2016 * * * congatec, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design & manufacturing (EDM) services, is presenting its new family of highly scalable Thin Mini-ITX boards with Intel® processors at Embedded World (hall 1, stand 358). The new boards stand out with their high scalability, ranging from 2.0 GHz Intel® Celeron® processors up to 3.4 GHz Intel® Core™ i7 processors. The industrial-grade boards further offer a fully configurable thermal design power (TDP) from 7.5 to 15 watts and up to 32GB of DDR4 RAM as well as 4K multiscreen support. These advantages come in tandem with … Read More → "congatec industrial-grade Thin Mini-ITX boards with 6th generation Intel® Core™ processors offer high scalability"

IAR Systems and Express Logic form an IoT Development Partnership to provide easier and faster development of connected applications

February 26, 2016

embedded world, Nuremberg, Germany—February 23, 2016—IAR Systems®, the world’s leading vendor of embedded development tools, and Express Logic, Inc., the worldwide leader in royalty-free real-time operating systems (RTOSes), announce the formation of an IoT Development Partnership, in order to provide customers with easier, secure, and faster development, resulting in shorter time to market for connected applications.

With embedded applications continuously growing in complexity, the need for pre-integrated solutions and complete development platforms is increasing. IAR Systems and Express Logic have responded to this need with increased collaboration. The innovative Renesas Synergy Platform™ highlights one such example … Read More → "IAR Systems and Express Logic form an IoT Development Partnership to provide easier and faster development of connected applications"

LG Uplus Selects Conexant’s AudioSmart Technology to Enable Voice Control in New Smart Home Products

February 26, 2016

IRVINE, CA–(Marketwired – Feb 23, 2016) – Connected Internet of Things (IoT) devices in smart homes can talk to each other — but can users talk to them? “Turn on the living room lights.” “Find the remote control.” “Turn up the volume on the TV.” They can when these devices are voice control-enabled. Conexant Systems, Inc. today announced that its high-performance far-field voice input processor system-on-chip (SoC) — the CX2092x — has been adopted by LG … Read More → "LG Uplus Selects Conexant’s AudioSmart Technology to Enable Voice Control in New Smart Home Products"

Joint ams and STMicroelectronics solution enables secure NFC transactions in new ARM mbed Wearable Reference Design

February 26, 2016

Premstaetten, Austria; Geneva, Switzerland, 23 February, 2016 — ams AG (SIX: AMS), a leading provider of high performance sensors and analog ICs, and STMicroelectronics, (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today revealed that ARM is using the companies’ NFC solution to provide the secure, high-performance NFC and microcontroller functionality in its new wearable reference design.

The NFC solution developed jointly by ST and ams is comprised of the ST54E from ST, a System-in-Package featuring an NFC controller (NFCC) and a Secure Element compliant with the Global Platform standard v2.2, and ams’ … Read More → "Joint ams and STMicroelectronics solution enables secure NFC transactions in new ARM mbed Wearable Reference Design"

GUC/Partner Jointly Develop USB3.1 PHY/Controller IP

February 26, 2016

Hsinchu, Taiwan, February 26, 2016 – Global Unichip Corp. (GUC), the Flexible ASIC LeaderTM and leading analog mixed-signal IP provider, worked jointly with a major Japanese IDM partner to develop USB3.1 PHY/Controller IP by using GUC’s PHY and partner’s Controller.

The combined USB 3.1 IP is compliant with both USB 3.1 and USB 2.0/1.1 specifications. The IP supports all USB bus speeds: Super Speed Plus (10 Gbps), Super Speed (5 Gbps), High Speed (480 Mbps), Full Speed (12Mbps), and Low Speed (1.5Mbps). It is compliant with Battery Charging Specification </ … Read More → "GUC/Partner Jointly Develop USB3.1 PHY/Controller IP"

eBeam Initiative to Expand Education Efforts on eBeam Technology Requirements for EUV and Nanoimprint Lithography

February 26, 2016

SAN JOSE, Calif., February 23, 2016–The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced that it will expand its education efforts in 2016 to increase the industry’s focus on eBeam technology requirements and new developments to support extreme ultraviolet (EUV) lithography, nanoimprint lithography (NIL) and multi-beam mask writing. Each of these topics will be addressed by industry luminary guest speakers at the annual eBeam Initiative members and press luncheon event being held today during the SPIE Advanced Lithography Conference at the San Jose Convention Center.</ … Read More → "eBeam Initiative to Expand Education Efforts on eBeam Technology Requirements for EUV and Nanoimprint Lithography"

Imec reveals impact of DSA process variations on electrical performance of DSA-formed vias.

February 26, 2016

Leuven (Belgium) Feb 24, 2016 – Today, at SPIE Advanced Lithography Conference (San Jose, Feb 21-25), world-leading nanoelectronics research center imec will present electrical results of DSA (directed self-assembly)-formed vias, gaining insight in the impact of DSA processing variations on electrical readout. The results accelerate learning towards implementation of DSA for via patterning at the N7 technology node and beyond.

DSA processes with cylinder-forming block copolymers (BCP) have gained attention for contact hole shrink applications with improved contact hole roughness, and for their potential to increase the contact hole density that is obtained with optical lithography. … Read More → "Imec reveals impact of DSA process variations on electrical performance of DSA-formed vias."

Silicon Labs Significantly Reduces Design Time Using the Cadence Mixed-Signal Low-Power Flow

February 26, 2016

SAN JOSE, Calif., February 24, 2016 – Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Silicon Labs http://www.silabs.com used a Cadence® mixed-signal low-power flow to reduce overall design time, significantly speeding time to market. Silicon Labs adopted the flow for its new Blue Gecko family of wireless system-on-chip (SoC) devices http://www.silabs.com/BlueGecko that provide ultra-low-power Bluetooth Smart connectivity for Internet of Things (IoT) applications.

For design, Silicon Labs used the comprehensive Cadence mixed-signal, low-power flow based on the unified OpenAccess (OA)-enabled Incremental Technology Database (ITDB) to seamlessly interoperate between the Cadence Virtuoso® … Read More → "Silicon Labs Significantly Reduces Design Time Using the Cadence Mixed-Signal Low-Power Flow"

New Automotive Microcontrollers from STMicroelectronics Enhance Safety of Smarter Vehicles

February 25, 2016

Geneva, February 23, 2016 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced first microprocessors in the SPC57 family that break new ground in automotive applications by offering the industry’s best combination of safety assurance and cost/performance. Building on the successful 32-bit Power Architecture^™ SPC5 microprocessor platform, the new product family targets cost-sensitive automotive systems that must meet the most stringent safety requirements, up to the highest ISO26262 ASIL-D Automotive Safety Integrity Level.

The new microcontrollers … Read More → "New Automotive Microcontrollers from STMicroelectronics Enhance Safety of Smarter Vehicles"

New Next Generation 6U VME i7 Processor Board

February 25, 2016

WIXOM, Mich., Feb. 24, 2016 /PRNewswire/ — Acromag’s XVME-6510 is a high-performance 6U VME single board computer based on the 4^th Generation Intel® Core™ i7 processor and utilizes the Intel 8-Series QM87 PCH chipset for extensive I/O support. Two ruggedized SODIMMs offer up to 16GB of high-speed DDR3L removable memory plus 32GB of flash memory. The air-cooled … Read More → "New Next Generation 6U VME i7 Processor Board"

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