News – Page 1247 – EEJournal

Renesas Electronics ADAS Starter Kit Accelerates Vision-Based ADAS Application Development

July 16, 2015

Düsseldorf, July 16, 2015 – Renesas Electronics, a premier provider of advanced semiconductor solutions, today introduced the smallest R-Car-based development kit to date – the ADAS Starter Kit – based on Renesas’ high-end R-Car H2 System on Chip (SoC) and developed to help simplify and speed up the development of advanced driver assistance systems (ADAS) applications.

Complementing Renesas’ current R-Car V2H-based ADAS development boards, the new ADAS Starter Kit will enable users and partner companies to experience the enhanced computer vision performance of Renesas SoCs and accelerate the development of dedicated … Read More → "Renesas Electronics ADAS Starter Kit Accelerates Vision-Based ADAS Application Development"

Digi-Key Partners with ARM University Program to Offer ‘Lab-in-a-Box’ for Participating Universities Worldwide

July 16, 2015

THIEF RIVER FALLS, Minnesota, USA – Global electronic components distributor Digi-Key Electronics, the industry leader in electronic component selection, availability and delivery, today announced their partnership with the ARM University Program to distribute the innovative ‘Lab-in-a-Box’ (LiB) to higher educational institutions around the globe.

The LiB contains ARM-based technology and high quality, rigorous training materials that support electronics and computer engineering courses. Since its launch in February 2014, ARM LiBs have been successfully deployed in hundreds of universities worldwide, enabling an easy migration path for academics wanting to upgrade their existing curricula to state-of-the-art technologies from … Read More → "Digi-Key Partners with ARM University Program to Offer ‘Lab-in-a-Box’ for Participating Universities Worldwide"

2A, 70V SEPIC/Boost DC/DC Converter with 7µA Quiescent Current

July 16, 2015

MILPITAS, CA – July 16, 2015 – Linear Technology Corporation announces the LT8494, a current mode, fixed frequency SEPIC/boost DC/DC converter with an internal 2A, 70V switch. Ultralow quiescent current of only 7µA makes the device ideal for always-on automotive or other industrial battery powered systems. The LT8494 starts up from an input voltage range of 2.5V to 32V and once running it … Read More → "2A, 70V SEPIC/Boost DC/DC Converter with 7µA Quiescent Current"

Keysight Technologies’ AcqirisMAQS Software Simplifies Multichannel Data Acquisition Systems

July 15, 2015

SANTA ROSA, Calif., July 13, 2015 – Keysight Technologies, Inc. (NYSE: KEYS) today announced a new version of its U1092A AcqirisMAQS Multichannel Acquisition Software. This application, providing unique features for massively multichannel acquisition systems, evolved together with all Keysight’s latest technologies, including the newly introduced M9709A AXIe 8-bit high-speed digitizer.

AcqirisMAQS proven software, designed specifically for large multichannel acquisition, enables configuration management as well as visualization of data for hundreds of channels from a … Read More → "Keysight Technologies’ AcqirisMAQS Software Simplifies Multichannel Data Acquisition Systems"

Besi and Imec Present High-Accuracy Narrow-Pitch Bonding of 3D ICs using Thermocompression

July 15, 2015

Leuven (Belgium) and Radfeld (Austria) —July 14, 2015—Today, at SEMICON WEST 2015 (San Francisco), world-leading nano-electronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries announced that they have jointly developed an automated thermocompression solution for narrow-pitch die-to-wafer bonding, a method by which singulated dies are stacked onto bottom dies which are still part of a fully intact 300mm wafer. The solution features high accuracy and high throughput, paving the way to a manufacturable 2.5D, 3D, and 2.5 … Read More → "Besi and Imec Present High-Accuracy Narrow-Pitch Bonding of 3D ICs using Thermocompression"

crystalsol Announces Development of Fully Printed Flexible Photovoltaic Film Using Silver Nanowires from Cambrios

July 15, 2015

July 14, 2015 – San Francisco, CA (Intersolar North America) –Vienna, Austria-based flexible photovoltaic film (PV) innovator, crystalsol GmbH, andCambrios Technologies, the Sunnyvale, CA-based leader in silver nanowire technology, today announced that crystalsol has successfully developed fully printed flexible solar cells using silver nanowires from Cambrios. Solar cells from the pilot production line at crystalsol are shipping into low volume consumer products. crystalsol expects large volume product shipment into building integrated photovoltaics market to begin in the near future.

“Our proprietary printed solar cell technology successfully achieves highly efficient solar cells that are thin, lightweight … Read More → "crystalsol Announces Development of Fully Printed Flexible Photovoltaic Film Using Silver Nanowires from Cambrios"

Compact, Low-Power, Configurable Multifunction Gates Add Versatility to Diodes Incorporated’s Logic Product Line

July 15, 2015

Plano, Texas – July 15th, 2015 – Four new multifunction gates from Diodes Incorporated feature user-customized logic configurations so that a single part can replace multiple devices. This product line expansion adds a new level of versatility to Diodes Incorporated’s existing 74AUP1G logic family and provides valuable space and weight saving benefits in space-constrained applications such as fitness wearables, smartphones and other portable consumer electronic devices.

The 74AUP1G57, 74AUP1G58, 74AUP1G97 and 74AUP1G98 provide various base gate arrangements with three … Read More → "Compact, Low-Power, Configurable Multifunction Gates Add Versatility to Diodes Incorporated’s Logic Product Line"

Leti and EVG Launch INSPIRE, a Lithography Program Aimed At Demonstrating Benefits of Nano-imprint Technology

July 15, 2015

GRENOBLE, France, and ST. FLORIAN AM INN, Austria – July 15, 2015 – CEA-Leti and EV Group have launched a new program in nano-imprint lithography (NIL) called INSPIRE to demonstrate the benefits of the versatile, powerful nano-patterning technology and spread its use for applications beyond semiconductors.

In addition to creating an industrial partnership to develop NIL process solutions, the INSPIRE program is designed to demonstrate the technology’s cost-of-ownership benefits for a wide range of application domains, such as photonics, plasmonics, lighting, photovoltaics, wafer-level optics and bio-technology.

GrammaTech’s TECHx Research Team Selected as Finalist in DARPA’s Cyber Grand Challenge

July 14, 2015

ITHACA, N.Y., July 13, 2015 /PRNewswire/ — GrammaTech, Inc., a leading maker of tools that improve and accelerate embedded software development, today announced the Defense Advanced Research Projects Agency (DARPA) has selected GrammaTech’s TECHx research team as a finalist in its Cyber Grand Challenge (CGC). The TECHx team, which includes collaborators from the University of Virginia, successfully beat off dozens of other competitors. The seven finalists will compete head-to-head at next year’s final … Read More → "GrammaTech’s TECHx Research Team Selected as Finalist in DARPA’s Cyber Grand Challenge"

Atmel Launches IoT Cloud Ecosystem Partner Program, Accelerating Internet of Things Development

July 14, 2015

SAN JOSE, CA, July 13, 2015 – Atmel® Corporation (NASDAQ: ATML), a global leader in microcontroller (MCU) and touch solutions, today launched the Atmel Internet of Things (IoT) Cloud Ecosystem Partner Program. The new program enables developers using Atmel | SMART MCUs and Atmel SmartConnect wireless solutions to access Atmel’s market-leading ecosystem cloud partners for device management, data analytics, and visualization in order to experience an end-to-end IoT solution development ‘out of the box’.

With the increasing need to collect, visualize and analyze data from IoT … Read More → "Atmel Launches IoT Cloud Ecosystem Partner Program, Accelerating Internet of Things Development"

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