News – Page 1210 – EEJournal

Cirrus Logic Accelerates Design of Next Generation Voice-Enabled Devices with Voice Capture Development Kit for Amazon Alexa Voice Service

Development Kit Offers Complete Low-Power, Two-Mic Solution to Deliver Superior Alexa Voice Interaction Experiences

July 7, 2017

AUSTIN, Texas – July 6, 2017 – Cirrus Logic (NASDAQ: CRUS), the audio and voice IC market leader, today introduced a development kit for Alexa Voice Service (AVS), optimized for smart speakers and smart home applications including voice controlled devices, hands-free portable speakers and networked speakers. With the Cirrus Logic IC and software design, the Voice Capture Development Kit for Amazon AVS helps manufacturers quickly get to market with new Alexa-enabled products that feature high-accuracy wake-word triggering and command interpretation even in noisy environments and during music playback.

The low power Voice Capture Development Kit for Amazon AVS includes a reference … Read More → "Cirrus Logic Accelerates Design of Next Generation Voice-Enabled Devices with Voice Capture Development Kit for Amazon Alexa Voice Service"

Premier Farnell launches free CAD library with TraceParts

The TraceParts CAD content platform initially includes 10,000 products from TE Connectivity

July 7, 2017

Premier Farnell, The Development Distributor, is partnering with Traceparts to provide CAD designs for 10,000 TE Connectivity products available to customers to download in multiple formats. Content provided within the library includes high-resolution images, technical documentation, attribution, features and benefits along with descriptions to assist customers with their design selection. Downloadable CAD files in multiple formats will include products from TE Connectively brands specifically; Alcoswitch, AMP, P&B, Raychem and Schrack, and new products will be added on a … Read More → "Premier Farnell launches free CAD library with TraceParts"

IAR Systems eases development for industrial applications based on Renesas’ EC-1

Quick start and simplified evaluation with IAR Embedded Workbench for ARM and complete starter kit for Renesas EtherCAT dedicated communication SoC

July 6, 2017

Tokyo, Japan / Uppsala, Sweden—July 6, 2017—IAR Systems®, a future-proof supplier of software tools and services for embedded development, today presents its tool solution for simplified evaluation and development of Renesas Electronics’ EC-1, a dedicated communication System on Chip (SoC) with a built-in EtherCAT® slave controller, intended to boost production efficiency in factories. In addition, IAR Systems announces that the company has joined EtherCAT Technology Group (ETG) to provide reliable solutions for industrial applications.

EtherCAT is one of the leading protocol standards in industrial networking applications … Read More → "IAR Systems eases development for industrial applications based on Renesas’ EC-1"

Fast 150V High Side N-Channel MOSFET Driver Provides 100% Duty Cycle Capability

July 6, 2017

MILPITAS, CA & NORWOOD, MA – July 6, 2017 – Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTC7001, a high speed, high side N-channel MOSFET driver that operates up to a 150V supply voltage. Its internal charge pump fully enhances an external N-channel MOSFET switch, enabling it to remain on indefinitely. The LTC7001’s powerful 1Ω gate driver can easily drive large gate capacitance MOSFETs with very short transition times and 35ns propagation delays, well suited for both high frequency switching and static switch applications.

The LTC7001 is designed to receive a ground-referenced, low voltage digital input signal … Read More → "Fast 150V High Side N-Channel MOSFET Driver Provides 100% Duty Cycle Capability"

Coventor Announces SEMulator3D 6.1 and New Analytics Capabilities

Coventor’s Virtual Fabrication Platform Provides Statistical Insight into Process Variation Challenges

July 5, 2017

CARY, NC– June 22, 2016 – Coventor®, Inc., the leading supplier of automated software solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced the availability of SEMulator3D® 6.1 – the latest version of its semiconductor virtual fabrication platform. This new version further increases the accuracy of the process simulation, geometry and modeling of advanced semiconductor processes with new features and usability enhancements. Along with SEMulator3D Version 6.1, Coventor is releasing an all-new SEMulator3D Analytics add-on component that automates statistical analysis of process variation directly from within … Read More → "Coventor Announces SEMulator3D 6.1 and New Analytics Capabilities"

Baidu Deploys Xilinx FPGAs in New Public Cloud Acceleration Services

Target applications to include machine learning and data security

July 5, 2017

SAN JOSE, Calif., July 5, 2017 /PRNewswire/ — Xilinx, Inc. (XLNX) today announced that Baidu has deployed Xilinx FPGA-based application acceleration services in their public cloud. The Baidu FPGA Cloud Server, a new service in Baidu Cloud, features highly efficient Xilinx® Kintex® FPGAs, tools, and the software needed to develop and deploy hardware-accelerated data center applications such as machine learning and data security.

“FPGAs have the capability to deliver significant performance for deep learning inference, security, and other high growth data center applications,” said Liu Yang, Head of Baidu Technical Infrastructure, Co-General Manager of Baidu Cloud. “Years of research and … Read More → "Baidu Deploys Xilinx FPGAs in New Public Cloud Acceleration Services"

RS Components launches latest high-end thermal imaging camera from Fluke to help maintenance engineers with problem detection

Offering host of leading-edge features, robust Fluke camera delivers precise and reliable information for engineers and technicians working in industry sectors including electrical, processing and manufacturing

July 5, 2017

OXFORD, UK, 4 July, 2017 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, has announced availability of the latest thermal imaging camera from the Ti range from Fluke, ( http://uk.rs-online.com/web/b/fluke ) a world leader in the manufacture, distribution and service of electronic test tools and software. The new Fluke Ti480 is a rugged 640 x 480-pixel thermal imaging camera that delivers precise and reliable information for engineers, enabling them to quickly and easily identify and diagnose potential problems before they become expensive failures.

Offering a number of high-end … Read More → "RS Components launches latest high-end thermal imaging camera from Fluke to help maintenance engineers with problem detection"

ams extends magnetic position sensors portfolio with automotive-grade and ISO26262 safety-compliant dual die integrated circuits

With dual-die redundancy, full data path diagnostics and enhanced self-test capabilities, the AS5270A/B position sensors enable automotive OEMs to comply with the highest safety standards

July 5, 2017

Premstaetten, Austria (5 July, 2017) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, announces a new series of magnetic position sensors with increased safety and diagnostic capabilities to help automotive OEMs achieve the highest in ISO26262 ASIL system safety-level compliance.

The AS5270A/B devices are ideal for many automotive applications including brake and gas pedals, throttle valve and tumble flaps, steering wheel position, chassis ride-height, Exhaust Gas Recirculation (EGR) valves, fuel-level measurement systems, and 2/4 wheel drive switching.

The new AS5270A and AS5270B system-on-chip (SOC) devices are 0 to 360o rotary magnetic … Read More → "ams extends magnetic position sensors portfolio with automotive-grade and ISO26262 safety-compliant dual die integrated circuits"

New Enhancements to Microsemi’s Imaging/Video Solution Enable Customers to Leverage Company’s Low Power and High Security FPGAs in MIPI CSI-2-Based Camera Systems

Upgraded Features Include New FMC-Based Daughter Card and IP to Support Image Sensors with MIPI CSI-2 Interfaces

July 3, 2017

ALISO VIEJO, Calif., June 27, 2017 /PRNewswire/ — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced new additions to its imaging/video solution supporting the popular Mobile Industry Processor Interface (MIPI) camera serial interface (CSI-2). The enhancements, including a new field programmable gate array (FPGA) mezzanine card (FMC)-based daughter card and new intellectual property (IP) which support image sensors with MIPI CSI-2 interfaces, enable customers to use the company’s power-efficient, highly secure IGLOO™2 FPGA and SmartFusion™2 system-on-chip (SoC) FPGA capabilities in CSI-2-based camera systems.

Incredibly Rugged RS485 Transceiver Meets IEC Level 4 ESD Standard

July 3, 2017

MILPITAS, CA & NORWOOD, MA – June 28, 2017 – Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTC2862A, an enhanced version of the widely accepted LTC2862 ±60V tolerant RS485/RS422 transceiver that released several years ago. Both of these half-duplex transceivers eliminate field failures without the need of costly external protection devices by protecting practical RS485 systems from installation cross-wiring faults, ground voltage faults or lightning induced surge voltages, which can cause overvoltage conditions that exceed the absolute maximum ratings of typical transceivers. Both devices operate from supply voltages of 3V to 5.5V while maintaining compliance with the TIA/ … Read More → "Incredibly Rugged RS485 Transceiver Meets IEC Level 4 ESD Standard"

featured blogs

Want to Build Your Own AI-Powered Perseverance Mars Rover?

Apr 2, 2026

Build, code, and explore with your own AI-powered Mars rover kit, inspired by NASA's Perseverance mission....