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Robust 4Mbps CAN FD µModule Isolator with Power Improves System Reliability

September 13, 2016

MILPITAS, CA – September 13, 2016 – Linear Technology Corporation introduces the LTM2889, a fully ISO 11898-2 compliant CAN (controller area network) µModule® (micromodule) transceiver and isolator that guards against large ground-to-ground differentials and common mode transients in 3.3V or 5V applications. In practical CAN systems, ground potentials vary widely from node to node, often exceeding the tolerable range, which can result in an interruption of communications or destruction of a transceiver. The LTM2889 separates grounds by isolating the CAN transceiver using internal inductive isolation. It implements multiple levels of protection to significantly improve system reliability, including 2,500VRMS of galvanic isolation, ±60V bus … Read More → "Robust 4Mbps CAN FD µModule Isolator with Power Improves System Reliability"

Frontier Silicon and Marvell showcase new Wi-Fi network optimization technology

September 13, 2016

Dallas, 13th September 2016 — Frontier Silicon, a leading software provider for consumer audio devices, and Marvell, a global leader in providing complete silicon solutions, are extending their collaboration to develop a new generation of smart audio technologies.

Frontier is including Marvell’s Dynamic Multi-Hop Relay (DMHR) technology in its new Google Cast™-enabled smart audio module, Minuet.  DMHR is a new technology which allows Wi-Fi® multi-room speakers to form a chain where each device can receive streaming audio from the previous link in the chain – rather than individual … Read More → "Frontier Silicon and Marvell showcase new Wi-Fi network optimization technology"

ANSYS AIM 17.2: Expanding Upfront Simulation for the Design Engineer

September 12, 2016

PITTSBURGH, September, 12, 2016 – With today’s latest release of ANSYS AIM, organizations can accelerate product design through upfront simulation, mitigate late-stage design changes, and reduce the number of costly physical prototypes. Now available, ANSYS AIM 17.2 enhances engineering simulation for thermal management, extends collaboration between designers and analysts, and brings upfront simulation to Japanese engineers in their own language.

“We are pleased that our customers continue to benefit from the rapid development of ANSYS AIM, allowing new applications to be solved with every release,” said Walid Abu-Hadba, chief product … Read More → "ANSYS AIM 17.2: Expanding Upfront Simulation for the Design Engineer"

GLOBALFOUNDRIES Extends FDX™ Roadmap with 12nm FD-SOI Technology

September 12, 2016

Santa Clara, Calif., September 8, 2016 — GLOBALFOUNDRIES today unveiled a new 12nm FD-SOI semiconductor technology, extending its leadership position by offering the industry’s first multi-node FD-SOI roadmap. Building on the success of its 22FDXTM offering, the company’s next-generation 12FDXTM platform is designed to enable the intelligent systems of tomorrow across a range of applications, from mobile computing and 5G connectivity to artificial intelligence and autonomous vehicles.

As the world becomes more and more integrated through billions of connected devices, many emerging applications demand a new approach to semiconductor innovation. The chips … Read More → "GLOBALFOUNDRIES Extends FDX™ Roadmap with 12nm FD-SOI Technology"

Synopsys Introduces ARC Security Processors for Low-Power Embedded Applications

September 12, 2016

MOUNTAIN VIEW, Calif., Sept. 12, 2016 /PRNewswire/ —

Highlights:

  • New ultra-low power ARC SEM processors incorporate advanced security features to protect systems from evolving threats
  • Timing and power randomization features protect against side-channel attacks on high-value targets such as smart metering, NFC payment and embedded SIM applications
  • Cryptographic functions are performed in a secure software environment versus dedicated hardware, reducing silicon area
  • Enhanced memory protection unit and SecureShield Runtime Library simplify development of a Trusted … Read More → "Synopsys Introduces ARC Security Processors for Low-Power Embedded Applications"

Synopsys Expands Collaboration with ARM to Deliver Artisan Physical Libraries and POP IP Support for IC Compiler II

September 8, 2016

MOUNTAIN VIEW, Calif., Sept. 8, 2016 /PRNewswire/ —

Highlights: 

Lam Research Introduces Dielectric Atomic Layer Etching Capability for Advanced Logic

September 7, 2016

FREMONT, CA — (Marketwired) – 9/6/16 – Lam Research Corp. (Nasdaq: LRCX), an advanced manufacturer of semiconductor equipment, today announced that it is expanding its atomic layer etching (ALE) portfolio with the addition of ALE capability on its Flex™ dielectric etch systems. Enabled by Lam’s Advanced Mixed Mode Pulsing (AMMP) technology, the new ALE process has demonstrated the atomic-level control needed to address key challenges in scaling logic devices to 10 nm and below. First in the industry to use plasma-enhanced ALE in production for dielectric films, the latest Flex system has been adopted as tool of record for high-volume manufacturing of logic … Read More → "Lam Research Introduces Dielectric Atomic Layer Etching Capability for Advanced Logic"

Pixus Offers Modular Subracks for Mounting of 3U, 6U and Custom Sized Boards

September 6, 2016

Waterloo, Ontario  —  Sept 06, 2016   –  Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers modular subracks and components for plugging of various sized boards.  The subracks are commonly 3U and 6U high or 4U and 7U allowing for spacing for fans. 

The modular subracks from Pixus come in 84HP (for 19” rackmount size), 42HP,  and 21HP widths.  The extruded rails feature tapped holes and optional extensions for IEEE injector/ejector latches.  Multiple depth options are available and EMC versions are … Read More → "Pixus Offers Modular Subracks for Mounting of 3U, 6U and Custom Sized Boards"

u-blox announces its first LTE Cat M1 module

September 6, 2016

Thalwil, Switzerland – September 6, 2016 – u-blox (SIX:UBXN), a global leader in wireless and positioning modules and chips, today announced plans to launch modules supporting Category M1 (Cat M1) LTE networks, which will allow a larger number of devices to connect to the Internet of Things (IoT). The first SARA-R4 module developed by u-blox will be available in Q4 2016 targeting mobile network operators in the US market. With the recently launched SARA-N2, the world’s first cellular NB-IoT module, the new LTE Cat M1 complements u-blox’s extensive product offering for the IoT.

Along with NB-IoT, … Read More → "u-blox announces its first LTE Cat M1 module"

STMicroelectronics Keynotes on Increasing Adoption of MEMS in IoT and on Future Smart Cars at SEMICON Taiwan

September 2, 2016

Taipei, Taiwan, September 2, 2016 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, a top MEMS[1] manufacturer and the world’s leading supplier of MEMS for consumer and mobile applications2, and a top-four supplier of automotive ICs3, today announced that two of its executives will deliver keynote speeches at SEMICON Taiwan 2016, September 7-9 2016.

At the MEMS Forum, Benedetto Vigna, Executive Vice President and General Manager of ST’s Analog and MEMS Group, … Read More → "STMicroelectronics Keynotes on Increasing Adoption of MEMS in IoT and on Future Smart Cars at SEMICON Taiwan"

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