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RS Components adds IoT development solutions to portfolio with new Arrow SmartEverything boards

SmartEverything boards provide wireless support including LoRa communications for Internet of Things development
July 11, 2017

OXFORD, UK, 11 July 2017 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, is extending its portfolio of high-quality development boards with the introduction of two new SmartEverything solutions from Arrow. ( http://uk.rs-online.com/web/c/semiconductors/semiconductor-development-kits/radio-frequency-development-kits/?applied-dimensions=4293332331 ) The SmartEverything LION IoT development system-on-module (SoM) board and the SmartEverything ARIS IoT board both offer support for Internet of Things (IoT) application development.

The SmartEverything LION SoM board is based on an Arduino form-factor board that features a Microchip LoRa module, which enables low-data-rate communications to be made over … Read More → "RS Components adds IoT development solutions to portfolio with new Arrow SmartEverything boards"

Helix Semiconductors’ New eMpower HS100 Chipset Now Sampling

Enables End-to-End Efficiency of More Than 90 Percent
July 11, 2017

IRVINE, CA–(Marketwired – Jul 11, 2017) – Fabless power semiconductor company Helix Semiconductors today announced sampling of its eMpower HS100 chipset, its first production IC, which is a key piece in the company’s mission to address the overburdened nature of electricity grids around the globe. By enabling more than 90 percent end-to-end efficiency, the eMpower HS100 is an answer to the regulatory pressures being exerted by governments for more efficient power conversions.

Industry leaders have set an aggressive target for power consumed by electronic appliances when in an inactive, or standby, mode. Dubbed ‘Zero Power,’ the goal is specified as … Read More → "Helix Semiconductors’ New eMpower HS100 Chipset Now Sampling"

PiL P53 Hygienic Ultrasonic Sensors Mounting Kits Now Available with EHEDG Certification

Durable ultrasonic sensors & mounts for applications with demanding hygienic requirements
July 11, 2017

July 11, 2017 – Woodstock, GA

Hoffmann-Krippner today announced the availability of the EHEDG (European Hygienic Engineering and Design Group) certified hygienic mounting kit for PiL’s P53 “Steel Head” ultrasonic sensors. This new, off the shelf, hygienic sensor solution has been designed for the food and beverage sector and chemical and pharmaceutical industries – suitable for any manufacturing/assembly/bottling/packaging system that requires a clean and hygienic environment.

Consisting of half-shells, each with one opening to accommodate the sensor ends, these installation sets can be used to securely mount P53 sensors to walls or enclosures. FDA-approved, food-safe … Read More → "PiL P53 Hygienic Ultrasonic Sensors Mounting Kits Now Available with EHEDG Certification"

Extreme Sensitivity Occupancy and Non-Contact Respiration Sensors Benefit from Novelda’s Latest X4 UWB Radar SoC

Technology detects <1 mm movement and sees through walls and clothes for advanced home automation, health monitoring and elderly care applications
July 10, 2017

Oslo, Norway, 10th of July 2017 – Novelda, a developer and manufacturer of adaptive smart sensors, today announced two new modules – the X4M300 Presence Sensor for occupancy sensing and the X4M200 Respiration Sensor for non-contact respiration and vital-sign monitoring. Both modules benefit from improvements made by Novelda in the performance, integration and functional capability of its ultra-wideband impulse radar system-on-chip (SoC) design. These advances have also yielded a smaller-size, lower-power, lower-cost implementation that allows these modules to be readily deployed without needing to be an expert in radar or antenna design.

The latest X4 SoC, which operates … Read More → "Extreme Sensitivity Occupancy and Non-Contact Respiration Sensors Benefit from Novelda’s Latest X4 UWB Radar SoC"

Brewer Science Partners With Arkema to Develop High-Chi DSA Materials for Advanced Node Patterning

July 10, 2017

July 10, 2017 – Rolla, Missouri, USA – Brewer Science Inc. today announced from SEMICON West the extension of its partnership with Arkema to develop second-generation directed self-assembly (DSA) materials using high-x (chi) block copolymers. These new materials target advanced-node wafer patterning processes, because they enable even smaller feature sizes than first-generation DSA materials. As such, they provide a cost-effective solution to achieving device nodes down to 5nm and beyond, thereby enabling the continuation of Moore’s law.

“There have been very high expectations that DSA would solve all patterning issues,” said Darron Jurajda, Business Unit Manager, Brewer Science Inc. “Like … Read More → "Brewer Science Partners With Arkema to Develop High-Chi DSA Materials for Advanced Node Patterning"

Imec demonstrates Electrically Functional 5nm Solution for Back-End-of-Line

Imec pioneers in novel materials, process modules and architectures to solve future high-density interconnect challenges.
July 10, 2017

SAN FRANCISCO (USA), July 10, 2017 – At its annual Imec Technology Forum USA in San Francisco, imec, the world-leading research and innovation hub in nano-electronics and digital technology, today presented an electrically functional solution for the 5nm back-end-of-line (BEOL). The solution is a full dual-damascene module in combination with multi-patterning and multi-blocking. Scaling boosters and aggressive design rules pave the way to even smaller dimensions.

As R&D progresses towards the 5nm technology node, the tiny Cu wiring schemes in the chips’ BEOL are becoming more complex and compact. Shrinking the dimensions also reduces the wires cross-sectional area, driving … Read More → "Imec demonstrates Electrically Functional 5nm Solution for Back-End-of-Line"

u-blox announces world’s smallest LTE Cat M1/NB1 multimode module with global support for IoT and M2M applications

SARA R410M 02B is among the industry’s first multimode Cat M1 and NB1 solutions and includes software based global band configurability in a single hardware design
July 10, 2017

Thalwil, Switzerland – July 10, 2017 – u‑blox (SIX:UBXN), a global leader in wireless and positioning modules and chips, today announced the SARA‑R410M‑02B, a configurable LTE Cat M1/NB1 multi‑mode module with worldwide coverage. It is the industry’s smallest module available in the market today, measuring just 16 x 26 mm, to offer both LTE Cat M1 and Cat NB1 in a single hardware package, as well as software‑based configurability for all deployed bands. The SARA‑R410M‑02B multi‑mode global module supports ultra‑low power consumption and cost‑optimized solutions making it ideal for the … Read More → "u-blox announces world’s smallest LTE Cat M1/NB1 multimode module with global support for IoT and M2M applications"

AVX Releases New SPICE Models for its CapGuard™ Automotive & TransGuard® Automotive Series Varistors

The new SPICE models allow engineers to accurately simulate & fine-tune the performance of these protective parts in their circuits, enabling shorter, more cost-effective automotive device development cycles
July 10, 2017

FOUNTAIN INN, S.C. (July 10, 2017) – AVX Corporation, a leading manufacturer and supplier of passive components and interconnect solutions, has released new SPICE models for its CapGuard™ Automotive and TransGuard® Automotive Series multilayer varistors. Designed to enable shorter, more cost-effective development cycles with more first-pass prototype successes, SPICE models allow electronic design engineers to quickly, easily, and effectively evaluate the integrity of circuit designs, accurately simulate their performance, and identify and correct potentially problematic properties, including parasitic resistances and capacitances.

“The new SPICE models for our TransGuard and CapGuard Automotive Series varistors allow engineers to accurately estimate the … Read More → "AVX Releases New SPICE Models for its CapGuard™ Automotive & TransGuard® Automotive Series Varistors"

Industry’s Lowest Power Zero-Drift Op Amp Consumes only 1.3μA

July 10, 2017

MILPITAS, CA & NORWOOD, MA – July 10, 2017 – Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTC2063 zero-drift op amp which draws just 1.3μA typ (2μA max) on a 1.8V supply. This micropower amplifier maintains uncompromised precision: maximum input offset voltage is 5μV at 25°C, maximum drift is 0.06μV/°C from –40°C to 125°C. Maximum input bias current is 15pA at 25°C, and 100pA from –40°C to 125°C. These high precision input characteristics allow the use of large value feedback network resistors, keeping power consumption low without compromising accuracy, even at elevated temperature.

Rail-to-rail inputs and outputs … Read More → "Industry’s Lowest Power Zero-Drift Op Amp Consumes only 1.3μA"

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