MOUNTAIN VIEW, Calif., – August 10, 2016 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced that Rockchip, China’s leading fabless semiconductor company, has licensed the Read More → "Rockchip and CEVA Extend Partnership to Include CEVA-XM4 Intelligent Vision DSP"
SAN JOSE, CA – August 9, 2016 – ADLINK Technology, Inc., a leading provider of embedded building blocks and Application-ready Intelligent Platforms (ARIPs) for the Industrial Internet of Things (IoT), invites attendees to learn about our IIoT and communications offerings at this year’s IDF16, August 16-18, at West Moscone Convention Center, San Francisco, CA, in IoT Community Booth 113 and Intel Builders Community Booth 173.
IoT Community Booth 113 – Operational Excellence Through Edge Analytics
We will be showing predictive maintenance for the smart factory with ADLINK’s PMQi … Read More → "ADLINK Technology Showcasing Predictive Maintenance and Network Functions Virtualization Solutions at Upcoming Intel Developer Forum (IDF16)"
Las Vegas / Ithaca, USA, August 9, 2016 — GrammaTech and its partner the University of Virginia took second place in DARPA’s Cyber Grand Challenge finale, showcasing next-generation technologies for software vulnerability discovery and application hardening.
GrammaTech’s team competed with Xandra – its high-performance, scalable system that harnessed 2400 cores to power 210 high-performance fuzzing pods capable of 1.8M fuzzing ops per second and feeding a dedicated bank of binary analyzers, patch generators, and binary rewriters to repair and protect binaries. Xandra performed steadily throughout the event, staying consistently in the top of the leaderboard … Read More → "GrammaTech’s Team TECHx Places Second in DARPA’s Cyber Grand Challenge"
Oxford, UK – 9th August 2016 — Orange Tree Technologies today announced the ZestSC3, an easy to use FPGA module with a Xilinx Artix-7 user-programmable … Read More → "Orange Tree announces SuperSpeed USB 3.0 FPGA module"
WARWICK, R.I. – At the end of 2014, the IEEE association adopted the IEEE802.3bj specification for 100 Gbps Ethernet. Among other things, the specification details the requirements for a 100 Gbps transmission path in printed circuit boards. Since its adoption, PICMG has defined the 100 Gbps requirements for AdvancedTCA backplanes and blades. Pentair introduces its first 100 Gbps Schroff AdvancedTCA backplane, verified according to the design requirements of the IEEE802.3bj specifications for 100 Gbps Ethernet.
The high data transmission rates of 100 Gbps presented new challenges for connectors, printed circuit board material and backplane design.
… Read More → "Pentair delivers the first 100 Gbps Schroff AdvancedTCA backplane"
WILSONVILLE, Ore., August 9, 2016 – Mentor Graphics Corp. (NASDAQ: MENT) has added to its Verification Academy a new SystemVerilog course and Patterns Library that together help verification engineers increase their expertise, productivity, and design quality. Developed by one of the leading SystemVerilog experts in the industry, SystemVerilog Object-Oriented Programming (OOP) for UVM Verification enables engineers to extend their SystemVerilog skills and keep up to date on the latest concepts, techniques, and methodologies. The searchable and versatile Patterns Library captures solutions for commonly encountered recurring problems, allowing organizations to document and share best practices to improve verification productivity and final … Read More → "Mentor Graphics Verification Academy Adds SystemVerilog Course and Patterns Library to Expand Engineers’ Expertise and Resources"
Plano, Texas – August 9th, 2016 – The AP3401 and AP3428 DC-DC step-down converters introduced by Diodes Incorporated are capable of driving loads up to 1A with excellent line- and load-regulation provided by a constant-frequency PWM control that requires no external compensation and so minimizes component count and material costs. Developed to meet the demands of set-top boxes, TVs, routers, Wi-Fi modules and security systems, these buck converters feature low power consumption and highly-efficient light-load operation.
The AP3401/3428 operate from an input voltage between 2.5V and 5.5V, making them well?suited for use with a single Li+/ … Read More → "1A DC-DC Buck Converters from Diodes Incorporated Achieve High Efficiency Under Light-Load and Full-Load Conditions"
OXFORD, UK, 9 August, 2016 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, offers an extensive range of products, selection tools and support materials that enable machine and plant safety operators to quickly and easily purchase vital safety equipment.
Latest products available from RS include light curtains from ABB Read More → "Safety range from RS Components addresses thousands of applications in machine, plant and personnel safety"
Durham, N.H., August 9, 2016 – The University of New Hampshire InterOperability Laboratory (UNH-IOL), an independent provider of broad-based testing and standards conformance services for the networking industry, announced today the first commercial availability of two previously proprietary Ethernet testing tools: a Universal FPGA-based Ethernet Test (UFET) System and a 10 Gigabit System. These tools will be available to UNH-IOL member companies for … Read More → "UNH-IOL Licenses Ethernet Test Tools for In-house Validation"
FREMONT, CA — (Marketwired) – 8/9/16 – Lam Research Corp. (NASDAQ: LRCX), an advanced manufacturer of semiconductor equipment, today introduced an atomic layer deposition (ALD) process for depositing low-fluorine-content tungsten films, the latest addition to its industry-leading ALTUS® family of products. With the industry’s first low-fluorine tungsten (LFW) ALD process, the ALTUS Max E Series addresses memory chipmakers’ key challenges and enables the continued scaling of 3D NAND and DRAM devices. Building on Lam’s market-leading product portfolio for memory applications, the new system is gaining market traction worldwide, winning production positions at leading 3D NAND and DRAM manufacturers and placement at … Read More → "Lam Research Enables Next-Generation Memory with Industry’s First ALD Process for Low-Fluorine Tungsten Fill"
