News – Page 1234 – EEJournal

ST Unveils its DOCSIS 3.1 Chipset Solution, Opening Multi-Gigabit Era to Cable MSOs

August 4, 2015

Geneva, August 4, 2015 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the STiD325 (codenamed Barcelona), its DOCSIS^{^[1]} 3.1 chipset for Broadband CPE^{^[2]} Cable Modems, embedded Media Terminal Adapters (eMTAs), and Gateways, as well … Read More → "ST Unveils its DOCSIS 3.1 Chipset Solution, Opening Multi-Gigabit Era to Cable MSOs"

RTI Introduces First Edge-to-Cloud Connectivity Software for the Industrial Internet of Things (IIoT)

August 4, 2015

SUNNYVALE, Calif. – August 4, 2015— Real-Time Innovations (RTI), the Industrial Internet of Things connectivity platform company, today introduced Connext DDS 5.2, the first software solution to address application-to-application data exchange at both the network edge and in the cloud. The new version adds support for load balancing of analytics and transaction processing via a message queuing service. This allows IIoT service providers to take advantage of cloud elasticity to process more data and transactions while retaining low latency.

Connext DDS now supports all of the fundamental communication patterns used in the … Read More → "RTI Introduces First Edge-to-Cloud Connectivity Software for the Industrial Internet of Things (IIoT)"

Wind River Achieves CMMI Level 3 Appraisal for Automotive Expertise and Services

August 4, 2015

ALAMEDA, Calif. – Aug 4, 2015 – Wind River®, a global leader in delivering software for the Internet of Things (IoT), announced that it has been appraised at Level 3 of the CMMI Institute’s Capability Maturity Model Integration (CMMI)® for its worldwide Automotive Solutions & Professional Services.

Wind River completed a CMMI SCAMPI ‘A’ appraisal and achieved a CMMI Capability Level 3 in 18 process areas, resulting in a CMMI Maturity Level 3. This appraisal further builds on Wind River’s past CMMI Level 3 achievements; the first of which … Read More → "Wind River Achieves CMMI Level 3 Appraisal for Automotive Expertise and Services"

Synopsys and ASMedia Announce Industry’s First USB 3.1 Interoperability Demonstration

August 3, 2015

MOUNTAIN VIEW, Calif. and TAIPEI, Taiwan, Aug. 3, 2015 /PRNewswire/ —

Highlights:

Interoperability demonstration shows successful 10 Gbps USB 3.1 data transfers between the DesignWare USB 3.1 Device Controller IP and ASMedia USB 3.1 Host Controller IC
Demonstration validates the readiness of the DesignWare USB 3.1 Device Controller for integration into SoCs
ASMedia’s USB 3.1 Host Controller IC, the first USB-IF certified USB 3.1 product, provides a silicon-proven IC solution for USB 3.1
USB 3.1 specification delivers double the data throughput of SuperSpeed USB 3.0 for 10 … Read More → "Synopsys and ASMedia Announce Industry’s First USB 3.1 Interoperability Demonstration"

Avnet Electronics Marketing Releases New Zynq-7000 All Programmable SoC/Analog Devices Intelligent Drives Kit II

August 3, 2015

PHOENIX—August 3, 2015—Avnet Electronics Marketing, an operating group of Read More → "Avnet Electronics Marketing Releases New Zynq-7000 All Programmable SoC/Analog Devices Intelligent Drives Kit II"

Synopsys, UL to Reveal Details About Cybersecurity Assurance Program at CodenomiCON USA 2015

August 3, 2015

MOUNTAIN VIEW, Calif., Aug. 3, 2015 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) today announced that UL will present details about its Cybersecurity Assurance Program (CAP) at CodenomiCON USA, hosted by Synopsys at the House of Blues in Las Vegas, Nevada, on August 4. This presentation follows UL’s April announcement of a collaboration between UL and Codenomicon, a cybersecurity company Read More → "Synopsys, UL to Reveal Details About Cybersecurity Assurance Program at CodenomiCON USA 2015"

New congatec COM Express compact modules with Intel® Pentium® and Celeron® processors

August 3, 2015

San Diego, CA, July 30, 2015 * * congatec Inc., a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, announced the introduction of conga-TCA4, the company’s first COM Express compact module based on the new Intel® Pentium® and Celeron® processors (codenamed Braswell). Based on this new premium class low-power design, the robust COM Express modules consume on average just 4 watts while providing increased graphics capabilities and overall performance. Up to 16 graphics execution units can support up to three HD displays or two 4k displays and achieve a theoretical peak performance of 358.4 GFlops … Read More → "New congatec COM Express compact modules with Intel® Pentium® and Celeron® processors"

Industry’s first high-current PMBus converters with frequency synchronization reduce EMI

August 3, 2015

DALLAS (August 3, 2015) – Texas Instruments (TI) (NASDAQ: TXN) today introduced the industry’s first 20-A and 30-A synchronous DC/DC buck converters with frequency synchronization for low-noise and reduced EMI/EMC and a PMBus interface for adaptive voltage scaling (AVS). TI’s SWIFT™ 20-A TPS544B25 and 30-A Read More → "Industry’s first high-current PMBus converters with frequency synchronization reduce EMI"

New Safety-Documentation Package for STMicroelectronics STM8A Automotive Microcontrollers Streamlines ISO 26262 Certification

August 3, 2015

Geneva, August 3, 2015 – STMicroelectronics has published a safety manual and FMEDA^{^[1]} document that help streamline ISO 26262 functional-safety certification up to ASIL-B for systems containing its STM8AF automotive microcontrollers.

With valuable features including CAN and LIN drivers, touch-sense/LCD-control capability, ST’s AEC-Q100 qualified STM8AFseries is a popular and economical choice for body and infotainment applications such as seat adjusters, instrumentation, and lighting controllers. Recognizing that … Read More → "New Safety-Documentation Package for STMicroelectronics STM8A Automotive Microcontrollers Streamlines ISO 26262 Certification"

Realtek Accelerates System-on-Chip Verification with Cadence Palladium XP Platform

August 3, 2015

SAN JOSE, Calif., August 3, 2015? Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Realtek Semiconductor Corp. utilized the Cadence® Palladium® XP platform to accelerate the successful development and verification of a recent system-on-chip (SoC) design. With the Palladium XP platform, Realtek achieved up to 250X faster acceleration versus its previous methodology and was able to improve quality by executing system simulations six months before the silicon was available.

Due to the integrated nature of the Cadence System Development Suite, Realtek was able to save time by reusing over 90 percent of its simulation environment setup for Cadence Incisive® … Read More → "Realtek Accelerates System-on-Chip Verification with Cadence Palladium XP Platform"