industry news
Subscribe Now

Tango Systems Inc. Achieves Conformal Deposition for 15:1 Aspect Ratio TSVs

SAN JOSE, Calif.Nov. 5, 2014 – Tango Systems Inc., a leading innovator in high-performance, cost-effective physical vapor deposition (PVD) systems, today announced it has published results for conformal step seed layer coverage for through silicon vias (TSVs) with a15:1 aspect ratio. This significant achievement represents the industry’s highest TSV step coverage for interposers and 3D ICs. The results were achieved using Tango’s flagship Axcela™ PVD platform.

“2.5D interposers and 3D ICs are now in low-volume production for high-end server applications. To enable high volume manufacturing for consumer applications, via diameters must be aggressively reduced. High aspect ratio (HAR) TSVs are one way to do this,” says Ravi Mullapudi, CEO, Tango Systems. “At Tango, we’ve been fine-tuning hardware and process conditions in our Axcela platform to exceed step coverage requirements for HAR TSVs, and are pleased to announce our success in conformal coverage of 15:1 aspect ratio TSVs.” 

In TSV seed layer deposition processes for silicon interposers and device wafers, the Axcela PVD process window accommodates TSVs with via diameters ranging from sub-micron to 100µm, and aspect ratios as high as 15:1. The multi-wafer cluster architecture, coupled with the patented D-Source magnetron technology and ICP clean configuration, makes the Axcela PVD platform the most flexible, reliable, and cost-effective system in its class, capable of depositing metal layers from 10Å to 10µm layer thicknesses.

Tango’s step coverage capabilities also address industry requirements for under bump metallization, redistribution layer, TSV, CMOS image sensor, electro-magnetic interference shielding, and molded substrates. With the smallest footprint in the industry, Axcela’s technology and extendibility accommodate wafer sizes from 150mm – 300mm in the same system, and requires only a quick and easy hardware change.

About Tango Systems Inc.

Tango Systems, a leading innovator in high-performance, cost-effective PVD systems, has been supplying equipment and PVD process solutions in the advanced packaging, hard disk drive, ultra-thin films, interposers and TSV markets for 10 years. Customers benefit from Tango Systems’ TSV processing through ease of maintenance, high throughput, the lowest cost-of-ownership, high tool availability, active wafer cooling and low-temperature PVD processing. For more information on Tango Systems, visit our website, www.tangosystems.com.

Leave a Reply

featured blogs
Mar 28, 2024
'Move fast and break things,' a motto coined by Mark Zuckerberg, captures the ethos of Silicon Valley where creative disruption remakes the world through the invention of new technologies. From social media to autonomous cars, to generative AI, the disruptions have reverberat...
Mar 26, 2024
Learn how GPU acceleration impacts digital chip design implementation, expanding beyond chip simulation to fulfill compute demands of the RTL-to-GDSII process.The post Can GPUs Accelerate Digital Design Implementation? appeared first on Chip Design....
Mar 21, 2024
The awesome thing about these machines is that you are limited only by your imagination, and I've got a GREAT imagination....

featured video

We are Altera. We are for the innovators.

Sponsored by Intel

Today we embark on an exciting journey as we transition to Altera, an Intel Company. In a world of endless opportunities and challenges, we are here to provide the flexibility needed by our ecosystem of customers and partners to pioneer and accelerate innovation. As we leap into the future, we are committed to providing easy-to-design and deploy leadership programmable solutions to innovators to unlock extraordinary possibilities for everyone on the planet.

To learn more about Altera visit: http://intel.com/altera

featured chalk talk

BMP585: Robust Barometric Pressure Sensor
In this episode of Chalk Talk, Amelia Dalton and Dr. Thomas Block from Bosch Sensortec investigate the benefits of barometric pressure sensors for a variety of electronic designs. They examine how the ultra-low power consumption, excellent accuracy and suitability for use in harsh environments can make Bosch’s BMP585 barometric pressure sensors a great fit for your next design.
Oct 2, 2023
23,287 views