News – Page 1307 – EEJournal

Mentor Graphics Integrates its Questa Verification Solution with Jenkins Ecosystem Enabling Maximum Regression Speed

October 20, 2016

WILSONVILLE, Ore., October 20, 2016 – Mentor Graphics® Corporation (NASDAQ: MENT) today announced the integration of its Questa® Verification Solution with the Jenkins Continuous Integration and Source Code Management (CI/SCM) ecosystem. As a result, Mentor Graphics Questa users are now able to manage and control regressions running Questa Formal and Questa Simulation tools from within the Jenkins dashboard. They can also use Jenkins to interpret and analyze results, generate a complete suite of charts and graphs, and automatically generate status and trend reports for management. By integrating Questa tools with the … Read More → "Mentor Graphics Integrates its Questa Verification Solution with Jenkins Ecosystem Enabling Maximum Regression Speed"

Melexis Announces Pioneering Use of MEMS in Mid-Range Pressure Sensing Applications

October 20, 2016

Tessenderlo, Belgium, 20th October 2016 – Melexis, the global microelectronics company enabling future innovation through a philosophy of inspired engineering, continues to bring highly differentiated products to market through superior innovation, with the introduction of its MLX90819 sensor IC – which is targeted at measuring mid pressure (10-50bar) levels. Applying its proprietary micro-electro-mechanical system (MEMS) technology to an area that had not been previously adequately served by a fully integrated sensor solution means that major system design benefits can now be derived.

Available as a bare die, the MLX90819 runs off a standard 5 … Read More → "Melexis Announces Pioneering Use of MEMS in Mid-Range Pressure Sensing Applications"

STMicroelectronics Delivers Record Performance and Advanced Secure Services for the IoT with New STM32 Microcontroller Enhancements

October 20, 2016

New STM32H7 series establishes bar-setting industry benchmark for ARM^® Cortex^®-M core performance
Extremely high on-chip memory density and richest connectivity peripheral set, plus state-of-the-art security for connected objects

Geneva, October 20, 2016 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronic applications, is paving the way to even more intelligent smart devices everywhere with its new record-breaking Read More → "STMicroelectronics Delivers Record Performance and Advanced Secure Services for the IoT with New STM32 Microcontroller Enhancements"

CANDI Integrates with Intel® Building Management Platform to Provide Edge-to-Cloud IoT Data Access

October 20, 2016

Oakland, Calif. – October 20, 2016 – CANDI today announced that its PowerTools software has been integrated with the Intel® Building Management Platform (Intel® BMP), which is now available. Intel® BMP is a manageable IoT platform with built-in security that enables cloud-based smart building applications and services with easy access to the data and things in … Read More → "CANDI Integrates with Intel® Building Management Platform to Provide Edge-to-Cloud IoT Data Access"

ADLINK Launches PCIe-GIE72/74 GigE Vision PoE+ Frame Grabbers

October 20, 2016

San Jose, CA – Oct 18, 2016 – ADLINK Technology, a leading global provider of embedded building blocks and application-ready intelligent platforms, today announced the release of its new PCIe-GIE72/74 2/4CH PCI Express® GigE vision Power over Ethernet (PoE)+ frame grabbers. With comprehensive PoE power protection exclusive to ADLINK, multi-card capture capability, and smart PoE management combined with ADLINK’s extensive experience in GigE vision-based solutions, the … Read More → "ADLINK Launches PCIe-GIE72/74 GigE Vision PoE+ Frame Grabbers"

Renesas Electronics Introduces Two Versions of Third-Generation R-Car Starter Kits to Deliver “One Kit Per Engineer” Software Development Environment

October 19, 2016

Düsseldorf, October 19, 2016 – To accelerate the development of increasingly complex and large-scale automotive computing systems for the autonomous-driving era, Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced two new third-generation R-Car starter kits that make the development environment more accessible to automotive software development engineers. … Read More → "Renesas Electronics Introduces Two Versions of Third-Generation R-Car Starter Kits to Deliver “One Kit Per Engineer” Software Development Environment"

Orange Tree announces Gigabit Ethernet FPGA module with TCP/IP Offload Engine

October 19, 2016

Oxford, UK – 19th October 2016 — Orange Tree Technologies today announced the ZestET2-J, an FPGA module with a very high performance TCP/IP … Read More → "Orange Tree announces Gigabit Ethernet FPGA module with TCP/IP Offload Engine"

Intrinsic-ID to Host IoT Security Summit in Silicon Valley: “Establishing Trust for the Internet of Things”

October 19, 2016

MOUNTAIN VIEW, CA – October 17 2016: Intrinsic-ID, a digital authentication company and inventor of SRAM Physical Unclonable Function (SRAM PUF), today announced it will host its first Security Summit, bringing together electronics industry thought leaders to discuss best practices for Establishing Trust for the Internet of Things. The summit will take place on October 24th at Michaels at Shoreline in Mountain View, California from 9:00 am to 6:00 … Read More → "Intrinsic-ID to Host IoT Security Summit in Silicon Valley: “Establishing Trust for the Internet of Things”"

Mentor Graphics Announces Availability of Qualified Calibre PERC Rule Decks for UMC 28nm Technology

October 19, 2016

WILSONVILLE, Ore., October 19, 2016— Mentor Graphics Corporation (NASDAQ: MENT) today announced the availability of qualified Read More → "Mentor Graphics Announces Availability of Qualified Calibre PERC Rule Decks for UMC 28nm Technology"

Architects of Modern Power Releases New Standard for High Power Advanced Bus Dc-Dc Converter

October 19, 2016

TUALATIN, STOCKHOLM, and KYOTO —19 October 2016 — The Architects of Modern Power® (AMP Group®) consortium today announced a new standard aimed to keep designers of high-performance datacom and telecom equipment one step ahead as cloud computing and IoT continue to drive power density and power requirements higher. Initially supporting 1 kW of output power, the ‘HPABC?qbAMP™’ standard establishes common mechanical and electrical specifications for high power advanced bus dc-dc converters in distributed power systems.

The new ‘HPABC?qbAMP’ standard builds upon the previously released “ … Read More → "Architects of Modern Power Releases New Standard for High Power Advanced Bus Dc-Dc Converter"