News – Page 1360 – EEJournal

Atmel Launches New LIN Family for In-vehicle Networking

November 6, 2014

San Jose, CA, November 5, 2014 – Atmel® Corporation (NASDAQ: ATML), a leader in microcontroller (MCU) and touch technology solutions, today announced the company has launched its next-generation family of local interconnect networking (LIN) transceivers, system basis chips (SBC) and voltage regulators for automotive body, power-train, infotainment sensor, actuator applications and more. The new family is the industry’s first to comply with the new original equipment manufacturer (OEM) hardware recommendations and provide scalable functionality to improve the overall system cost.

All the new devices in this new family feature an … Read More → "Atmel Launches New LIN Family for In-vehicle Networking"

Renesas Electronics Eases Safety, Security, and Connectivity for the Car of the Future

November 6, 2014

Düsseldorf, 6 November 2014 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, is easing the design complexities involved in developing self-driving car and other driver assistance systems that can offer users with a safe, secure, and convenient driving experience. The new RH850/P1x-C Series, a high-end version of the RH850/P1x Series of 32-bit automotive microcontrollers (MCUs), is designed for sensor fusion, gateway, and advanced chassis system applications that will enable the types of advanced systems envisioned in the car of the future.

“The new RH850/ … Read More → "Renesas Electronics Eases Safety, Security, and Connectivity for the Car of the Future"

Tango Systems Inc. Achieves Conformal Deposition for 15:1 Aspect Ratio TSVs

November 5, 2014

SAN JOSE, Calif., Nov. 5, 2014 – Tango Systems Inc., a leading innovator in high-performance, cost-effective physical vapor deposition (PVD) systems, today announced it has published results for conformal step seed layer coverage for through silicon vias (TSVs) with a15:1 aspect ratio. This significant achievement represents the industry’s highest TSV step coverage for interposers and 3D ICs. The results were achieved using Tango’s flagship Axcela™ PVD platform.

“2.5D interposers and 3D ICs are now in low-volume production for high-end server applications. To enable high volume manufacturing for consumer applications, via diameters must be aggressively reduced. High … Read More → "Tango Systems Inc. Achieves Conformal Deposition for 15:1 Aspect Ratio TSVs"

STMicroelectronics Introduces World’s Smallest Integrated 6-Axis Inertial Measurement Unit

November 5, 2014

Geneva, October 30, 2014 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, the world’s top MEMS (Micro-Electro-Mechanical Systems) manufacturer and the leading supplier of MEMS for consumer and mobile^{^[1]} as well as automotive applications^{^[2]}, today announced the industry’s smallest 6-axis Inertial Measurement Unit (IMU) qualified for Automotive applications with low-noise and improved … Read More → "STMicroelectronics Introduces World’s Smallest Integrated 6-Axis Inertial Measurement Unit"

Xilinx Expands 20 nm Kintex UltraScale Portfolio for the Most Demanding Data Center Acceleration, Video and Signal Processing Applications

November 5, 2014

SAN JOSE, Calif., Nov. 4, 2014 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced the expansion of its 20 nm portfolio with shipment of the Kintex® UltraScale™ KU115 FPGA. As the flagship of the Kintex UltraScale family, the KU115 offers the highest DSP count available in a single programmable device, doubling the DSP resources previously available. This DSP-optimized KU115 FPGA targets data center compute acceleration and signal processing applications including data center, video and medical imaging, broadcast systems, and radar. With the … Read More → "Xilinx Expands 20 nm Kintex UltraScale Portfolio for the Most Demanding Data Center Acceleration, Video and Signal Processing Applications"

Semtech Launches IoT Revolution Ecosystem with Key Partners at Electronica

November 5, 2014

MUNICH – Electronica 2014 – Nov 5, 2014 — Semtech Corporation (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, is partnering with IBM Research, Microchip and their distribution partners, to demonstrate the most powerful and advanced technology for Internet of Things (IoT) and Machine-to-Machine (M2M) at Electronica 2014 by deploying a live LoRa™ Low Power Wide Area Network (LPWAN) over a majority of the Munich area.

Semtech is also promoting its broader partner ecosystem of end-node modules, gateways/concentrators, and network controller solutions for private networks at the show by giving away 1,000 IoT demonstration end-nodes to select clients by the ecosystem … Read More → "Semtech Launches IoT Revolution Ecosystem with Key Partners at Electronica"

STMicroelectronics Bridges the Gap Between Bulk and Surface Micromachining for Critical Sensors

November 5, 2014

THELMA60 manufacturing process enters full production
Delivers sensitivity of Bulk micromachining for near-Surface micromachining cost

Geneva, November 5, 2014 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, the world’s top MEMS (Micro-Electro-Mechanical Systems) manufacturer and the leading supplier of MEMS for consumer and mobile^{^[1]} as well as automotive applications< … Read More → "STMicroelectronics Bridges the Gap Between Bulk and Surface Micromachining for Critical Sensors"

Icon Labs Announces The Internet of Secure Things™ Initiative

November 5, 2014

Protecting the Perimeter is Not Enough – Devices need to be Secure
Devices Using Real Time Operating Systems Need to Be Protected
New Internet of Secure Things White Paper

November 5, 2014 – West Des Moines, IA – Icon Labs (www.iconlabs.com), a leading provider of embedded networking and security technology, today announced its Internet of Secure Things Initiative.

The Internet of Things has become a ubiquitous … Read More → "Icon Labs Announces The Internet of Secure Things™ Initiative"

Altera and MathWorks Deliver Unified Model-Based Design Workflow for Altera SoCs

November 5, 2014

San Jose, Calif., November 5, 2014 – Altera Corporation (Nasdaq: ALTR) today announced new programming support for its ARM-based SoCs using industry-standard workflows from MathWorks. Release 2014b from MathWorks includes an automated, highly integrated model-based design workflow optimized for Altera SoCs. Designers using this flow can accelerate their algorithmic designs in Altera SoCs while staying in a high-level programming environment and save weeks of development time.

“Today’s announcement is a significant extension to our partnership with Altera, enabling our customers to quickly and easily … Read More → "Altera and MathWorks Deliver Unified Model-Based Design Workflow for Altera SoCs"

MIPI Alliance Introduces Sensor Interface Specification for Mobile, Mobile-Influenced and Embedded-Systems Applications

November 5, 2014

PISCATAWAY, NJ and SCOTTSDALE, AZ, November 5, 2014 – MIPI^®Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today introduced a sensor interface specification for mobile, mobile-influenced and embedded-systems applications. The new specification, named MIPI I3C? (or MIPI i3c?), was developed with the participation of vendors from across the sensor and mobile ecosystems. The name MIPI SenseWire? will be used to describe the application of I3C? in mobile devices and the use of the I3C interface for mobile devices connecting to a … Read More → "MIPI Alliance Introduces Sensor Interface Specification for Mobile, Mobile-Influenced and Embedded-Systems Applications"

featured blogs

How Synopsys IP and TSMC’s N12e Process are Driving AIoT

May 8, 2024

Learn how artificial intelligence of things (AIoT) applications at the edge rely on TSMC's N12e manufacturing processes and specialized semiconductor IP.The post How Synopsys IP and TSMC’s N12e Process are Driving AIoT appeared first on Chip Design....