News – Page 1263 – EEJournal

Linear Technology Demonstrates Breakthrough Wireless Battery Management System in BMW i3 at CES

January 4, 2017

MILPITAS, CA – January 4, 2017 – Linear Technology, the leading provider of battery stack monitoring ICs for electric and hybrid/electric vehicles, is demonstrating the industry’s first wireless automotive battery management system (BMS) concept car at the Consumer Electronics Show this week in Las Vegas (Booth 36708, LVCC South Hall 4). This wireless BMS concept car, developed with Linear’s design partner LION Smart, combines Linear’s highly accurate battery stack monitors with its SmartMesh® wireless mesh networking products in a BMW i3, replacing the traditional wired connections between the battery packs and the battery management system. This significant breakthrough in BMS addresses … Read More → "Linear Technology Demonstrates Breakthrough Wireless Battery Management System in BMW i3 at CES"

Shenzhen Micro & Nano Institute License CEVA Audio/Voice DSP for 8 Microphone Far-Field Voice Pickup Applications

January 3, 2017

MOUNTAIN VIEW, Calif., – January 03, 2017 – the leading licensor of signal processing IP for smarter, connected devices, today announced that Shenzhen Micro & Nano Institute (MNI) has licensed the CEVA audio/voice DSP for the development of a multi-mic voice processor targeting a range of intelligent hardware systems including robots, smart appliances and the smart home.

“The IoT revolution continues to drive the use of voice and speech processing into new use cases and applications, where microphone array technology is key to deliver the optimal user experience,” said Dr. Feng Xiaoxing, MNI. “Utilizing the CEVA audio/voice DSP, our … Read More → "Shenzhen Micro & Nano Institute License CEVA Audio/Voice DSP for 8 Microphone Far-Field Voice Pickup Applications"

STMicroelectronics Advances Single-Chip Telematics/Connectivity Processors to Support Future Connected-Driving Services

January 3, 2017

ST’s ‘Telemaco’ family combines telematics and connectivity functions in the same chip, delivering economical, scalable platform
Latest-generation chips pack in hardware-accelerated cybersecurity and extra processing power to support more sophisticated connected-driving applications

Geneva, January 3, 2017 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has boosted performance and security in its latest Telemaco processors tailored to support richer connected-driving services.

Telematics systems that monitor on-board sensors and exchange information with the Cloud are becoming increasingly sophisticated to support high-value services including remote vehicle diagnostics, roadside … Read More → "STMicroelectronics Advances Single-Chip Telematics/Connectivity Processors to Support Future Connected-Driving Services"

congatec presents new COM Express modules with Gen 7 Intel® Core™ processors (codename Kaby Lake)

January 3, 2017

San Diego, CA, January 3, 2017 * * * congatec – a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services – has released new COM Express Compact modules in time with the launch of the 7th generation of Intel^® Core™ SoC processors (codename Kaby Lake). The new conga?TC175 Computer-on-Modules (COMs) with Intel’s Skylake successor –the second variant of the current 14nm microarchitecture – are simply better than their predecessors. Compelling features include greater CPU performance, more dynamic HDR graphics thanks to 10-bit video codec, and support of the optional, super-fast 3D Xpoint-based Intel< … Read More → "congatec presents new COM Express modules with Gen 7 Intel® Core™ processors (codename Kaby Lake)"

Imec and Besi Demonstrate Long-Term Reliability of Ni-Cu-Ag Plated Solar Modules

January 3, 2017

Drunen (The Netherlands) and Leuven (Belgium)—January 3, 2017—Today, the world-leading research and innovation hub in nano-electronics, energy and digital technology imec (partner in EnergyVille) and BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment for the semiconductor industry, announced that they have demonstrated long-term reliability in five full size 60-cells Nickel/Copper/Silver (Ni/Cu/Ag) plated solar cell modules, confirming the industrial value of this metallization technology.

The modules consist of 60 front side laser ablated and Ni-Cu-Ag plated … Read More → "Imec and Besi Demonstrate Long-Term Reliability of Ni-Cu-Ag Plated Solar Modules"

STMicroelectronics Peps Up Booming Social-Fitness Scene with Smart Motion Sensors for Better Accuracy, Longer Battery Life, and Faster Time to Market

January 2, 2017

ST smart MEMS sensors with on-board pedometer extend battery life of devices hosting always-on activity-tracking apps
Already designed into several smartphones to enable the social fitness feature WeRun inside WeChat messaging app
Low-power design combines with superior performance and faster and easier calibration by end user

Geneva, January 2, 2017 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and the leading supplier^{^[1]} of MEMSRead More → "STMicroelectronics Peps Up Booming Social-Fitness Scene with Smart Motion Sensors for Better Accuracy, Longer Battery Life, and Faster Time to Market"

Pentek Introduces Jade Architecture Module for Extremely Wideband Signal Applications

December 28, 2016

1-channel, 3.6 GHz or 2-channel, 1.8 GHz 12-bit A/D converter
Digital down converter (DDC) IP with up to 32x decimation
Jade architecture with Xilinx Kintex Ultrascale FPGA offers price, power and processing performance
advantages
Navigator Design Suite compatible with Xilinx’s Plug-and-Play Vivado IP Integrator expedites development

UPPER SADDLE RIVER, NJ? Pentek, Inc., today introduced the newest member of the Jade™ family of high-performance data converter XMC FPGA modules: the Jade Model 71841, a 1-channel, 3.6 GHz 12-bit A/D or 2-channel, 1.8 GHz 12 … Read More → "Pentek Introduces Jade Architecture Module for Extremely Wideband Signal Applications"

Himax Announces 5.5MP UltraSenseIR™ BSI Image Sensor with 2X Higher Near Infrared Sensitivity for Computer Vision and NIR Imaging Camera

December 28, 2016

TAINAN, Taiwan, Dec. 27, 2016 (GLOBE NEWSWIRE) — Himax Imaging, Inc., a subsidiary of Himax Technologies, Inc. (Nasdaq:HIMX) (“Himax” or the “Company”), a leading global supplier and fabless manufacturer of display drivers and other semiconductor products, today announced the HM5530 UltraSenseIR™ product, a low power and low noise 5.5 Megapixel Back Side Illuminated (“BSI”) CMOS Image Sensor (“CIS”) with more than 40% quantum efficiency in the Near Infrared (“NIR”) spectrum enabling the next generation of embedded computer vision applications such as 3D camera, autonomous navigation, event and pattern recognition and human-machine interaction.

Read More → "Himax Announces 5.5MP UltraSenseIR™ BSI Image Sensor with 2X Higher Near Infrared Sensitivity for Computer Vision and NIR Imaging Camera"

Green Hills Software and INTEGRITY Security Services to Present and Exhibit at CTS/CES 2017 in Las Vegas, NV

December 23, 2016

SANTA BARBARA, CA — December 22, 2016 — Green Hills Software and INTEGRITY Security Services (ISS) will showcase their industry-leading technology for automotive electronics and secure IoT devices at CES 2017 and Consumer Telematics Show (CTS) and associated programs, January 4-8, 2017 in Las Vegas, Nevada.

Key demonstrations and presentations will include innovative solutions for cybersecurity for the connected car, ensuring trusted electronic component supply chains, and consolidating complex automotive cockpit software in safe and secure domains.

CTS, January 4 – … Read More → "Green Hills Software and INTEGRITY Security Services to Present and Exhibit at CTS/CES 2017 in Las Vegas, NV"

Huawei selects Rohde & Schwarz for NB-IoT base station testing in line with 3GPP Rel. 13

December 23, 2016

In response to the growing demand for low-power services and applications as part of the Internet of Things (IoT), 3GPP has developed narrowband IoT (NB-IoT), a new cellular air interface that is fully adapted to the requirements of machine type communications. In October, Huawei and Rohde & Schwarz finished a test session for NB-IoT capable base stations, successfully verifying their air interface characteristics and RF performance in line with 3GPP.

Munich, December 22, 2016 — Huawei, a leading global ICT solutions provider, has chosen a test solution from Rohde & Schwarz based on the R&S SMW200A vector … Read More → "Huawei selects Rohde & Schwarz for NB-IoT base station testing in line with 3GPP Rel. 13"

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