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Aitech to Showcase Mission-Proven Edge-AI Computing Innovation and First-of-its-Kind IQSat PicoSat Configurator at Space Symposium

Edge-AI Computing Innovation Powering Next-Gen Missions and New IQSat Satellite Configurator Making Space-Based Intelligence More Accessible Take Center Stage
April 7, 2026

CHATSWORTH, Calif. – April 7, 2026 – Aitech, a global leader in AI-powered rugged embedded computing systems for defense and space applications, today announced it will showcase its latest space technologies at the Space Symposium in Colorado Springs, Colo. from … Read More → "Aitech to Showcase Mission-Proven Edge-AI Computing Innovation and First-of-its-Kind IQSat PicoSat Configurator at Space Symposium"

TDK launches ultra-small noise suppression filters for audio lines with high noise attenuation in the 5-GHz band

April 7, 2026
  • The filters achieve industry-leading* noise attenuation in the high-frequency range exceeding 5 GHz
  • A newly developed low-distortion ferrite material significantly reduces audio distortion by minimizing performance variations in the audio line of small consumer devices
  • Reduces attenuation of audio signals with lower resistance than conventional products, achieving a wide dynamic range

April 7, 2026

TDK Corporation (TSE:6762) has announced its latest noise suppression filters of the MAF0603GWY series. These measure only 0.6 mm x 0.3 mm x 0.3 … Read More → "TDK launches ultra-small noise suppression filters for audio lines with high noise attenuation in the 5-GHz band"

Intel Core Ultra Series 3 Computer-on-Modules from congatec are hardened for harsh environments within the industrial temperature range

Extraordinary AI performance from -40 to +85 °C for rugged applications
April 6, 2026

San Diego, CA, March 31, 2026 * * * congatec – a leading vendor of embedded and edge computing building blocks – is expanding its portfolio of Computer-on-Modules (COMs) with Intel Core Ultra Series 3 processors to include variants for the extended industrial temperature range of -40 °C to +85 °C. With up to 180 TOPS of energy-efficient embedded computing performance, this high-performance module family is now also available for use in particularly demanding environments in AI-intensive markets including industrial automation, robotics, medical, and retail point-of-sales.

Industry-leading COMs for extended requirements

With the support for … Read More → "Intel Core Ultra Series 3 Computer-on-Modules from congatec are hardened for harsh environments within the industrial temperature range"

CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics into 3D Stacking and Interposer for Next-Generation AI

The two flagship institutes of the French Alternative Energies and Atomic Energy Commission (CEA) are global innovation leaders in microelectronics and intelligent digital systems
April 6, 2026

GRENOBLE, France – April 3, 2026 – CEA-Leti, a world-leading micro & nanotechnologies research institute, and CEA-List, a specialist in smart digital systems, today announced a strategic collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC). The collaboration will leverage CEA-List’s RISC-V design expertise and CEA-Leti’s silicon photonics expertise to introduce high-bandwidth communication and high-efficiency computing technologies into PSMC’s established 3D stacking and interposer platforms to deliver solutions for next-generation artificial intelligence (AI) systems.

The semiconductor industry faces mounting challenges, including the physical limits of traditional copper interconnects, increasingly stringent power budgets, and the urgent need for flexible, scalable computing … Read More → "CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics into 3D Stacking and Interposer for Next-Generation AI"

Saelig Introduces Advanced AIM-TTi ADM1055

ADM1055 DMM delivers laboratory-grade performance suitable for research, production QA, and advanced electronics education.
April 3, 2026

Fairport, NY. Saelig Company, Inc. has introduced the Aim-TTi ADM1055 DMM, a next‑generation 5½‑digit bench multimeter engineered to deliver the measurement accuracy, flexible functionality, and seamless integration needed for development labs, production test environments, and educational establishments. The ADM1055 provides 0.02% basic DC accuracy, the precision needed for tasks such as device characterization, troubleshooting and teaching.  Measurement sensitivity is specified to 1uV, 1 mohm, 10 nA, 0.01Hz, and 100pF.

To support fast, intuitive operation, the ADM1055 features a full-color, user-friendly touchscreen interface, with multiple advanced display tools to help analyze results effectively: e.g. Bar … Read More → "Saelig Introduces Advanced AIM-TTi ADM1055"

DDC-I Announces Safety-Critical Multi-core RTOS for NXP S32G Network Application Processors

Deos RTOS running on S32G provides for the orchestration of high-speed multi-core application processing and coordination of data from multiple I/O interfaces used in safety critical systems
April 3, 2026

Phoenix, AZ – March 31, 2026. DDC-I, a leading supplier of software and professional services for mission- and safety-critical applications, today announced the availability of its Deos™  multi-core real-time operating system for the NXP S32G family of network application processors with verification evidence to DO-178C Design Assurance Level A (DAL A). Deos support extends and strengthens the S32G’s applicability in safety and mission critical military and aerospace markets. Use cases include control nodes, data transfer devices, and intelligent sensors.  

“The functionality, I/O and safety-critical requirements of automotive and … Read More → "DDC-I Announces Safety-Critical Multi-core RTOS for NXP S32G Network Application Processors"

Renesas’ Radiation‑Hardened ICs Take Flight on NASA’s Artemis II Crewed Lunar Mission

April 2, 2026

Düsseldorf, April 2, 2026 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced its radiation‑hardened (rad-hard) ICs are being used in NASA’s Artemis II mission, which successfully launched from the Kennedy Space Center in Florida on April 1. The first crewed mission around the moon in decades, Artemis II represents a major milestone in NASA’s plans to return humans to the moon … Read More → "Renesas’ Radiation‑Hardened ICs Take Flight on NASA’s Artemis II Crewed Lunar Mission"

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