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AVX Announces the 6411 Series PCI Express® M.2 Connectors from Kyocera Connector Products

August 8, 2016

FOUNTAIN INN, S.C. (August 8, 2016) – AVX Corporation, a leading manufacturer of passive components and interconnect solutions, and the only authorized supplier of Kyocera Electronic Devices to the Americas and Europe, announces the 6411 Series PCI Express® M.2 connectors from Kyocera Connector Products®. Compatible with the new M.2 specification developed by the Peripheral Component Interconnect Special Interest Group (PCI-SIG), 6411 Series PCI Express connectors support multiple functions with high-speed signal integrity on a single card, effectively contributing to thinner and lighter notebook and mobile computers, including Ultrabook™ and … Read More → "AVX Announces the 6411 Series PCI Express® M.2 Connectors from Kyocera Connector Products"

eSOL Develops Software Parallelizer Using Model-Based Design

August 4, 2016

Tokyo, Japan. August 4, 2016 — eSOL, a leading developer of real-time embedded software solutions, today announced the development of a prototype of its eSOL Model-Based Parallelizer (MBP) that supports the development of software for multi- and many-core hardware. The incorporation of intelligent functions into equipment is being accompanied by growing use of multi- and many-core processors and multi-chip configurations that offer superior computing power. By using model diagrams in the parallelization process, eSOL MBP generates parallel software with high performance and efficiency in a way that takes account … Read More → "eSOL Develops Software Parallelizer Using Model-Based Design"

Silicon Labs Launches Industry’s First High-Speed Multi-Channel PLC Input Isolators

August 4, 2016

AUSTIN, Texas – August 3, 2016 – Silicon Labs (NASDAQ: SLAB) has introduced the industry’s first high-speed, multi-channel digital isolators designed to meet the demands of programmable logic controller (PLC) applications. The new Si838x PLC field input isolator family offers an unmatched combination of high-speed channels (up to 2 Mbps), exceptional channel integration (up to eight channels per device), bipolar input flexibility, high noise immunity and 2.5k VRMS safety isolation. The Si838x family provides a purpose-built solution for PLC applications including industrial I/O modules, computer numerical control (CNC) machines and servo motor control. The Si838x isolators are also … Read More → "Silicon Labs Launches Industry’s First High-Speed Multi-Channel PLC Input Isolators"

Cadence Delivers Industry’s First Design and Verification IP for MIPI SoundWire v1.1 High Quality Audio Solutions

August 3, 2016

SAN JOSE, Calif., August 2, 2016?Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that they have delivered the industry?s first Design and Verification IP for MIPI SoundWire v1.1 and demonstrated interoperability of MIPI SoundWire solutions in collaboration with Realtek. SoundWire is a digital audio interface specification that can replace legacy audio interfaces, reducing the cost of supporting high quality audio through reduced pin count, ease of integration, and low gate count. These system design benefits, and scalability of the solution from simple to high-end audio, make the standard attractive to many design applications.

?Cadence has … Read More → "Cadence Delivers Industry’s First Design and Verification IP for MIPI SoundWire v1.1 High Quality Audio Solutions"

AVX Releases New 2.9GHz High Performance, Low Pass Integrated Thin Film Filter in Ultra Miniature 0805 Case

August 3, 2016

FOUNTAIN INN, S.C. (August 3, 2016) – AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has released a new 2.9GHz 0805 high performance, low pass integrated thin film (ITF) SMD filter that exhibits low insertion loss and extremely sharp roll-off in high frequency (1.7GHz – 2.9GHz) wireless applications, including: mobile communications systems, microcell and picocell base stations, satellite TV receivers, global positioning systems (GPS), vehicle location systems, and wireless large area networks (LANs). Based on thin film multilayer technology, the new 2.9GHz filter delivers excellent high frequency performance, and features … Read More → "AVX Releases New 2.9GHz High Performance, Low Pass Integrated Thin Film Filter in Ultra Miniature 0805 Case"

Lime Micro Collaborates with On.Lab on the CORD Project for M-CORD Solution POC

August 3, 2016

MENLO PARK, Calif., August, 3, 2016 –  Lime Micro, a leading provider of open source Software Defined Radio products for 2G to 5G wireless networks, announces its collaboration with the CORD Project for a Proof of Concept (POC) on the Mobility Data Center (M-CORD). The work targets a number of applications including rural area coverage and use cases for Mobile Edge Computing. This work forms a key part in Lime’s commitment with service and solutions providers to drive innovation around open source CORD-based platforms to solve the challenges … Read More → "Lime Micro Collaborates with On.Lab on the CORD Project for M-CORD Solution POC"

Octal Bus Transceiver with Hot Insertion and Bus-Hold Capability adds to Diodes Incorporated’s Logic Portfolio

August 3, 2016

Plano, Texas – August 3rd, 2016 – The 74LVT245BB octal transceiver introduced by Diodes Incorporated enables asynchronous communication between data buses. A control pin determines data flow direction, while disabling the tri-state outputs allows the buses to be completely isolated. Once reserved primarily for computer applications, data buses are now commonplace in TVs, set-top boxes, base stations and a myriad of other data communication devices, providing a broad market for transceiver circuits.

The 74LVT245BB adds a partial power-down capability to the normal asynchronous … Read More → "Octal Bus Transceiver with Hot Insertion and Bus-Hold Capability adds to Diodes Incorporated’s Logic Portfolio"

STMicroelectronics Reveals Ultra-Tiny Low-Dropout Regulator in Breakthrough Bumpless Chip-Scale Package

August 3, 2016

Geneva, August 3, 2016 – STMicroelectronics has introduced the LDBL20, a 200mA Low-Dropout (LDO) regulator in a minuscule 0.47mm x 0.47mm x 0.2mm chip-scale package that is ideal for wearable and portable devices and for flexible electronics such as multifunction connected smart cards.

The LDBL20’s bumpless STSTAMP™ package breaks through the minimum I/O-area and height limitation imposed by the diameter of traditional flip-chip solder bumps, enabling unprecedentedly small footprints and low mounted heights. The LDBL20 extends ST’s family of compact LDOs, which includes devices from 2mm x 2mm DFN to a 0.69mm x 0.69mm CSP with 300mA … Read More → "STMicroelectronics Reveals Ultra-Tiny Low-Dropout Regulator in Breakthrough Bumpless Chip-Scale Package"

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