News – Page 1324 – EEJournal

Micron Introduces Industry’s Best-in-Class SLC NAND Flash for IoT and Automotive

July 8, 2016

BOISE, Idaho, July 07, 2016 (GLOBE NEWSWIRE) — Micron Technology, Inc. (NASDAQ:MU), today announced its newest embedded SLC NAND Flash optimized for the next generation of Internet of Things (IoT) and automotive applications. Available with differing interfaces to accommodate design, Micron’s second generation Serial (SPI) NAND and fifth generation parallel SLC NAND, offers the industry’s best-in-class reliability¹ and read and program performance, ease of design and advanced security features.

Gartner projects that the IoT endpoint hardware and services market will rise to a $3.5 trillion industry by 2020². As system designers seek embedded … Read More → "Micron Introduces Industry’s Best-in-Class SLC NAND Flash for IoT and Automotive"

Multiprotocol Transceiver Simplifies Industrial Designs & Supports Legacy Peripherals

July 7, 2016

Supports broader range of RS-232 peripherals with wide ±10V RS-232 driver output
Reduces component count and saves board space as a result of integrated cable termination
Supports full DB9 RS-232 or RS-485/RS-422 serial protocols from one IC

Fremont, CA – July 7, 2016 – Exar Corporation (NYSE: EXAR), a leading supplier of analog mixed-signal products serving the industrial, high-end consumer and infrastructure markets, expanded its family of single-chip RS-232/RS-485/RS-422 serial transceivers by adding the XR34350.Read More → "Multiprotocol Transceiver Simplifies Industrial Designs & Supports Legacy Peripherals"

Compact 1 W and 2 W DC-DC converters target medical applications

July 7, 2016

XP Power today announced the IMM series of 1 and 2 Watt DC-DC converters. The IMM01 1 Watt and the IMM02 2 Watt converters are designed for use in medical applications. Providing a 1500 VAC input/output isolation at a 250 VAC working voltage to facilitate a 1 x MOPP the single and dual output units are approved to the international medical safety standards ANSI/AMII ES60601-1, CSA 22.2 No 60601-1 and EN/IEC60601-1.

The IMM01 and IMM02 are available with a choice of two 2:1 input voltage ranges based around a nominal 5 VDC (4.5 to 9.0 VDC) and 12 VDC (9.0 to 18.0 VDC) inputs. … Read More → "Compact 1 W and 2 W DC-DC converters target medical applications"

Modelithics and Coilcraft Collaborate to Offer New Microwave Global Models™ for High Frequency Conical Inductor Series

July 7, 2016

Tampa, Florida and Cary, IL – Modelithics, Inc. and Coilcraft Inc. have teamed to develop two (2) new Microwave Global Models™ for the Coilcraft BCL and BCR RF and microwave inductor families. Modelithics Microwave Global Models are high-accuracy equivalent circuit models that cover an entire component series within a single model. These powerful models, unique to Modelithics, feature substrate, pad and part value scalability (or selectability), and accurately predict parasitic effects based on the model parameter settings. These features allow designers to simulate condition-specific response of their designs electronically and perform advanced analysis of their designs with efficiency and accuracy.

< … Read More →

Intersil’s 12-Cell Li-ion Battery Pack Monitor Safeguards Hybrid and Electric Vehicle Battery Systems

July 7, 2016

Milpitas, Calif., June 20, 2016 – Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions, today announced the ISL78610 12-cell lithium-ion (Li-ion) battery pack monitor. The device provides cell balancing and accurate voltage and temperature monitoring to safeguard Li-ion battery packs in hybrid electric vehicles, plug-in hybrid electric vehicles, and electric vehicles. System designers can use the ISL78610 as a … Read More → "Intersil’s 12-Cell Li-ion Battery Pack Monitor Safeguards Hybrid and Electric Vehicle Battery Systems"

ADLINK Introduces Network Appliance & Media Cloud Server Based on Intel® Xeon® Processor E5-2600 v3/v4 and Intel® Xeon® Processor E3-1500 v5 Product Families for High Performance, Compute Intensive Solutions

July 7, 2016

San Jose, CA – July 7, 2016 – ADLINK Technology, Inc.,a leading global provider of embedded building blocks and edge computing platforms that enable the Industrial Internet of Things (IoT), today introduced the CSA-7200 Network Appliance and Read More → "ADLINK Introduces Network Appliance & Media Cloud Server Based on Intel® Xeon® Processor E5-2600 v3/v4 and Intel® Xeon® Processor E3-1500 v5 Product Families for High Performance, Compute Intensive Solutions"

STMicroelectronics Releases Development Ecosystem and Adds New Devices in Low-Power STM32L4 Microcontroller Series

July 7, 2016

Geneva, July 7, 2016 – STMicroelectronics has introduced the development ecosystem for its latest low-power, high-performance STM32L4 microcontrollers (MCU) and expanded the series with five new product lines comprising a range of package and memory-density options.

The expanded STM32L4 ecosystem builds on ST’s free and easy-to-use STM32Cube platform. This comprises theRead More → "STMicroelectronics Releases Development Ecosystem and Adds New Devices in Low-Power STM32L4 Microcontroller Series"

D3 Engineering announces availability of DesignCore™ ADAS Development Kit, featuring reference design with Texas Instruments TDA3x automotive vision processor

July 6, 2016

Rochester, NY – July 5, 2016 –D3 Engineering announces the availability of the DesignCore™ Development Kit for Advanced Driver Assistance Systems (ADAS). Based on D3’s DesignCore™ Rugged Vision Platform (RVP) Reference Design with Texas Instruments (TI) TDA3x Automotive Vision Processor, the new development kit lets product development teams evaluate ADAS technology under realistic on-vehicle conditions.

D3 demonstrated the development kit and a full-sized automotive implementation of its DesignCore™ RVP-TDA3x Reference Design in the TI booth at TU-Automotive Detroit 2016 this month. The ADAS Development Kit is available to qualified design integrators through D3 Engineering.

The DesignCore™ … Read More → "D3 Engineering announces availability of DesignCore™ ADAS Development Kit, featuring reference design with Texas Instruments TDA3x automotive vision processor"

Intersil Unveils Industry’s Highest Performance Laser Diode Driver for Automotive Heads-Up Displays

July 6, 2016

Milpitas, Calif., May 31, 2016 – Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions, today announced the ISL78365 laser diode driver for automotive heads-up display (HUD) systems. The highly integrated device pulses four high intensity lasers up to 750mA for projecting full-HD color video onto the windshield at nearly twice the current of competitive solutions. The ISL78365’s … Read More → "Intersil Unveils Industry’s Highest Performance Laser Diode Driver for Automotive Heads-Up Displays"

Nordic Semiconductor launches the most advanced, high-performance single chip Bluetooth low energy SoC in a tiny package size

July 6, 2016

Oslo, Norway – July 6, 2016 – Nordic Semiconductor today announces the availability of a Wafer Level Chip Scale Package (WL-CSP) variant of its nRF52832 Bluetooth® low energy (formerly known as Bluetooth Smart) System-on-Chip (SoC) that occupies a quarter of the footprint area of the standard-packaged Nordic nRF52832 and targets next-generation, high-performance wearables and space-constrained IoT applications.

The nRF52832 WL-CSP has a super-compact 3.0 by 3.2mm footprint compared to the standard 6.0 by 6.0mm footprint of its larger but conventionally-packaged nRF52832 QFN48 cousin, yet offers the same full single-chip feature … Read More → "Nordic Semiconductor launches the most advanced, high-performance single chip Bluetooth low energy SoC in a tiny package size"