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AMD and Meta Announce Expanded Strategic Partnership to Deploy 6 Gigawatts of AMD GPUs

February 25, 2026

News Highlights

  • Meta is partnering with AMD to rapidly scale AI infrastructure and accelerate the development and deployment of cutting-edge AI models
  • AMD and Meta agree to a definitive multi-year, multi-generation partnership to deploy up to 6 gigawatts of AMD Instinct™ GPUs
  • Built on the AMD Helios rack-scale architecture announced at the 2025 Open Compute Project Global Summit, shipments to support the first gigawatt deployment are expected to begin in 2H 2026, … Read More → "AMD and Meta Announce Expanded Strategic Partnership to Deploy 6 Gigawatts of AMD GPUs"

Infineon presents microcontroller and sensor solutions for the future of AI, IoT, mobility, and robotics at embedded world 2026

February 24, 2026

Munich, Germany – 24 February 2026 – Next-generation embedded systems are essential for applications in the rapidly evolving connected world. They range from high-performance sensors for capturing critical data to advanced microcontrollers (MCUs) that process and analyze this data. At embedded world 2026, taking place from 10 to 12 March 2026 in Nuremberg, Germany, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will demonstrate how its innovative semiconductor solutions enable green and efficient energy, clean and safe mobility, and an intelligent and secured IoT. True to the motto “Driving decarbonization … Read More → "Infineon presents microcontroller and sensor solutions for the future of AI, IoT, mobility, and robotics at embedded world 2026"

STMicroelectronics’ new MasterGaN power ICs combine flexibility with advanced GaN technology

Target chargers and adapters for consumer electronics, industrial-lighting power supplies, and DC-to-AC solar micro-inverters
February 24, 2026

Geneva, Switzerland, February 24, 2026 — STMicroelectronics has introduced MasterGaN6, beginning the second generation of the MasterGaN half-bridge family. The new power system in package couples an updated BCD driver with a high-performance GaN power transistor that has just 140mΩ RDS(on).

Leveraging the high … Read More → "STMicroelectronics’ new MasterGaN power ICs combine flexibility with advanced GaN technology"

TASKING Integrates Modern AI Technology to Enable Robust Software Verification and Validation (V&V)

The TASKING toolchain now supports agentic AI workflows that allow OEMs and Tier 1 suppliers to further optimize the entire software development lifecycle of functionally safe and secure systems
February 24, 2026

MUNICH – February 24, 2026 – TASKING, a global leader in high-performance embedded software development tools, today announced enhancements to the TASKING toolchain … Read More → "TASKING Integrates Modern AI Technology to Enable Robust Software Verification and Validation (V&V)"

PLS’ UDE 2026 now also enables debugging of highly efficient embedded AI accelerators

February 24, 2026

Lauta (Germany), February 24, 2026 – The debug, trace, and test tool UDE® Universal Debug Engine 2026, presented by PLS Programmierbare Logik & Systeme at embedded world 2026 in Nuremberg in Hall 4, booth 4-310, now enables debugging, runtime monitoring, and validation of special, data flow-oriented algorithms, such as those currently incorporated into embedded AI applications. As part of a research project funded by the German Federal Ministry for Economic Affairs and Energy, PLS developed innovative tools for the Bosch Data Flow Architecture (DFA) and integrated them into UDE 2026.

The Bosch DFA is a highly parallel, dynamically configurable hardware accelerator that enables very … Read More → "PLS’ UDE 2026 now also enables debugging of highly efficient embedded AI accelerators"

Marvell to Showcase Latest AI Data Center Connectivity Solutions at DesignCon 2026

February 24, 2026

SANTA CLARA, Calif. – February 24, 2026 – Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced it will showcase its latest data center connectivity products and technologies driving the next wave of AI innovation at DesignCon 2026—February 24 to 26 at the Santa Clara Convention Center in Santa Clara, California.

The primary bottleneck in AI data center infrastructure has shifted from compute to connectivity. Data center operators require scalable, ultra-high performance connectivity solutions to address the massive growth of new, more demanding AI workloads. To meet this challenge, Marvell is … Read More → "Marvell to Showcase Latest AI Data Center Connectivity Solutions at DesignCon 2026"

Renesas R-Car V4H ADAS SoC Selected for Toyota RAV4 Model

February 24, 2026
  • Renesas ADAS automotive SoC, R-Car V4H has been selected for the TSS(LSS) control unit supplied by Denso for Toyota’s new RAV4 model
  • R-Car V4H performs core ADAS signal processing such as camera, radar sensing and Driver Monitor, supporting higher levels of vehicle safety

TOKYO, Japan, February 24, 2026―Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that its ADAS automotive system-on-chip (SoC), R-Car V4H, has been selected for the TSS(LSS) control unit used in Toyota Motor Corporation’s new RAV4 model, which debuted in … Read More → "Renesas R-Car V4H ADAS SoC Selected for Toyota RAV4 Model"

MIPI Alliance Releases UniPro v3.0 and M-PHY v6.0, Accelerating JEDEC UFS Performance for Edge AI in Mobile, PC and Automotive

New versions enable twice the previous data rate and gains in efficiency and scalability for flash storage applications
February 24, 2026

BRIDGEWATER, N.J., Feb. 24, 2026 – The MIPI Alliance, an international organization that develops specifications that standardize wired interfaces for mobile and other connected ecosystems, today announced major updates to two of its foundational specifications. MIPI … Read More → "MIPI Alliance Releases UniPro v3.0 and M-PHY v6.0, Accelerating JEDEC UFS Performance for Edge AI in Mobile, PC and Automotive"

Bourns Latest RF Inductors Deliver High Reliability from Advanced Multilayer Technology and Monolithic Construction

The four new multilayer chip inductor series are optimized for RF applications and deliver high-frequency performance with a compact, low‑profile design
February 23, 2026

RIVERSIDE, Calif., February 23, 2026 – Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today introduced four Multilayer Chip Inductor Series: the CE0603G</ … Read More → "Bourns Latest RF Inductors Deliver High Reliability from Advanced Multilayer Technology and Monolithic Construction"

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