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Keysight Technologies’ Boundary Scan Analyzer Delivers Improved Productivity, Coverage, Throughput

SANTA ROSA, Calif., March 4, 2015 – Keysight Technologies, Inc. (NYSE: KEYS) announced today that Solution Sources Programming Inc. (SSP), a comprehensive test and measurement solution provider, has achieved significant boundary scan test capabilities using the Keysight x1149 boundary scan analyzer in a standalone configuration or integrated with the Keysight i3070 in-circuit test system.

SSP has used the Keysight x1149-based solution on eleven key projects. Solutions range from low to no-access boards, all the way up to … Read More → "Keysight Technologies’ Boundary Scan Analyzer Delivers Improved Productivity, Coverage, Throughput"

Synopsys Announces VDK for Freescale S32V200 MCU Family for Advanced Driver Assistance Systems Development

MOUNTAIN VIEW, Calif., March 5, 2015 /PRNewswire/ —

Highlights:

  • Virtualizer Development Kit enables early software development, integration and test for increased productivity, higher reliability and reduced development cost
  • New VDK combines the virtual prototype for the S32V234 MCU, VDK software development tools and integration with automotive design tools enabling system integration and testing using a virtual Hardware-in-the-Loop environment
  • S32V234 virtual prototype developed as part of the Freescale® and Synopsys Center of Excellence collaboration ensures the earliest availability … Read More → "Synopsys Announces VDK for Freescale S32V200 MCU Family for Advanced Driver Assistance Systems Development"

Fairchild’s High-Current, High Efficiency MOSFETs Available in TO-Leadless Packaging for Automotive

SAN JOSE, Calif., March 2, 2015 /MobilityWire/ — Fairchild (NASDAQ: FCS), a leading global supplier of high-performance power semiconductor solutions, announced today the availability of its next generation PowerTrench® MOSFETs for automotive applications in the high-power TO-Leadless (TO-LL) package (JEDEC MO-299). The innovative TO-LL technology offers an extremely low package resistance, a very small … Read More → "Fairchild’s High-Current, High Efficiency MOSFETs Available in TO-Leadless Packaging for Automotive"

CSR Expands Dual-Mode BlueCore® Platform with Turnkey SoC for Bluetooth® Modules and Embedded IoT Systems

San Jose, California and Cambridge, UK – February 23, 2015 – CSR plc (LSE: CSR; NASDAQ: CSRE) today announces the launch of the BlueCore® CSRB5348 dual-mode system on chip (SoC). The new feature rich Bluetooth® Smart compliant platform offers a powerful, versatile and cost-effective solution, making it ideal for a variety of next generation embedded systems and modules. This configurable SoC is ideal for a number of emerging applications in the Internet of Things (IoT) space which require both Bluetooth and Bluetooth Smart Ready capabilities.

The industrial temperature grade SoC, part of … Read More → "CSR Expands Dual-Mode BlueCore® Platform with Turnkey SoC for Bluetooth® Modules and Embedded IoT Systems"

Mentor Graphics Joins the Center for Power Electronics Systems (CPES)

WILSONVILLE, Ore., March 4, 2015 — Mentor Graphics Corporation (NASDAQ: MENT) today announced that it has joined the Center for Power Electronics Systems (CPES) at Virginia Tech, the industry consortium dedicated to improving electrical power processing and distribution across various systems. CPES is focused on technologies and applications related to power electronic components: vehicular power conversion, power conversion technologies, power management, and renewable energy systems.  CPES has a global reputation for advanced research in power electronics with 78 members who contribute and participate in the organization’s mission, including Toyota, … Read More → "Mentor Graphics Joins the Center for Power Electronics Systems (CPES)"

Micro-mirrors from STMicroelectronics Provide Precision in Perceptual Computing

Geneva, March 2, 2015 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, the world’s top MEMS (Micro-Electro-Mechanical Systems) manufacturer and the leading supplier of MEMS for consumer and mobile applications[1] today announced that ST was providing micro-mirrors and control devices for Perceptual Computing initiatives at Intel.

In addition to the ASIC control devices, ST supplies a tiny MEMS mirror that moves thousands of times per second to scan an infrared light beam, painting … Read More → "Micro-mirrors from STMicroelectronics Provide Precision in Perceptual Computing"

Synchronous Rectifiers from Diodes Incorporated Offer High Integration and Efficiency for Portable Electronics Chargers

Plano, Texas – March 4, 2015 – Addressing the need for higher integration and efficiency in portable chargers, Diodes Incorporated has introduced two synchronous rectifiers: the APR3415 and APR34330. These devices combine a driver circuit with an internal MOSFET to provide cost effective rectification with reduced power dissipation and using fewer external components. Target applications include adapters/chargers for cellular and cordless phones, ADSL modems, MP3 players, and similar portable consumer products and home appliances.

The APR3415 and APR34330 are synchronous rectification switchers for 5V output-voltage … Read More → "Synchronous Rectifiers from Diodes Incorporated Offer High Integration and Efficiency for Portable Electronics Chargers"

InterDigital, Imec and Peraso Demonstrate World’s First Wigig-Based Milimeter Wave Mesh Backhaul System

BARCELONA, Spain, March. 4, 2015 (GLOBE NEWSWIRE) – MOBILE WORLD CONGRESS 2015 – InterDigital, Inc. (Nasdaq:IDCC), a mobile technology research and development company, nanoelectronics research center imec, and WiGig chip developer Peraso Technologies Inc. today announced the integration of their respective technologies into the world’s first WiGig-based Millimeter Wave Mesh Backhaul system. The technology will enable easier deployments for small cell mobile backhaul resulting in lower cost solutions for high-speed data delivery in 4G and 5G networks.

The system developed by the InterDigital Labs team includes imec’s 60 GHz PHARA4 radio and phased array antenna with fast … Read More → "InterDigital, Imec and Peraso Demonstrate World’s First Wigig-Based Milimeter Wave Mesh Backhaul System"

Audio ADCs combine professional performance with portable integration

DALLAS (March 4, 2015) – Texas Instruments (TI) (NASDAQ: TXN) today introduced a family of six high-performance audio analog-to-digital converters (ADCs). Featuring a dynamic range as high as 110 dB, the devices in the PCM1865 family integrate features typically found in portable audio codecs, while also giving designers a level of performance previously found only in single-function, professional audio ADCs. For more information about the new audio ADCs, visit www.ti.com/PCM1865-pr.

Powered by a single 3.3-V supply, the PCM1865 audio ADC removes the traditional requirement for a … Read More → "Audio ADCs combine professional performance with portable integration"

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