industry news
Subscribe Now

Brewer Science Partners With Arkema to Develop High-Chi DSA Materials for Advanced Node Patterning

July 10, 2017 – Rolla, Missouri, USA – Brewer Science Inc. today announced from SEMICON West the extension of its partnership with Arkema to develop second-generation directed self-assembly (DSA) materials using high-x (chi) block copolymers. These new materials target advanced-node wafer patterning processes, because they enable even smaller feature sizes than first-generation DSA materials. As such, they provide a cost-effective solution to achieving device nodes down to 5nm and beyond, thereby enabling the continuation of Moore’s law.

“There have been very high expectations that DSA would solve all patterning issues,” said Darron Jurajda, Business Unit Manager, Brewer Science Inc. “Like all worthwhile technologies, there are many challenges to be solved before going into production. Leveraging our earlier DSA collaboration with Arkema offers the best path for implementing the next generation of materials. Together, we look forward to unlocking DSA’s full potential in accordance with industry timelines for manufacturing.”

High-chi block copolymers will further extend DSA’s advantages, achieving feature sizes that meet the requirements for 5nm and beyond. Extending their partnership allows these companies to build on their knowledge base, giving them a head start on developing high-chi materials.

As feature sizes shrink more aggressively with each node, it has become cost prohibitive to create them using existing patterning processes, such as EUV, self-aligned double patterning and self-aligned quad patterning. This presents a challenge for foundries and integrated device manufacturers preparing to ramp to 7nm and 5nm processes. DSA provides an alternative solution to achieving fine feature patterning; can be explored for minimal investment; and is cost efficient in final production. Development of high-chi materials also expands the opportunity for implementing DSA in other applications, including photonics, membrane applications and other areas of microelectronics.

The original collaboration between the two companies combined Brewer Science’s know-how in patterning and process integration with Arkema’s leading-edge expertise in block copolymer development to develop polystyrene-polymethyl methacrylate DSA materials, which are now production-ready to manufacture sub-22nm features.

About Brewer Science

Brewer Science is a global technology leader in developing and manufacturing innovative materials and processes for the reliable fabrication of cutting-edge microdevices used in electronics such as tablet computers, smartphones, digital cameras, televisions, LED lighting and flexible technology products. In 1981, Brewer Science revolutionized lithography processes with its invention of ARC® materials. Today, Brewer Science continues to expand its technology portfolio to include products enabling advanced lithography, thin wafer handling, 3D integration, and chemical and mechanical device protection and products based on nanotechnology. With its headquarters in Rolla, Missouri, Brewer Science supports customers throughout the world with a service and distribution network in North America, Europe and Asia. We invite you to learn more about Brewer Science at www.brewerscience.com, follow us on Twitter at @BrewerScience, like us on Facebook and subscribe to our blog.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Introducing Altera® Agilex 5 FPGAs and SoCs

Sponsored by Intel

Learn about the Altera Agilex 5 FPGA Family for tomorrow’s edge intelligent applications.

To learn more about Agilex 5 visit: Agilex™ 5 FPGA and SoC FPGA Product Overview

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

PIC® and AVR® Microcontrollers Enable Low-Power Applications
Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Amelia Dalton and Marc McComb from Microchip explore how Microchip’s PIC® and AVR® MCUs are a game changer when it comes to low power embedded designs. They investigate the benefits that the flexible signal routing, core independent peripherals, and Analog Peripheral Manager (APM) bring to modern embedded designs and how these microcontroller families can help you avoid a variety of pitfalls in your next design.
Jan 15, 2024
15,747 views