News – Page 1243 – EEJournal

Solido Launches ML Labs

April 10, 2017

San Jose, CA – April 6, 2017 – Solido Design Automation, a leading provider of variation-aware design and characterization software, today announced the immediate launch of its Machine Learning (ML) Labs. Through this initiative, for the first time Solido is making its machine learning technologies and expertise developed over the past 12 years, in conjunction with its variation-aware design and characterization products, available to collaboratively work with semiconductor companies to develop new ML-based electronic design automation (EDA) products.

ML Labs enables semiconductor companies to work with Solido in developing ML-based EDA … Read More → "Solido Launches ML Labs"

ProTek Devices’ Steering Diode TVS Array Combo Component Protects Circuits in Consumer and Networking Electronics Interfaces

April 10, 2017

TEMPE, Ariz. – April 10, 2017 – ProTek Devices™ has introduced the PLR0502-6, an ultra-low capacitance (0.7pF typical) steering diode and transient voltage suppressor array (TVS array) combination component. It provides circuit protection in various consumer and networking applications, such as USB 1.0 to 3.1, HDMI 2.0 and 4K, DVI, IEEE 1394 FireWire, and Gigabit Ethernet.

The company’s new device specifically targets protection against electrostatic discharges (ESD) and electrical fast transients (EFT) for interfaces, wireless bus applications and portable electronics. against the effects of ESD and EFT. The PLR0502-6 meets a variety of IEC standards: 61000-4-2 (ESD) compliant for Air ±15kV … Read More → "ProTek Devices’ Steering Diode TVS Array Combo Component Protects Circuits in Consumer and Networking Electronics Interfaces"

AVX Releases Leadless Bidirectional ESD Suppression Diodes for High-Speed Circuit Protection

April 7, 2017

FOUNTAIN INN, S.C. (April 4, 2017) – AVX Corporation, a leading manufacturer and supplier … Read More → "AVX Releases Leadless Bidirectional ESD Suppression Diodes for High-Speed Circuit Protection"

CES 2017 Innovation Award honoree FIIL selects ams noise-cancelling technology for its stylish Diva Pro headphones

April 7, 2017

Premstaetten/Austria, Beijing/China (April 5, 2017) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions and FIIL, a Chinese designer and manufacturer of consumer audio products, announced today that ams noise-cancelling technology is an integral component in the FIIL Diva Pro high-end headphones, which recently won a CES 2017 Innovation Award.

The stylish Diva Pro headphones from FIIL offer an array of advanced features including touch control, motion sensing, My AudioFilter personalization and storage capacity for audio content. The Diva Pro headphones also offer excellent noise-cancellation capability, giving a comfortable, … Read More → "CES 2017 Innovation Award honoree FIIL selects ams noise-cancelling technology for its stylish Diva Pro headphones"

PICMG Announces The Ratification of COM0 R.3 for COM Express for Server Grade Performance

April 7, 2017

Wakefield, MA – Apr 05, 2017 – PICMG, a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open specifications, has announced the release of a high-performance revision that adds server-grade functionality to COM Express embedded computing systems. COM Express is widely used in Industrial Automation, Military/Aerospace, Gaming, Medical, Transportation, IoT, and other applications.

Revision 3.0 of COM Express provides for a new Type 7 connector and the addition of up to four 10 Gigabit Ethernet (10GbE) interfaces on the board. Previous revisions … Read More → "PICMG Announces The Ratification of COM0 R.3 for COM Express for Server Grade Performance"

Open-Silicon Unveils Industry’s Highest Performance Interlaken Chip-to-Chip Interface IP

April 7, 2017

Milpitas, CA – April 4, 2017 – Open-Silicon, a system-optimized ASIC solution provider and founding member company of the Interlaken Alliance, today announced its eighth-generation Interlaken IP core, supporting up to 1.2 Tbps high-bandwidth performance and up to 56 Gbps SerDes rates with Forward Error Correction (FEC). This high-speed chip-to-chip interface IP features an architecture that is fully flexible, configurable and scalable, making it ideal for highbandwidth networking applications, such as routers, switches, Framer/MAC, OTN switch, packet processors, traffic managers, look aside processors/memories, data center applications, and several other high-end networking and data processing applications.

Open Silicon’s 8th generation Interlaken … Read More → "Open-Silicon Unveils Industry’s Highest Performance Interlaken Chip-to-Chip Interface IP"

Microsemi and Athena Announce the TeraFire Hard Cryptographic Microprocessor for PolarFire “S Class” FPGAs, Providing Advanced Security Features

Powerful Data Security Technology Enables High Performance and Low Power for Communications, Defense and Industrial Applications

April 6, 2017

ALISO VIEJO, Calif., April 6, 2017 /PRNewswire/ — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, and The Athena Group, Inc. (Athena), a leading provider of security, cryptography, anti-tamper and signal processing intellectual property (IP) cores, today announced Athena’s TeraFire® cryptographic microprocessor … Read More → "Microsemi and Athena Announce the TeraFire Hard Cryptographic Microprocessor for PolarFire “S Class” FPGAs, Providing Advanced Security Features"

Pasternack Releases New Line of IQ Mixers with RF and LO Frequency Bands Ranging from 4 GHz to 38 GHz

April 6, 2017

IRVINE, Calif. – Pasternack, a leading provider of RF, microwave and millimeter wave products, has released six new IQ mixer models with RF and LO frequency bands ranging from 4 GHz to 38 GHz and In-Phase and Quadrature IF bandwidths ranging from DC to 4.5 GHz. Typical applications include point-to-point and point-to-multipoint radio, VSAT, Military Radar, EW, Satellite Communications, sensors, and test and measurement equipment.

Pasternack’s new Read More → "Pasternack Releases New Line of IQ Mixers with RF and LO Frequency Bands Ranging from 4 GHz to 38 GHz"

New Line of Peltier Modules Features Unique Construction that Delivers High Performance and Longer Life

April 6, 2017

TUALATIN, Ore. — April 5, 2017 — CUI’s Thermal Management Group today announced a new line of high performance Peltier modules that boasts superior performance and reliability, thanks to its innovative arcTEC™ structure. This unique construction utilizes a combination of thermally conductive resin between the ceramic and copper on the cold side of the module, high temperature solder, and larger P/N elements made from premium silicon ingot. The elasticity of arcTEC’s resin layer allows for thermal expansion and contraction during the repeated heating and cooling of normal operation, which reduces stress on the elements, resulting in a better thermal … Read More → "New Line of Peltier Modules Features Unique Construction that Delivers High Performance and Longer Life"

Artesyn Launches New COM Express Modules based on NXP QorIQ® T Series processors

April 6, 2017

Artesyn Embedded Technologies today announced a new series of COM Express^® embedded computing modules based on NXP QorIQ^® T Series processors. The Artesyn COMX-T Series brings four (NXP T1042) or eight virtual core (NXP T2081) Power Architecture™ processors, with a wide range of high speed interfaces, to a commercial off-the-shelf (COTS) … Read More → "Artesyn Launches New COM Express Modules based on NXP QorIQ® T Series processors"