News – Page 1371 – EEJournal

Cadence IP Portfolio and Tools to Support New TSMC Ultra-Low Power Technology Platform

September 29, 2014

SAN JOSE, Calif., 29 Sep 2014 – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that the company is supporting TSMC’s new ultra-low power (ULP) technology platform with its extensive IP portfolio and suite of digital and custom/analog tools. The ULP technology platform spans multiple process nodes to provide several power saving options to benefit advanced low-power mobile and consumer applications.

To enable the rapid development of designs for TSMC’s ULP technology platform, Cadence is migrating key components of its … Read More → "Cadence IP Portfolio and Tools to Support New TSMC Ultra-Low Power Technology Platform"

ARM and Synopsys Expand Collaboration to Improve Quality of Results and Time-to-Results for Leading-Edge ARMv8-A and ARMv7-A Cores

September 29, 2014

CAMBRIDGE, United Kingdom and MOUNTAIN VIEW, Calif., Sept. 29, 2014 /PRNewswire/

Highlights:

Extended collaboration to benefit mutual customers with optimized Synopsys implementation, verification and software development tools, and methodologies for design with ARM® IP
Multi-year subscription agreement gives Synopsys pre-production access to ARM Cortex® processors for the ARMv8-A and ARMv7-A ARM architectures, ARM Mali™ GPUs, ARM CoreLink™ system IP, ARM Artisan^® physical IP and ARM POP^™ IP
Agreement spans all Synopsys tools, … Read More → "ARM and Synopsys Expand Collaboration to Improve Quality of Results and Time-to-Results for Leading-Edge ARMv8-A and ARMv7-A Cores"

Microsemi Expands Customer Application Design Opportunities by Introducing SmartFusion2 Advanced Development Kit with Largest Density 150K LE Device

September 29, 2014

ALISO VIEJO, Calif.—Sept. 29, 2014—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of the company’s new largest density, lowest power SmartFusion®2 150K LE System-on-Chip (SoC) FPGA Advanced Development Kit. Board-level designers and system architects can quickly develop system-level designs by using the two FPGA Mezzanine Card (FMC) expansion headers to connect a wide range of new functions with off-the-shelf daughter cards, which significantly reduces design time and cost when creating new applications for communications, industrial, defense and aerospace markets.

“Microsemi’s new SmartFusion2 150 … Read More → "Microsemi Expands Customer Application Design Opportunities by Introducing SmartFusion2 Advanced Development Kit with Largest Density 150K LE Device"

Cadence and ARM Expand System-on-Chip Design Collaboration with New Multi-Year Technology Access Agreement

September 29, 2014

Highlights:

Multi-year Technology Access Agreement gives Cadence rights to access to existing and future ARM® Cortex® processors, ARM Mali(TM) GPUs, ARM CoreLink(TM) system IP, ARM Artisan® physical IP, and ARM POP(TM) IP
Expands upon existing and successful EDA Technology Access Agreement between the companies

San Jose, USA and Cambridge, UK, 29 Sep 2014 – Cadence Design Systems, Inc. and ARM today announced the signing of a multi-year Technology Access Agreement. Expanding upon the successful EDA Technology … Read More → "Cadence and ARM Expand System-on-Chip Design Collaboration with New Multi-Year Technology Access Agreement"

S2C Announces AXI-4 Prototype Ready Quick Start Kit

September 29, 2014

SAN JOSE, Calif. – Sept. 29, 2014 – S2C, Inc. announced today the release of its AXI-4 Prototype Ready™ Quick Start Kit, based on the Xilinx Zynq® device. The Quick Start Kit is the latest addition to S2C’s library of Prototype Ready IP and is uniquely suited to next-generation designs including the burgeoning Internet of Things (IoT). A demonstration of the Kit will be shown at the S2C booth at ARM^® TechCon 2014 in Santa Clara, CA on October 1-3.

The Quick Start Kit adapts a Xilinx Zynq ZC702 Evaluation Board to an S2C TAI … Read More → "S2C Announces AXI-4 Prototype Ready Quick Start Kit"

Eurotech Announces Release of Kura 1.0 Java-OSGi Framework for M2M Gateways and Smart Sensor

September 26, 2014

AMARO, September 26, 2014 – Eurotech, a leading supplier of embedded technologies, products and systems, announced the official release of Kura 1.0, the Java OSGi software framework for M2M multiservice gateways and smart sensors, which has graduated from the Incubation Phase to Mature Phase within the Eclipse Foundation project lifecycle. Kura Release 1.0 is the result of Eurotech’s commitment and contribution to Eclipse Kura, which enriches the portfolio of Eclipse IoT projects and provides Java software developers with an open-source platform for embedded applications.

Kura offers a development environment for Java … Read More → "Eurotech Announces Release of Kura 1.0 Java-OSGi Framework for M2M Gateways and Smart Sensor"

Versatile Media Isolated Pressure Sensor from Measurement Specialties Withstands Extremely Corrosive Environments

September 26, 2014

Hampton, Va. September 2014 – Measurement Specialties (NASDAQ: MEAS), an expert in sensor design and manufacturing, has now expanded its 154 Series of media isolated, piezoresistive silicon pressure sensors with the small profile, backside compensated 154B.

Housed in a 316L stainless steel package as standard, the compact 19 mm sensor is also available in an ASTM Grade 2 CP titanium housing for exceptionally harsh environments. This broadens the 154B’s uses from process controls, refrigeration and compressors, hydraulic controls and fresh water measurement to medical equipment, such as dialysis machines, … Read More → "Versatile Media Isolated Pressure Sensor from Measurement Specialties Withstands Extremely Corrosive Environments"

VadaTech Offers Hybrid 2U MicroTCA Chassis Platform with Rear Transition Slots

September 26, 2014

Henderson, NV – Sept 25, 2014 – VadaTech, a manufacturer of embedded boards and complete application-ready platforms, has announced a 2U Hybrid Chassis that provides MicroTCA.4 compliant slots along with MicroTCA.0 standard slots. The result is a powerful mix of configuration possibilities, including the use of rear I/O modules.

The VT812 2U Chassis Platforms features 4 mid-size MTCA.0 and 4 mid-size MTCA.4 slots including corresponding MicroRTMs (Rear Transition Modules for MicroTCA). The MicroTCA.4 architecture is designed primarily for high energy physics applications, but is an excellent fit for many Mil/Aero, Broadcast, and Networking applications. The chassis offers dual MicroTCA Carrier Hubs ( … Read More → "VadaTech Offers Hybrid 2U MicroTCA Chassis Platform with Rear Transition Slots"

High-Speed 5 GS/s PCIe Digitizer Cards released by Spectrum

September 26, 2014

Grosshansdorf, Germany — September 26th, 2014 — For the first time, Spectrum is offering a solution to engineers and scientists looking to capture and analyze fast electronic signals in the DC to 1 GHz frequency range. The company has greatly extended the performance of its PCIe based instruments by adding nine new models to its M4i series of digitizers. These cards boast real-time sampling rates up to 5 GS/s and high bandwidth making it possible for them to measure signals, edges and pulses down into the sub nanosecond realm.

Cadence Digital and Custom/Analog Tools Achieve TSMC Certification for 16FF+ Process

September 26, 2014

SAN JOSE, Calif., September 26, 2014 – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that its digital and custom/analog tools have achieved V0.9 Design Rule Manual (DRM) and SPICE certification from TSMC for its 16FF+ process, enabling systems and semiconductor companies to take advantage of the 15 percent speed improvement with the same total power compared to 16nm FinFET, or 30 percent total power reduction at the same speed compared to 16nm FinFET. 16FF+ V1.0 certification is on track to be concluded … Read More → "Cadence Digital and Custom/Analog Tools Achieve TSMC Certification for 16FF+ Process"

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