News – Page 1351 – EEJournal

Keysight Technologies Introduces the First CXPI Triggering, Decode Options for Oscilloscopes

May 4, 2016

SANTA ROSA, Calif., May 3, 2016 – Keysight Technologies, Inc. (NYSE: KEYS) today announced the clock extension peripheral interface (CXPI) decoding and triggering options for its InfiniiVision 3000T and 4000 X-Series oscilloscopes. These are the only oscilloscopes available today that can decode and trigger on the CXPI bus. These new capabilities improve engineers’ efficiency in debugging the physical layer of CXPI … Read More → "Keysight Technologies Introduces the First CXPI Triggering, Decode Options for Oscilloscopes"

New Cadence Allegro Platform Accelerates Design of Compact, High-Performance Products Using Flex and Rigid-Flex Technologies

May 4, 2016

MUNICH, Germany, 03 May 2016 — Today at CDNLive EMEA, Cadence Design Systems, Inc. (NASDAQ: CDNS) unveiled the Allegro® 17.2-2016 portfolio, which enables a more predictable and shorter design cycle. The portfolio features comprehensive in-design inter-layer checking technology that minimizes design-check-redesign iterations and a new dynamic concurrent team design capability that accelerates product creation time by up to 50 percent. Utilizing material inlay fabrication techniques, these new capabilities can reduce material costs by up to 25 percent. In addition, embedded SigrityTM technology now ensures critical signals meet performance criteria and power integrity (PI) for PCB designers addressing power … Read More → "New Cadence Allegro Platform Accelerates Design of Compact, High-Performance Products Using Flex and Rigid-Flex Technologies"

Curtiss-Wright Expands Ultra Small Form Factor Rugged System Family with Quad-Core Intel® Atom™ Highly Modular Mission Computer

May 4, 2016

AUVSI XPONENTIAL 2016 (BOOTH #873), NEW ORLEANS, La. – May 3, 2016 – Curtiss-Wright’s Defense Solutions division today announced the newest member of its Parvus® DuraCOR® family of extremely small form factor rugged commercial off the shelf (COTS) mission computer subsystems. Designed for a wide range of demanding applications and platforms, such as unmanned systems, that require an extremely size, weight, power and cost (SWaP-C) optimized mission computer, the new Parvus DuraCOR 311 Mission Computer combines 64-bit quad-core Intel “Baytrail” Atom™ modular mission processing capabilities with integrated Intel HD graphics in a lightweight, ultra-small form factor rugged design. The new ultra-small mission computer … Read More → "Curtiss-Wright Expands Ultra Small Form Factor Rugged System Family with Quad-Core Intel® Atom™ Highly Modular Mission Computer"

Imec Honors Dr. Gordon Moore with “Lifetime of Innovation Award”

May 4, 2016

Leuven (Belgium) – May 3, 2016 – World-leading nanoelectronics research center imec has announced that Dr. Gordon E. Moore, creator of the famous Moore’s law theory and co-founder of Intel, is the recipient of its lifetime of innovation award. Imec’s annual award recognizes Dr. Moore’s visionary view, unrivalled innovation, and his profound impact on the global electronics industry.

In 1965, Dr. Moore predicted that the number of components on an integrated circuit (IC) would double every year for the coming 10 years, thereby making ICs and computer processing simultaneously faster, cheaper, and more powerful. In 1975, Dr. … Read More → "Imec Honors Dr. Gordon Moore with “Lifetime of Innovation Award”"

TI’s 65-V micro-power buck converters feature industry’s lowest quiescent current

May 4, 2016

DALLAS (May 2, 2016) – Texas Instruments (TI) (NASDAQ: TXN) today introduced two 65-V, 150-mA synchronous DC/DC buck converters with the industry’s lowest 10.5-uA quiescent current (I_Q) for powering factory automation and automotive sensor applications requiring high efficiency. The industrial-grade LM5165 and automotive-grade LM5165-Q1 micro-power step-down regulators feature a wide input voltage (V_IN) range and dual control modes for optimizing efficiency and printed circuit board (PCB) area. By using the regulators together with TI’s WEBENCH^® Power … Read More → "TI’s 65-V micro-power buck converters feature industry’s lowest quiescent current"

Altium Releases New Documentation-Focused Update to Flagship PCB Design Platform

May 4, 2016

San Diego, Calif. – May 3, 2016 – Altium has announced the release of an update to their flagship PCB design platform, Altium Designer 16.1 <http://www.altium.com/altium-designer/whats-new> . This update continues the company’s core focus on providing engineers with the most efficient PCB design platform with several new features that enhance design documentation and high-speed design workflows. Altium Designer 16.1 is available now as a free upgrade for all existing Altium Subscription customers, and can be accessed via the Altium Products Download page << … Read More → "Altium Releases New Documentation-Focused Update to Flagship PCB Design Platform"

STMicroelectronics Brings Superior Indoor and Undercover Navigation to Mobiles and Wearables

May 4, 2016

Geneva, May 4, 2016 – Smartphones, as well as smartwatches, fitness trackers and other wearables are about to get better at guiding users and mapping their sporting achievements even where satellite navigation cannot work, using the latest electronic compass (eCompass) from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications.

Fitness-tracking smartphone apps, smartwatches, and bands need continuous location data for mapping and recording, and accuracy is critical for wearers who like to monitor their progress and share achievements online. A built-in eCompass helps calculate location when satellite signals are … Read More → "STMicroelectronics Brings Superior Indoor and Undercover Navigation to Mobiles and Wearables"

Cadence Expands OrCAD Solution to Address Flex and Rigid-Flex Design Challenges for IoT, Wearables and Mobile Devices

May 3, 2016

Today at CDNLive EMEA, Cadence Design Systems, Inc. (NASDAQ: CDNS) announced the OrCAD 17.2-2016 release with new capabilities for OrCAD® Capture, PSpice® Designer and PCB Designer that address challenges with flex and rigid-flex design as well as mixed-signal simulation complexities in IoT, wearables and wireless mobile devices.This latest release reduces PCB development time by addressing the need to design reliable circuits for smaller, more compact devices.

This OrCAD portfolio includes technology enabled for integrated rigid-flex planning, design and real-time visualization, as well as built-in translators that enable direct design imports from select EDA vendors. PSpice Designer … Read More → "Cadence Expands OrCAD Solution to Address Flex and Rigid-Flex Design Challenges for IoT, Wearables and Mobile Devices"

Semtech Announces the Industry’s First Single Chip Hybrid PLC and LoRa® Wireless Platform for Smart Grid, Smart Metering and IoT Applications

May 3, 2016

CAMARILLO, Calif., May 3, 2016 – Semtech Corporation (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, announced today the availability of its new EV8600 dual modem (PLC+RF System-on-Chip) with integrated LoRa™ wireless RF technology. The Semtech EV8600 is the first fully integrated PLC and LoRa modem for smart grid, smart metering and IoT applications. The advanced … Read More → "Semtech Announces the Industry’s First Single Chip Hybrid PLC and LoRa® Wireless Platform for Smart Grid, Smart Metering and IoT Applications"

Cadence Announces New Tensilica Vision P6 DSP Targeting Embedded Neural Network Applications

May 3, 2016

SAN JOSE, Calif., 02 May 2016 — Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the new Cadence® Tensilica® Vision P6 digital signal processor (DSP), Cadence’s highest-performing vision/imaging processor, which extends the Tensilica product portfolio further into the fast-growing vision/deep learning applications areas. New instructions, increased math throughput and other enhancements set a new standard in imaging and computer vision benchmarks, increasing performance by up to 4X compared to the Tensilica Vision P5 DSP.

The Tensilica Vision P6 DSP quadruples multiply-accumulate (MAC) performance compared to the previous generation Vision … Read More →

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