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SmartDV’s USB Power Delivery Verification IP Successfully Deployed by Lattice Semiconductor

July 8, 2015

SAN DIEGO, CA – July 8, 2015 – Within a four week period, SmartDV Technologies, the verification intellectual property (VIP) company, delivered verification IP to Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of customizable smart connectivity solutions. Lattice Semiconductor used the verification IP to verify and tape out their chip with a type C/CC connector interface that supports the new USB power delivery specification.

USB Power Delivery Verification IP, one of 75+ VIPs from SmartDV, uses compiler technology that automates VIP creation as well as customization to meet customer needs, resulting in shorter support turnaround time. Customers have source code … Read More → "SmartDV’s USB Power Delivery Verification IP Successfully Deployed by Lattice Semiconductor"

STMicroelectronics Shows How to Transform Products to Suit Dynamic Mobile and IoT Markets in China

July 8, 2015

Shanghai, China, 8 July, 2015 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is showcasing its latest products and technologies for mobile, wearable, and Internet-of-Things applications at Mobile World Congress Shanghai, July 15-17, 2015. ST designs, manufactures, and delivers solutions that help its Chinese customers transform the world for the better.

China is one of the world’s largest and most dynamic Mobile and IoT markets. According to IDC[1], 420.7 million smartphones were shipped to China in 2014 and the year-over-year growth for the smartphone market in China is … Read More → "STMicroelectronics Shows How to Transform Products to Suit Dynamic Mobile and IoT Markets in China"

LDRA Tool Suite Selected for Industry-Leading Structural Coverage and Standards Compliance

July 8, 2015

Wirral, U.K. July 8, 2015—LDRA, the leader in standards compliance, automated software verification, source code analysis and test tools, announces that Wind River® has selected the LDRA tool suite and DO-178 Qualification Support Packsfor both internal software quality assurance and to help Wind River customers expedite the qualification and certification of their aerospace and defense applications. The selection of LDRA hinged on the ability of its tools to achieve 100 percent MC/DC coverage at both source and assembler levels—a mandatory requirement for object code verification—and to perform data coupling … Read More → "LDRA Tool Suite Selected for Industry-Leading Structural Coverage and Standards Compliance"

STMicroelectronics Introduces First Automotive CAN ESD Protection Devices Compliant with All Key Interface Protocols

July 7, 2015

Geneva, July 7, 2015 – The continual introduction of new electronics-based features in cars, including various Advanced Driver Assistance Systems (ADAS), has led to a proliferation of communications protocols that offer different combinations of speed, cost, and flexibility.  Now, STMicroelectronics has introduced two new devices that combine superior protection of CAN (Controller Area Network) bus lines against electrostatic discharges and other transients and market-unique compliance with all key automotive interfaces.

The ESDCAN02-2BWY and ESDCAN03-2BWY are automotive-grade dual-line Transil™ devices that leverage ST’s long-term leadership in transient protection devices[1]and … Read More → "STMicroelectronics Introduces First Automotive CAN ESD Protection Devices Compliant with All Key Interface Protocols"

High Efficiency LTPoE++ PD Controllers Integrate Forward/Flyback Controller

July 7, 2015

MILPITAS, CA – July 7, 2015 – Linear Technology Corporation introduces the LT4276 LTPoE++™, PoE+ and PoE-compliant powered device (PD) interface controllers for applications requiring 2W to 90W of delivered power. The LT4276 integrates a PD controller and an isolated switching regulator controller, capable … Read More → "High Efficiency LTPoE++ PD Controllers Integrate Forward/Flyback Controller"

Sonics and AlphaChips Collaborate to Develop Advanced SoC Design Platforms

July 7, 2015

Milpitas, Calif. – July 7, 2015 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) technologies and services, today announced that it is collaborating with AlphaChips, a Korean semiconductor design services company, on the development of advanced SoC design platforms. Sonics will provide the SonicsGN® NoC for integration of semiconductor IP and consult with AlphaChips on the front-end RTL design flow for the SoC platforms. In addition, Sonics will work closely with AlphaChips on power management specification and implementation for the SoC platforms based on its recently introduced ICE-Grain™ Power Architecture. 

“We are excited … Read More → "Sonics and AlphaChips Collaborate to Develop Advanced SoC Design Platforms"

AUTOSAR Integrated With MOST® Infotainment and Advanced Driver Assistance Networking Technology

July 7, 2015

CHANDLER, Ariz., July 7, 2015 — Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that designers using the Automotive Open System Architecture (AUTOSAR) to develop and reuse their in-vehicle software can now connect their systems to not only networking technologies such as CAN and LIN, but also to the MOST® Cooperation’s automotive-proven MOST networking technology. This means that Microchip’s MOST Intelligent Network Interface Controllers (INICs) can be used for cross-domain communication in an AUTOSAR system, such as Advanced Driver Assistance Systems (ADAS), which simplifies automotive networking and diagnostics.

< … Read More → "AUTOSAR Integrated With MOST® Infotainment and Advanced Driver Assistance Networking Technology"

New Lightweight Terminations for Aerospace Reduce Weight up to 60 Percent

July 7, 2015

HARRISBURG, Pa. – July 7, 2015 – TE Connectivity (TE), a world leader in connectivity, announces its new COPALUM Lite sealed terminals and splices that provide up to 60 percent in weight savings versus copper terminal alternatives, and up to 53 percent weight savings versus drop-forged aluminum terminals. The new terminals feature the time-tested dry crimp technology that has provided three decades of reliable connectivity to the commercial aerospace industry. 

“Saving weight is always critical when designing interconnect solutions for aerospace applications,” said Steve McIntire, product manager, Global Aerospace, Defense & Marine, TE. “We’ve taken the time-tested COPALUM design and … Read More → "New Lightweight Terminations for Aerospace Reduce Weight up to 60 Percent"

Tektronix Showcases New and Enhanced Coherent Optical Test Solutions at ECOC 2015

July 7, 2015

BRACKNELL, UK – 6 July 2015 – Tektronix, the world’s leading manufacturer of oscilloscopes, announced today that the company will be showcasing a wide range of optical test and measurement products and solutions at ECOC 2015 (Stand 435) which takes place from 28 – 30 September 2015 in Valencia, Spain.

Tektronix will showcase a wide range of applications to test the world’s most complex components for coherent optical and communication design which include the following:

IAR Systems extends industry-leading Renesas RX tools with static code analysis

July 7, 2015

Uppsala, Sweden—July 7, 2015—IAR Systems presents version 2.80 of the complete C/C++ compiler and debugger toolchain IAR Embedded Workbench for RX. The new version adds integrated static code analysis through C-STAT, which makes it possible for RX developers to take full control of their code and enables companies to save valuable time and money in their development projects.

Static analysis finds potential issues in code by doing an analysis on the source code level. Such errors as memory leaks, access violations, arithmetic errors and array and string overruns can cause security issues and affect the performance and … Read More → "IAR Systems extends industry-leading Renesas RX tools with static code analysis"

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