ESCATEC investment enables it to offer manufacture and test of next generation, high density, micro-scale PCBs
Heerbrugg, Switzerland – 9 March 2015 – ESCATEC, one of Europe’s leading providers of contract and manufacturing services, has invested in the next generation of ultra small needles for bed of nails testing of high density, micro-scale PCBs. This will enable the company to provide customers with next generation, high density, micro-scale PCBs that are growing in popularity, especially for wearable electronics and Internet of Things (IoT) applications. Automated bed of nails testing ensures that production costs are kept low for customers and that yields are improved as manual testing with probes is eliminated.
“PCBs are always getting smaller and … Read More → "ESCATEC investment enables it to offer manufacture and test of next generation, high density, micro-scale PCBs"