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Samtec Offers Upscreen Testing to Speed Mil/Aero Time to Market

April 1, 2026

March 31, 2026 [New Albany, IN] — Samtec, Inc., the service leader in the connector industry, now offers in-house Upscreen Testing services to meet the highest levels of reliability assurance required for mission-critical applications. This new service is primarily designed for military and aerospace customers, and the testing is specifically designed for how customers use Samtec’s commercial off-the-shelf (COTS) interconnect products. Each order includes a full test report.

Comprehensive Testing

Upscreen testing at Samtec includes Lot Screen Testing (which incorporates electrical, mechanical, and manufacturing tests) and Qualification Conformance Testing (QCI; which includes lot screen testing … Read More → "Samtec Offers Upscreen Testing to Speed Mil/Aero Time to Market"

Mouser Now Shipping Microchip Technologies PIC32CM PL10 Arm Cortex -M0+ Based Microcontrollers for Industrial, Smart, and Consumer Applications

April 1, 2026

March 31, 2026 – Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now shipping the new PIC32CM PL10 low-power Arm® Cortex®-M0+ based microcontrollers (MCUs) from … Read More → "Mouser Now Shipping Microchip Technologies PIC32CM PL10 Arm Cortex -M0+ Based Microcontrollers for Industrial, Smart, and Consumer Applications"

EnSilica joins UK CHERI Adoption Collective to accelerate secure-by-design silicon

Part of a leading team of companies addressing the UK's £27bn cyber resilience challenge
March 31, 2026

Oxford, UK, March 31st, 2026: EnSilica, a leading maker of mixed-signal ASICs, has been selected to join the newly formed CHERI Adoption Collective, launched by PA Consulting in collaboration with the UK Department for Science, Innovation & Technology (DSIT).

CHERI (Capability Hardware Enhanced RISC Instructions) is a processor technology that enhances cybersecurity at the hardware level by enforcing memory safety. Memory-related vulnerabilities are responsible for around 70% of software security issues and underpin many severe cyber incidents. The Collective aims to address this by bringing together leading organisations across the energy, defence, telecommunications and semiconductor sectors to create a … Read More → "EnSilica joins UK CHERI Adoption Collective to accelerate secure-by-design silicon"

STMicroelectronics’ low-resistance MOSFETs save energy and PCB area in power distribution applications

New series leverages advanced Smart STripFET F8 power technology for best static performance and smaller die size
March 31, 2026

Geneva, Switzerland, March 31, 2026 — STMicroelectronics has introduced a series of low-RDS(on) MOSFETs made with new Smart STripFET F8 technology, which is engineered for optimum conduction performance and small die size. The devices target space-constrained applications including power distribution and battery management in automotive products.

The first device in the new series, the Read More → "STMicroelectronics’ low-resistance MOSFETs save energy and PCB area in power distribution applications"

Infineon launches industry‑first TLVR quad‑phase module exceeding 2 A/mm² for next‑generation AI compute

March 30, 2026

Munich, Germany – 26 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) unveils a high‑current‑density quad‑phase power module with TLVR (trans‑inductor voltage regulator) inductors to meet the power demand of advanced AI data centers. The TDM24745T is a new OptiMOS™ quad‑phase power module designed to meet the rapidly growing power requirements of next‑generation AI accelerators. Integrating four power stages, a TLVR inductor and decoupling capacitors into a compact 9 x 10 x 5 mm³ package. The module delivers … Read More → "Infineon launches industry‑first TLVR quad‑phase module exceeding 2 A/mm² for next‑generation AI compute"

HEAPGrasp: A Faster, Smarter Way for Robots to Handle Tricky Objects Using Only RGB Camera

Researchers develop a new approach that improves robots’ grasping success rate for transparent and shiny objects, beyond reducing handling time
March 30, 2026

The fields of manufacturing, logistics, and even restaurants are increasingly moving toward automation, with robots being employed for a wide range of tasks. One of the most critical applications of robots is material handling, where grippers are used to move objects, such as automotive parts, logistics packages, food ingredients, and restaurant dishes. This reduces the burden on human workers while lowering the risk of accidents, thereby improving workplace safety.

For robots to handle objects autonomously, they must first accurately measure the three-dimensional (3D) shape of the scene using cameras and … Read More → "HEAPGrasp: A Faster, Smarter Way for Robots to Handle Tricky Objects Using Only RGB Camera"

Fujitsu develops high-sensitivity, high-resolution infrared sensor to expand monitoring capabilities in defense and disaster prevention

World's first over 1-megapixel dual-band T2SL infrared sensor developed and delivered as part of research prototype for Acquisition Technology & Logistics Agency
March 30, 2026

KAWASAKI, Japan, Mar 27, 2026 – (JCN Newswire) – Fujitsu today announced the development of a world-leading, high-sensitivity and high-resolution infrared sensor to expand monitoring capabilities in the defense and disaster prevention fields. This sensor is a Type-II superlattice (T2SL) infrared sensor with over 1 million pixels, capable of detecting both mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) light. Its high-sensitivity allows it to clearly capture minute thermal differences of 0.05°C or less, enabling high-precision monitoring day and night. This over 1-megapixel dual-band T2SL infrared sensor is the first of its kind in the world.

The newly developed technology boasts … Read More → "Fujitsu develops high-sensitivity, high-resolution infrared sensor to expand monitoring capabilities in defense and disaster prevention"

Bourns Expands SSA-2 Series Analog Current Sensors with AEC-Q Compliant Assembly Option

New assembly option reduces qualification burden and compliance risk for engineers designing high-reliability power systems
March 30, 2026

RIVERSIDE, Calif., March 30, 2026 – Bourns today announced that its SSA-2 Series analog current sensors are now available with an AEC-Q compliant components assembly option. The addition targets engineers developing high-reliability power systems where component qualification is a formal requirement—giving them a path to AEC-Q compliance without rebuilding their qualification process from the ground up.

In automotive, industrial, and … Read More → "Bourns Expands SSA-2 Series Analog Current Sensors with AEC-Q Compliant Assembly Option"

Sivers Semiconductors Announces Availability of DaybreakTM 5G/6G Advanced ICs For Emerging FR3 Applications

7-15ghz Beamforming Chipsets Unlock $1.3B of New Emerging Serviceable Available Market (SAM) in Base Station and Consumer Premise Equipment (CPE) Segments
March 30, 2026

Kista, Sweden – March 30, 2026 – Sivers Semiconductors AB (STO:SIVE), a global leader in photonics and wireless technologies, today announced general availability of its 7-15GHz DaybreakTM beamforming ICs for emerging 5G/6G FR3 applications as well as multi-function defense arrays. FR3 frequencies are the next frontier for 5G-Advanced and 6G network deployments, combining the benefits of superior propagation at sub-6GHz and wider bandwidths at millimeter-wave frequencies.

While global standardization of … Read More → "Sivers Semiconductors Announces Availability of DaybreakTM 5G/6G Advanced ICs For Emerging FR3 Applications"

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