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Green Hills Software to Showcase and Present its Technology for Secure IoT Devices at ARM TechCon, Santa Clara, CA

SANTA BARBARA, CA — October 18, 2017 — Green Hills Software, the largest independent software vendor for the Internet of Things (IoT), will showcase its broad portfolio and forward-thinking technology for automotive electronics and secure IoT devices at ARM TechCon, October 25 – 27, 2017 at the Santa Clara Convention Center. Green Hills will be in booth #720 and provide executive meetings and product demonstrations.

Green Hills Software Sessions

Topic: Hack-proofing your C/C++ code</ … Read More → "Green Hills Software to Showcase and Present its Technology for Secure IoT Devices at ARM TechCon, Santa Clara, CA"

Synopsys and NXP Extend Multiyear Automotive Center of Excellence Collaboration for NXP S32 Automotive Processing Platform

MOUNTAIN VIEW, Calif., Oct. 18, 2017 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), today announced the extension of its multiyear Center of Excellence (CoE) program with NXP and availability of Virtualizer Development Kits (VDKs) for NXP S32 Automotive Processing Platform. VDKs, software development kits using a virtual prototype as the embedded target, enable … Read More → "Synopsys and NXP Extend Multiyear Automotive Center of Excellence Collaboration for NXP S32 Automotive Processing Platform"

STMicroelectronics Launches Open Development Platform for Secure Car-Connectivity Applications

Geneva, October 18, 2017 — The Modular Telematics Platform (MTP) from STMicroelectronics provides an open development environment for prototyping advanced Smart Driving applications, including vehicle connectivity to back-end servers, road infrastructure, and other vehicles. The MTP integrates a central processing module based on the just-launched Telemaco3P secure automotive-telematics processor and a comprehensive set of automotive-connectivity devices both on the board and in plug-in modules, ensuring development flexibility and extensibility.

The new Telemaco3P secure telematics processor is already making inroads with top OEMs and Tier1s around the globe. At the same time, the MTP can speed Telemaco3P … Read More → "STMicroelectronics Launches Open Development Platform for Secure Car-Connectivity Applications"

Achronix Speedcore Custom Blocks Supercharge Data Acceleration Systems

  • Speedcore custom blocks dramatically increase Speedcore eFPGA performance and reduce die area and power consumption
  • Fully supported in Achronix ACE design tools

Santa Clara, Calif., October 17th, 2017 – Achronix today announced the availability of Speedcore custom blocks for its eFPGA IP solutions. Achronix Speedcore eFPGAs accelerate data intensive AI / machine learning, 5G wireless, automotive ADAS, datacenter and networking applications. Speedcore custom blocks massively improve performance, power, and area; and enable functionality that has never before been possible in standalone FPGAs. With Speedcore custom blocks, customers gain ASIC efficiency while retaining FPGA flexibility, … Read More → "Achronix Speedcore Custom Blocks Supercharge Data Acceleration Systems"

Green Hills Software Contracts CERTON to Verify Conformance of Its INTEGRITY-178 tuMP Operating System to the FACE Technical Standard v2.1 for Intel, ARMv8 and PowerPC Architectures

SANTA BARBARA, CA — October 17, 2017 — Green Hills Software, the worldwide leader in high-assurance operating systems, today announced that it has contracted CERTON, a Cyient Company, to verify conformance of its INTEGRITY®-178 Time-Variant Unified Multi Processing (tuMP™) operating system with the Technical Standard for Future Airborne Capability Environment (FACE) edition 2.1. Green Hills Software and CERTON are verifying the Read More → "Green Hills Software Contracts CERTON to Verify Conformance of Its INTEGRITY-178 tuMP Operating System to the FACE Technical Standard v2.1 for Intel, ARMv8 and PowerPC Architectures"

CEVA and LG Electronics Partner for Smart 3D Camera Solution

MOUNTAIN VIEW, Calif., – October 17, 2017 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, announced today a partnership with LG Electronics, a global leader in consumer electronics and appliances, to deliver a high-performance, low-cost smart 3D camera solution for consumer electronics and robotic applications.
The 3D camera module incorporates a Rockchip RK1608 coprocessor with multiple CEVA-XM4 imaging and vision DSPs, which provide the processing power to perform a wide variety of 3D sensing applications. These include biometric face authentication, 3D reconstruction, … Read More → "CEVA and LG Electronics Partner for Smart 3D Camera Solution"

STMicroelectronics’ New Motor Driver with Embedded 32-Bit MCU Simplifies Motion Control for Battery-Operated Robots and Appliances

Geneva, October 17, 2017 — STMicroelectronics’ STSPIN32F0A programmable motor controller contains fully integrated gate drivers for three external MOSFET half-bridges, an STM32F0 microcontroller (MCU), as well as a 3.3V DC/DC switching converter plus a 12V LDO, giving designers flexible motor-control options in a lightweight and compact 7mm x 7mm outline. The 48MHz microcontroller, with 32Kbyte on-chip Flash, can run motor control algorithms such as 6-step sensorless, field-oriented control or position-sensed control, as well as the user application.

The STSPIN32F0A has an extended operating-voltage range from 6.7V to 45V and can run from batteries as … Read More → "STMicroelectronics’ New Motor Driver with Embedded 32-Bit MCU Simplifies Motion Control for Battery-Operated Robots and Appliances"

Spacecraft tech gets boost in reliability and connectivity

>Members of the media are invited to join TE Connectivity (TE), a world leader in connectivity and sensors, at Space Tech Expo Europe to experience TE’s breadth of solutions optimized for the rigors of space launch and spacecraft applications.

TE continually innovates its products to bring smaller, lighter connectivity solutions that are suited for the extreme conditions of space launch vehicles, spacecraft chassis, satellites, manned missions and deep space exploration.

Representatives from TE will be available at booth K42, Hall 5 throughout the show to answer questions and participate in interviews … Read More → "Spacecraft tech gets boost in reliability and connectivity"

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