News – Page 1316 – EEJournal

STMicroelectronics Reveals High-Efficiency Wireless Battery-Charging Chipset for Smaller, Simpler, Sealed Wearables

September 28, 2016

Geneva, September 28, 2016 – A miniaturized wireless battery-charging chipset from STMicroelectronics saves space, simplifies enclosure design and sealing, and accelerates time to market for ultra-compact sports wearables, wellness monitors, medical sensors, and remote controllers.

The combination of ST’s STWBC-WA charging-transmitter controller and Read More → "STMicroelectronics Reveals High-Efficiency Wireless Battery-Charging Chipset for Smaller, Simpler, Sealed Wearables"

Imagination licenses UltraSoC IP to deliver system-level debug and optimization capabilities for SoCs

September 27, 2016

CAMBRIDGE, United Kingdom, 27th September 2016 – UltraSoC today announced that Imagination Technologies (IMG.L) has licensed the full range of UltraSoC … Read More → "Imagination licenses UltraSoC IP to deliver system-level debug and optimization capabilities for SoCs"

Adesto Introduces EcoXiP™: the Ultimate Memory Solution for Intelligent IoT Devices

September 27, 2016

SUNNYVALE, Calif., Sept. 27, 2016 (GLOBE NEWSWIRE) — Adesto Technologies (NASDAQ:IOTS), a leading provider of application-specific, ultra-low power non-volatile memory products, today introduced EcoXiP™, a new eXecute-in-Place (XiP) non-volatile memory (NVM) that replaces expensive, energy-inefficient architectures, making power and performance trade-offs unnecessary in a wide range of connected devices. EcoXiP more than doubles processor performance, lowers system power consumption and reduces system cost compared to standard serial peripheral interface (SPI) devices.

Internet of things (IoT) and embedded devices such as wearables, medical monitors, POS controllers and other connected embedded systems must be designed to handle more intelligent local data … Read More → "Adesto Introduces EcoXiP™: the Ultimate Memory Solution for Intelligent IoT Devices"

Spin Transfer Technologies Develops 20nm Magnetic Tunnel Junction MRAM Technology at On-site R&D Fab

September 27, 2016

September 27, 2016 09:00 AM Eastern Daylight Time

FREMONT, Calif.–(BUSINESS WIRE)–Spin Transfer Technologies, Inc. (STT), a leading developer of breakthrough Orthogonal Spin Transfer Magneto-Resistive Random Access Memory technology (OST-MRAM™), today announced it has fabricated perpendicular MRAM magnetic tunnel junctions (MTJs) as small as 20nm — among the smallest MTJs reported — at its state-of-the-art development fab at the company’s Silicon Valley headquarters. The MTJ is the primary component of an MRAM memory cell and is the core technology of an MRAM device.

< … Read More →

Ericsson raises the bar with high-current 780W power interface module for ATCA applications

September 27, 2016

Quarter-brick power interface module (PIM) converter targets high-power Advanced Telecom Computing Architecture (ATCA) server applications
Feature-packed ultra-high-efficiency module delivers 15A output current at 82°C with 1.5m/s (300 LFM) airflow
Low-EMI design meets CISPR Class B with minimal external components
Extensive range of energy monitoring functionalities via I2C or PMBus

Ericsson Power Modules today announced the PIM4710PD, an extension of the popular 3E* Power Interface Module (PIM) family and an even higher power version than its recently announced family member – the 600W PIM4610PD. The new module … Read More → "Ericsson raises the bar with high-current 780W power interface module for ATCA applications"

Cadence Announces General Availability of Tensilica Xtensa LX7 Processor Architecture, Increasing Floating-Point Scalability to 2 to 64 FLOPS/Cycle

September 27, 2016

SAN JOSE, Calif., September 27, 2016?Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced general availability of the 12th generation Tensilica® Xtensa® base processor architecture. The Xtensa LX7 architecture makes new technologies available for customization by Xtensa customers and increases floating-point choices from 2 to 64 FLOPS/cycle, meeting the growing need for precision and portability in today?s demanding DSP (digital signal processing) applications. The Xtensa LX7 architecture includes easy-to-use click-box options for the Tensilica Vision P6 DSP for image and convolutional neural network (CNN) processing, the Tensilica Fusion … Read More → "Cadence Announces General Availability of Tensilica Xtensa LX7 Processor Architecture, Increasing Floating-Point Scalability to 2 to 64 FLOPS/Cycle"

ON Semiconductor Introduces Next Generation Fan Motor Drivers to Simplify and Accelerate Appliance Design

September 27, 2016

PHOENIX, Ariz. – Sept. 27, 2016 – ON Semiconductor (Nasdaq: ON), … Read More → "ON Semiconductor Introduces Next Generation Fan Motor Drivers to Simplify and Accelerate Appliance Design"

Imperas Expands University Partners Program

September 27, 2016

September 27, 2016 07:00 AM Eastern Daylight Time

OXFORD, England — Imperas Software Ltd. today announced the expansion of the Imperas University Program, with 34 universities now participating. The worldwide Imperas University Program was created to inspire and support the next generation of technologists and innovators. It grants academic and research institutions access … Read More → "Imperas Expands University Partners Program"

Faster, Easier Simplicity Studio Software from Silicon Labs Sets the Pace in Wireless IoT Design

September 27, 2016

AUSTIN, Texas – September 26th, 2016 – Silicon Labs (NASDAQ: SLAB) has released a major update of its award-winning Simplicity Studio™ software development tools. The new Simplicity Studio release represents a significant redesign of the software infrastructure, making the tools faster to download and easier to install and use. A more intuitive user interface improves the overall developer experience. As the industry’s most comprehensive software tool set for Internet of Things (IoT) connected device applications, Simplicity Studio is the only embedded development environment that broadly supports 8- and 32-bit microcontrollers (MCUs), multiprotocol and multiband wireless SoCs, and fixed-function devices.</ … Read More → "Faster, Easier Simplicity Studio Software from Silicon Labs Sets the Pace in Wireless IoT Design"

Ampleon launch ultra compact two-stage Doherty amplifier for 4.5 G / LTE Advanced Pro applications

September 27, 2016

Nijmegen, The Netherlands – Ampleon today announced a new family of integrated Doherty power amplifier devices aimed at LTE Advanced Pro / 4.5G massive-MIMO base station applications. Capable of being used also as power amplifiers in small cells, these compact and highly efficient devices are much smaller and easier to use than a traditional discrete Doherty amplifier design. They comprise a dual-stage Doherty amplifier with two stages of gain and feature 50 ohm matched inputs and outputs (on certain variants). Significantly simplifying the design process, these ultra compact amplifiers occupy the minimum of footprint, essential for today’s space constrained applications … Read More → "Ampleon launch ultra compact two-stage Doherty amplifier for 4.5 G / LTE Advanced Pro applications"