News – Page 1263 – EEJournal

First Scalable Wi-Fi HaLow MAC from Methods2Business Built with Cadence Tensilica DSP

February 22, 2017

SAN JOSE, Calif., 21 Feb 2017 — Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its Cadence® Tensilica® Fusion F1 DSP is part of the latest Methods2Business (M2B) Wi-Fi HaLow™ MAC IP offering. The licensable IP targets SoCs designed for battery-powered sensor nodes used in smart home, smart city and industrial applications. M2B leveraged the Fusion F1 DSP both to implement the IEEE 802.11ah MAC firmware and to run value-added applications like voice trigger, audio identification and sensor fusion on a single DSP. Customers can benefit from a hardware-software solution achieving optimal balance of … Read More → "First Scalable Wi-Fi HaLow MAC from Methods2Business Built with Cadence Tensilica DSP"

CUI Successfully Deploys its Software Defined Power Solutions (ICE Block) to Industry-Leading Data Center Operators

February 22, 2017

TUALATIN, Ore. — February 22, 2017 — CUI announced today that it has successfully deployed initial test units of its Intelligent Control of Energy (“ICE”) Block technology (http://www.cui.com/sdp-infrastructure-solutions). Deployment of the units highlight ICE Block’s peak shaving capabilities and includes a new ICE … Read More → "CUI Successfully Deploys its Software Defined Power Solutions (ICE Block) to Industry-Leading Data Center Operators"

LETI TO PRESENT LATEST R&D RESULTS ON Three Alternatives to EUV and 193nm Lithography at SPIE Meeting in US

February 22, 2017

GRENOBLE, France – Feb. 22, 2017 – In keeping with its mission to develop photolithography alternatives for advanced technology nodes and offer competitive solutions adapted to specific applications, Leti is developing technologies for directed self-assembly lithography (DSA), massively parallel electron beam lithography and nanoimprint lithography.

Leti, a research institute at CEA Tech, will present its latest results in these approaches for fabricating advanced CMOS and silicon photonics devices and sensors in several papers at the SPIE Advanced Lithography conference in San Jose, Calif., Feb. 26-March 2.

The ongoing collaborations with leading industry-equipment companies are designed to offer integrated circuit manufacturers … Read More → "LETI TO PRESENT LATEST R&D RESULTS ON Three Alternatives to EUV and 193nm Lithography at SPIE Meeting in US"

Sequans Introduces Monarch SX: LTE-M/NB-IoT System-on-Chip for Integrated IoT Devices

February 22, 2017

PARIS, France – February 22, 2017 – LTE for IoT chipmaker Sequans Communications S.A. (NYSE: SQNS) today introduced Monarch SX, a highly-integrated system-on-chip that combines Sequans’ IoT optimized Monarch LTE-M/NB-IoT platform with a low-power ARM^® Cortex^®-M4 processor, low power sensor hub, graphics display controller, and media processing engine, all in one compact package of less than 90 square millimeters. Monarch SX is designed to streamline the development of numerous types of IoT devices, including trackers, wearables, sensors, utility meters, and other smart home and city applications.

< … Read More →

STMicroelectronics Extends Flexibility of STM32 Ecosystem with Latest STM32F722 Nucleo board and STM32F723 Discovery kit

February 22, 2017

Geneva, February 22, 2017 – STMicroelectronics continues to enhance flexibility for developers working with high-performance STM32F722/723 microcontrollers^{^[1]}. A new-generation Discovery kit provides access to the STM32F723’s unique high-speed USB PHY, and a new STM32 Nucleo-144 board supports the STM32F722.

With rich on-board features including MEMS microphones and sensors, an audio codec, and a display for user-interface development, the Read More → "STMicroelectronics Extends Flexibility of STM32 Ecosystem with Latest STM32F722 Nucleo board and STM32F723 Discovery kit"

EXFO and Rohde & Schwarz accelerate troubleshooting of mobile networks

February 22, 2017

The two manufacturers have partnered together to provide test and measurement (T&M) solutions for on-site commissioning, maintenance and troubleshooting of mobile communications systems. EXFO and Rohde & Schwarz – each an expert in their own field – offer complementary solutions that combine optical and wireless technologies to significantly speed up and efficiently locate and eliminate RF interference.

Munich, February 22, 2017 — In modern mobile network stations, RF equipment continues to shift closer to the antennas. They are usually mounted just below the antenna in … Read More → "EXFO and Rohde & Schwarz accelerate troubleshooting of mobile networks"

Xilinx Unveils Disruptive Integration and Architectural Breakthrough for 5G Wireless with RF-Class Analog Technology

February 22, 2017

SAN JOSE, Calif., Feb. 21, 2017 /PRNewswire/ — Xilinx, Inc. (NASDAQ:XLNX) today announced a disruptive integration and architectural breakthrough for 5G wireless with the infusion of RF-class analog technology into its 16nm All Programmable MPSoCs. Xilinx’s new All Programmable RFSoCs eliminate discrete data converters, providing 50-75% power and footprint reduction for 5G massive-MIMO and millimeter wave wireless backhaul applications.

Large scale 2D antenna array systems will be key to the increase in spectral efficiency and network densification needed for 5G. Manufacturers … Read More → "Xilinx Unveils Disruptive Integration and Architectural Breakthrough for 5G Wireless with RF-Class Analog Technology"

STMicroelectronics Delivers Superior-Performing NFC Technology for Secure Contactless Payments and IoT Applications

February 21, 2017

Geneva, February 21, 2017 – STMicroelectronics has announced availability of its latest-generation NFC devices for contactless payments and data exchange. The new devices include the ST21NFCD NFC controller featuring the market-proven booster technology ST has recently acquired, and two new members in the … Read More → "STMicroelectronics Delivers Superior-Performing NFC Technology for Secure Contactless Payments and IoT Applications"

Accellera Day Opens DVCon U.S. on Monday, February 27 with Three Timely Tutorials

February 21, 2017

Elk Grove, Calif., USA, February 21, 2017 – Accellera Systems Initiative (Accellera), the electronics industry organization focused on electronic design automation (EDA) and intellectual property (IP) standards, will host its annual Accellera Day on Monday, February 27.

What/When/Where

Accellera Day opens DVCon U.S. 2017 on Monday, February 27 from 9:00am-5:00pm at the DoubleTree Hotel in San Jose, Calif. A booth crawl will be held during the Exhibition from 5:00pm-7:00pm.

Agenda:

9:00am-12:00pm

Tutorial 1: “Read More → "Accellera Day Opens DVCon U.S. on Monday, February 27 with Three Timely Tutorials"

Connected cars: Rohde & Schwarz Cybersecurity now provides dedicated security solutions for IoT automotive telematics

February 21, 2017

Building a secure automotive telematics platform to achieve a profitable business model for automakers and ecosystem partners is a challenging task for mobile network operators. As the platforms lack detailed security specifications and a standardized framework, they become an attractive target for cybercriminals. Rohde & Schwarz Cybersecurity now offers solutions that enable operators to build a second line of defense to protect platforms and vehicles. The security solutions will be presented at this year’s Mobile World Congress.

Leipzig, Germany – February 21, 2017 – Mobile … Read More → "Connected cars: Rohde & Schwarz Cybersecurity now provides dedicated security solutions for IoT automotive telematics"