News – Page 1242 – EEJournal

Keysight Technologies to Demonstrate NVMe, PCIe®, DDR, USB Test Solutions at IDF15

August 5, 2015

What:

Keysight will demonstrate the following solutions at the Intel Community Booths:

NVM Express

The Infiniium oscilloscope and compliance application, as part of Keysight’s solution suite, and the protocol analyzer and exerciser for PCIe^® testing. Demonstrations will focus on PCIe^® SFF-8639 (or U.2) testing supporting SSD drives

Speedgoat announces next generation Mobile real-time target machine

August 5, 2015

Liebefeld, Switzerland – (5 August 2015) Speedgoat today announced the release of the next generation Mobile real-time target machine.

This target machine acting as controller unit, together with Simulink Real-Time from MathWorks, provides engineers with the quickest path from Simulink® desktop to … Read More → "Speedgoat announces next generation Mobile real-time target machine"

New Small, Lightweight Contactors Handle Inrush Currents Up To 4000 AMPS

August 5, 2015

HARRISBURG, Pa. – Aug. 5, 2015 – TE Connectivity (TE), a world leader in connectivity, announces its new KILOVAC KHR500 (Bubba II) high-voltage, high-rupture, 600 AMP contactor that is smaller, lighter, and switches significantly higher power than its predecessor, the EV500 (Bubba I). It is capable of handling inrush currents as high as 4000 A. The new contactors are hermetically sealed for use in harsh and explosive environments.

“TE has always been focused on advancing SWaP (Size, Weight and Power) technology to help lower cost, reduce weight and size, and … Read More → "New Small, Lightweight Contactors Handle Inrush Currents Up To 4000 AMPS"

Wearable Impact and Health Monitor Wins element14’s Sudden Impact Challenge

August 4, 2015

August 4, 2015 – CHICAGO – A wearable impact and health monitor was named the winner in the “Sudden Impact” design competition, organized by the element14 Community. As part of the challenge, 12 individuals from around the world competed to develop wearable health solutions that can detect and even prevent sports-related injuries.

The winning design, created by element14 member Read More → "Wearable Impact and Health Monitor Wins element14’s Sudden Impact Challenge"

EMA Adds Industry First Bi-directional Interface Between OrCAD and Arena PLM

August 4, 2015

Rochester, NY (August 4, 2015) – EMA Design Automation® (ema-eda.com), a fullservice provider of Electronic Design Automation (EDA) solutions, and Arena Solutions, the pioneer of cloud-based Product Lifecycle Management (PLM) applications, today announced that Cadence® OrCAD® PCB (printed circuit board) design tools and the Arena cloud-based PLM system are now more comprehensively integrated.

“This new software integration is a result of the strategic alliance we announced at … Read More → "EMA Adds Industry First Bi-directional Interface Between OrCAD and Arena PLM"

New Cadence Joules RTL Power Solution Delivers 20X Faster Time-Based Power Analysis within 15 Percent Accuracy to Signoff

August 4, 2015

SAN JOSE, Calif., August 4, 2015?Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the Cadence® Joules? RTL Power Solution. This new register-transfer level (RTL) power analysis solution enables system-on-chip (SoC) design teams to analyze power consumption accurately during design exploration. Built on a multi-threaded architecture, the Joules RTL Power Solution delivers 20X faster time-based RTL power analysis when compared to other methods.

Incorporating rapid prototype technology from the Cadence Genus? Synthesis Solution engine, the Joules RTL Power Solution can analyze designs of up to 20 million instances overnight with gate-level accuracy within 15 percent of final power as signed off … Read More → "New Cadence Joules RTL Power Solution Delivers 20X Faster Time-Based Power Analysis within 15 Percent Accuracy to Signoff"

New Chip Inductors Offer Highest Inductance and Lowest DCR of any 0402-sized RF Choke

August 4, 2015

Cary, IL, USA – Developed for use in mobile devices and cellular infrastructure equipment,Coilcraft’s new 0402DF Series chip inductors offer higher inductance values and significantly lower DC resistance than other 0402-sized inductors, making them ideal for RF choke and filtering applications.

Micrium RTOS Kernels Support Xilinx’ All Programmable Zynq UltraScale+ MPSoC

August 4, 2015

Weston, Florida–August 4, 2015– Micrium today announced commercial real time operating system (RTOS) support for Xilinx’ new All Programmable Zynq® UltraScale+™ MPSoC. Micrium’s µC/OS-II®, µC/OS-III® kernels and full suite of RTOS components run on the ARM Cortex A53 and Cortex R5 CPUs as well as the Xilinx MicroBlaze™ FPGA-based soft processor core, enabling customers to select a single OS for all their embedded software needs on … Read More → "Micrium RTOS Kernels Support Xilinx’ All Programmable Zynq UltraScale+ MPSoC"

Advantech Launches Full Support of Microsoft Windows 10 Enabling the IoT

August 4, 2015

July 30, 2015, Irvine, CA – Advantech, a global leader in the embedded system market, is pleased to announce its support of the newly released Windows 10 IoT (Internet of Things). Windows 10 IoT will power a range of intelligent connected devices from smaller equipment such as gateways or mobile point-of-sale units, to industrial devices like robots and specialty medical equipment. Designed to connect through Azure IoT Services, Windows 10 IoT offers enterprise-grade security along with native connectivity for machine-to-machine and machine-to-cloud scenarios.

Connecting to Azure Cloud Services

Azure IoT Suite is an integrated offering that takes advantage of … Read More → "Advantech Launches Full Support of Microsoft Windows 10 Enabling the IoT"

Toshiba Develops World’s First 256Gb, 48-Layer BiCS FLASH

August 4, 2015

IRVINE, Calif., Aug. 3, 2015 — Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today unveiled the new generation of BiCS FLASH™, a three-dimensional (3D) stacked cell structure flash memory*1. The new device is the world’s first*2 256-gigabit (Gb *4) (32 gigabyte) 48-layer BiCS FLASH device and also deploys industry-leading 3-bit-per-cell TLC (triple-level cell) technology. Sample shipments will start in September.

BiCS FLASH is based … Read More → "Toshiba Develops World’s First 256Gb, 48-Layer BiCS FLASH"