News – Page 1349 – EEJournal

IAR Systems enables development for low-power sensor processing based on new NXP dual-core series

November 11, 2014

Uppsala, Sweden—November 11, 2014—IAR Systems® announces that its development toolchain IAR Embedded Workbench® for ARM® provides excellent performance and multicore debugging for the new ultra-low-power LPC54100 microcontroller series from NXP Semiconductor. The series is targeted for applications with demands on always-on sensor processing and high sensor density, typically seen within implementations for wearable health and fitness applications, gaming, and industrial applications such as environmental monitoring, home and building automation, lighting and robotics.

IAR Embedded Workbench for ARM includes leading … Read More → "IAR Systems enables development for low-power sensor processing based on new NXP dual-core series"

Nitero Achieves First-Pass Silicon Success for Industry’s First Mobile 60GHz SoC Using Synopsys DesignWare IP for PCI Express and Tools

November 11, 2014

MOUNTAIN VIEW, Calif., Nov. 11, 2014 /PRNewswire/ —

Highlights:

Nitero achieved first-pass silicon success for industry’s first 60GHz Wi-Fi SoC using Synopsys DesignWare IP for PCI Express technology, Verification IP and Design Compiler and PrimeTime design tools
Gained competitive advantage with low-power, silicon-proven PCI Express IP
Met aggressive tapeout schedule and solidified first-mover advantage

Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, … Read More → "Nitero Achieves First-Pass Silicon Success for Industry’s First Mobile 60GHz SoC Using Synopsys DesignWare IP for PCI Express and Tools"

Cypress Enters Bluetooth Low Energy Market With the Industry’s Most Integrated One-Chip Solutions for the Internet of Things

November 11, 2014

MUNICH, November 11, 2014 – ELECTRONICA – Cypress Semiconductor Corp. (Nasdaq: CY) today introduced two highly integrated, single-chip Bluetooth^® Low Energy solutions that simplify design of low-power, sensor-based systems for the Internet of Things. The new PSoC^® 4 BLE Programmable System-on-Chip delivers unprecedented ease-of-use and integration in a customizable solution for IoT applications, home automation, healthcare equipment, sports and fitness monitors, and other wearable smart devices. The Read More → "Cypress Enters Bluetooth Low Energy Market With the Industry’s Most Integrated One-Chip Solutions for the Internet of Things"

STMicroelectronics Slashes Time-to-Development with Open.MEMS Licensing

November 11, 2014

Geneva, November 11, 2014 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, the world’s top MEMS (Micro-Electro-Mechanical Systems) manufacturer and the leading supplier of MEMS for consumer and mobile^{^[1]} as well as automotive applications^{^[2]}, today announced itsOpen.MEMS program to boost time-to-development with quick and easy … Read More → "STMicroelectronics Slashes Time-to-Development with Open.MEMS Licensing"

congatec offers EDM services for embedded designs

November 11, 2014

San Diego, California, November 11th, 2014 * * * congatec, Inc., a leading technology company for embedded computer modules and single board computers, is expanding its successful value chain with EDM (Embedded Design & Manufacturing) services.

Customers benefit from congatec’s rich experience as a manufacturer of high quality computer modules with synergistic effects leading to reduced development time and costs. Existing know-how and infrastructure make it possible for customers to outsource custom designs and solutions to congatec. As a single supplier covering the complete range of cost-effective standard solutions to individual EDMS projects, congatec supports the full range of technology … Read More → "congatec offers EDM services for embedded designs"

Reinforced isolation meets highest industrial performance

November 11, 2014

DALLAS (Nov. 11, 2014) – Texas Instruments (TI) (NASDAQ: TXN) today introduced digital isolation and delta-sigma modulator families that offer reinforced isolation to help protect electronic equipment from high line voltages. The ISO7842 family provides the industry’s highest immunity reinforced isolators and the first to withstand an isolation barrier with a working breakdown voltage of 1,500 Vrms for a minimum lifetime of 40 years. The AMC1304 delta-sigma modulator family offers best-in-class precision performance and the lowest power consumption with reinforced isolation for current shunt monitoring. For more information about the new reinforced isolation … Read More → "Reinforced isolation meets highest industrial performance"

Pentek Introduces NEW Line of 6U VPX Boards Boosting Functional Density and Performance

November 11, 2014

Leverages Cobalt Virtex-6 and Onyx Virtex-7 FPGA XMC modules
GateFlow FPGA Design Kit for custom IP development
GateXpress for dynamic FPGA reconfiguration
ReadyFlow libraries speed software development
Built for rugged and commercial environments

UPPER SADDLE RIVER, NJ–November 10, 2014–Pentek, Inc., today announced the addition of 6U VPX boards to the Pentek product line: the Models 57xxx with one XMC module installed and the Models 58xxx with two XMC modules installed. These products extend the Pentek building block strategy of < … Read More → "Pentek Introduces NEW Line of 6U VPX Boards Boosting Functional Density and Performance"

Sonics Adopts Cadence JasperGold Apps Formal Verification for On-Chip Network IP Development

November 10, 2014

SAN JOSE, Calif., November 10, 2014?Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Sonics, Inc. has adopted Cadence® JasperGold® Apps in the formal verification methodology for its intellectual property (IP). Sonics’ on-chip network IP integrates multiple heterogeneous cores in a system-on-chip (SoC) using configurable interconnect fabric and multiple, on-chip communication protocols including the native PIF interface of Cadence® Tensilica® Xtensa® DPUs. Sonics is initially deploying the JasperGold Apps to speed the extensive validation of its protocol conversion logic. To view a video of Sonics discussing its adoption of JasperGold Apps, visit http://www.cadence.com/news/sonicsvideo.

Latest Release of Synopsys’ CODE V Optimizes Optical Design Performance for Cost-Effective Manufacturing

November 10, 2014

MOUNTAIN VIEW, Calif., Nov. 10, 2014 /PRNewswire/ —

Highlights:

Enhanced design visualization supports cutting-edge optical systems, including those with hyper-hemispherical fields of view
Robust ray tracing algorithm accelerates optimization and analysis of precision optical systems
New optimization parameters improve optical system manufacturability
Charting improvements enhance presentation of system performance

Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the release … Read More → "Latest Release of Synopsys’ CODE V Optimizes Optical Design Performance for Cost-Effective Manufacturing"

New Microchip USB2.0 4-Port Controller Hub Featuring FlexConnect Technology Connects Smartphones to Automotive Infotainment Systems

November 10, 2014

CHANDLER, Ariz., Nov. 10, 2014 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced the extension of its USB2 Controller Hub (UCH2) portfolio with the new automotive-grade, 4-port USB84604 IC. Featuring FlexConnect technology and an upstream port that supports both USB2.0 and High Speed Interchip (HSIC) connectivity, the new USB84604 UCH2 is ideal for automotive infotainment system designs, where USB port expansion and connectivity is needed.

Meeting the … Read More → "New Microchip USB2.0 4-Port Controller Hub Featuring FlexConnect Technology Connects Smartphones to Automotive Infotainment Systems"

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