News – Page 1402 – EEJournal

STMicroelectronics Unlocks Extra Power Savings in Smartphones and More with Latest STM32 Dynamic Efficiency™ Microcontrollers

June 27, 2014

Geneva, June 26, 2014 – New STM32 Dynamic Efficiency™ microcontrollers from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, improve the power-saving performance of data batching – the technique also used in Google’s latest Android 4.4 (KitKat) operating system to maximize battery life – and extend the advantages to many more applications besides smartphones and tablets.

Android 4.4 uses a low-power sensor hub to manage “always-on” sensors like accelerometers or pressure sensors, allowing the main system processor to consume less battery energy. ST’s STM32 … Read More → "STMicroelectronics Unlocks Extra Power Savings in Smartphones and More with Latest STM32 Dynamic Efficiency™ Microcontrollers"

EM Microelectronic Releases COiN, a Complete Bluetooth® Smart Beacon

June 27, 2014

Marin, Switzerland – June 24th, 2014 – Today, EM Microelectronic, the ultra-low power semiconductor company of the Read More → "EM Microelectronic Releases COiN, a Complete Bluetooth® Smart Beacon"

STMicroelectronics Boosts Design for a Cleaner Cloud with STM32 Digital-Power Microcontrollers

June 27, 2014

Geneva, June 25, 2014 – The Cloud supporting the digital economy could become significantly more energy-efficient with the adoption of the new Digital Power microcontrollers (STM32F334) from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications.

Today’s digital infrastructure draws large quantities of electrical energy. Data centers alone are believed to consume around 1.3% of the world’s electricity – about 264,000 GWh per year. Only about 40% of this energy is used productively, according to Power Usage Effectiveness (PUE) calculations by the Uptime … Read More → "STMicroelectronics Boosts Design for a Cleaner Cloud with STM32 Digital-Power Microcontrollers"

Isola Introduces Ultra-Low Loss Materials for 100 Gigabit Ethernet Applications

June 27, 2014

CHANDLER, Ariz., June 26, 2014 — Isola Group S.à r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), today announced the introduction of Tachyon-100G laminates and prepregs, which enable line cards required to transmit 100 … Read More → "Isola Introduces Ultra-Low Loss Materials for 100 Gigabit Ethernet Applications"

4DSP brings fiber optic sensing technology to an unprecedented level of performance with the RTS125

June 27, 2014

June 27, 2014 — AUSTIN, TX – The RTS125 is an off-the-shelf, distributed Fiber Optic Sensing solution. With tens of thousands of strain or temperature sensors simultaneously monitored up to 100 times per second, the RTS125 offers the same sensing capabilities on up to eight channels as its predecessor the RTS150 but in a lighter and ruggedized enclosure. This product delivers reliable measurements in the most demanding environments faced by the aerospace, automotive, civil engineering, and energy sectors among others.

“The groundbreaking distributed sensing capability of the … Read More → "4DSP brings fiber optic sensing technology to an unprecedented level of performance with the RTS125"

Microchip Expands XLP Low-Power PIC® Microcontroller Portfolio With Integrated Hardware Encryption Engine

June 26, 2014

CHANDLER, Ariz., June 24, 2014 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced from the Sensors Expo in Rosemont, IL the expansion of its eXtreme Low Power (XLP) PIC^® microcontrollers (MCUs) with the PIC24F “GB2” family. This new family features an integrated hardware crypto engine, a Random Number Generator (RNG) and One-Time-Programmable (OTP) key storage for protecting data in embedded applications. The PIC24F “GB2” devices offer up to 128 KB Flash and 8 KB RAM in small 28- or 44-pin packages, … Read More → "Microchip Expands XLP Low-Power PIC® Microcontroller Portfolio With Integrated Hardware Encryption Engine"

STMicroelectronics Reveals Best-In-Class Devices with the Highest Available Qualification for the Worldwide Aerospace Market

June 26, 2014

Geneva, June 26, 2014 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a leading supplier of high-performance components for space applications, has extended its portfolio of radiation-hardened (rad-hard) devices by adding a series of LVDS^{^[1]} drivers, receivers, and multiplexers carrying the US 300krad QML-V qualification^{^[2]}.

ST’s new rad-hard devices exceed … Read More → "STMicroelectronics Reveals Best-In-Class Devices with the Highest Available Qualification for the Worldwide Aerospace Market"

Agilent Technologies’ New Multi-Channel PXI-based Test Solution Speeds LTE/LTE-Advanced Waveform Creation and Analysis

June 26, 2014

SANTA CLARA, Calif., June 25, 2014 – Agilent Technologies Inc. (NYSE: A) today announced the LTE/LTE-Advanced multi-channel PXI-based test solution, which accelerates the setup of multi-channel test system configurations and enables engineers to gain deeper insight into complex carrier aggregation and spatial multiplexing MIMO designs.

Designing and characterizing components and RF subsystems for base stations, microcells, picocells, repeaters and mobile devices is becoming more complex as multi-antenna designs require increasingly complex multi-channel test configurations. Agilent’s new test solution provides tools to generate complex LTE/LTE-A multi-channel/MIMO … Read More → "Agilent Technologies’ New Multi-Channel PXI-based Test Solution Speeds LTE/LTE-Advanced Waveform Creation and Analysis"

eSilicon GDSII quoting portal now available

June 26, 2014

SAN JOSE, Calif. — June 26, 2014 — eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced the production release of its GDSII portal, which provides fast, automated quoting for TSMC technologies. Building on the successful introduction of its instant online quoting system for multi-project wafer (MPW) shuttle services, eSilicon’s GDSII quoting portal offers the ability to fully specify the manufacturing process requirements for submission of a GDSII design to … Read More → "eSilicon GDSII quoting portal now available"

CEA-Leti and CORIMA Team up on Force Sensors Integrated in Cycle Wheels to Measure Rider Power Output

June 26, 2014

GRENOBLE, France – June 26, 2014 – CEA-Leti and CORIMA, a leading supplier of carbon-composite wheels and frames for track and road-racing cyclists, today announced they are developing an integrated sensor system to measure the power output of riders as they pedal.

While there are a variety of ways to measure this key parameter for serious riders, they typically use sensors affixed to pedals or the rear-wheel axis. The compact, ultra-light force sensor developed in this collaboration will be lighter, more precise and more easily integrated in the rear wheel, assuring reliable data in all types of weather and on all … Read More → "CEA-Leti and CORIMA Team up on Force Sensors Integrated in Cycle Wheels to Measure Rider Power Output"

featured blogs

MaxLinear Is Staying at the Forefront of Connectivity Solutions with Cadence

Apr 19, 2024

In today's rapidly evolving digital landscape, staying at the cutting edge is crucial to success. For MaxLinear, bridging the gap between firmware and hardware development has been pivotal. All of the company's products solve critical communication and high-frequency analysis...