industry news archive
Subscribe Now

ams audio chips offer world-class noise-cancelling performance in two new wireless headphones from trend-setter FIIL

Premstaetten, Austria (17 October, 2017) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today announced that headphone manufacturer FIIL is using two ams chipsets in its latest releases.

ams’ hybrid Active Noise Cancellation (ANC) audio IC, the AS3435, is used in the high performance Canviis Pro wireless on-ear headphones. In addition, ams’ AS3412 has been chosen for the Driifter Pro, one of the first neck-band-based Bluetooth in-ear ANC headphones of its kind. The AS3412 – which comes in a tiny WL-CSP – is ideally suited for this audio application because of the headphones’ … Read More → "ams audio chips offer world-class noise-cancelling performance in two new wireless headphones from trend-setter FIIL"

Saelig Introduces SAM40 24-Bit Data Acquisition for HDO Oscilloscopes

Fairport, NY: Saelig Company, Inc. announces the availability of the Teledyne LeCroy SAM40 Data Acquisition Unit which provides up to 24 analog or digital input channels for low frequency (e.g. sensor signal) acquisition and analysis when connected to a 4 or 8 channel Teledyne L
eCroy 12-bit resolution high definition oscilloscope. This capability is ideal for system debug and analysis of motors and drives, power products, appliances, Internet of Things (IoT), vehicle/automotive devices, and other Read More → "Saelig Introduces SAM40 24-Bit Data Acquisition for HDO Oscilloscopes"

Microsemi’s Lowest Power, Cost-Optimized Mid-Range PolarFire FPGAs Achieve Key Milestone by Passing PCI SIG’s PCIe Endpoint Compliance Suites

ALISO VIEJO, Calif., Oct. 17, 2017 — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its PolarFire™ field programmable gate arrays (FPGAs) have achieved a key milestone by passing the Peripheral Component Interconnect Special Interest Group’s (PCI SIG’s) PCIe endpoint compliance suites, working at 5 Gbps. This certifies the product has passed rigorous testing of the compliance workshop, with the PolarFire FPGAs now included in the organization’s coveted integrators list.

Microsemi’s PolarFire FPGA devices feature 12.7 … Read More → "Microsemi’s Lowest Power, Cost-Optimized Mid-Range PolarFire FPGAs Achieve Key Milestone by Passing PCI SIG’s PCIe Endpoint Compliance Suites"

OmniVision Unveils Groundbreaking Nyxel™ Near-Infrared Technology for Machine-Vision and Night-Vision Applications

SANTA CLARA, Calif. – October 9, 2017 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today introduced Nyxel™, a revolutionary near-infrared (NIR) technology that leverages novel silicon semiconductor architectures and processes to tackle challenges that plague existing approaches to NIR detection in image sensors. The result is an increase in quantum efficiency (QE), of up to 3x at 850nm and 5x at 940nm, when compared with our legacy NIR-capable sensors. These improvements in NIR sensitivity enable the image sensor to see better and farther under the same amount of light, extending the image detection range. Conversely, … Read More → "OmniVision Unveils Groundbreaking Nyxel™ Near-Infrared Technology for Machine-Vision and Night-Vision Applications"

Renesas Electronics Enables Long-Term Support for Embedded Industrial Linux Developers with New RZ/G Linux Platform

SANTA CLARA, Calif., October 16, 2017 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the Renesas RZ/G Linux Platform featuring the industrial-grade  Read More → "Renesas Electronics Enables Long-Term Support for Embedded Industrial Linux Developers with New RZ/G Linux Platform"

STMicroelectronics’ Advanced Automotive Processors with Built-In Security Set to Protect Connected Cars against Cyber Threats

New processors combine ST’s automotive and security expertise to meet demanding safety, reliability, and quality standards
Market’s first implementation of dedicated, isolated Hardware Security Module (HSM) on an automotive microprocessor provides state-of-the-art security on-chip

Geneva, October 16, 2017 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is leading the race to protect connected cars against cyber threats with its latest automotive processors that feature a dedicated, built-in security module.

Millions of connected cars are already on the road, and industry analysts predict there will be more than 250 … Read More → "STMicroelectronics’ Advanced Automotive Processors with Built-In Security Set to Protect Connected Cars against Cyber Threats"

KDPOF Provides Optical Connectivity for Smart Antenna Modules

Madrid, Spain, October 11, 2017 – KDPOF – leading supplier for automotive gigabit connectivity over POF (Plastic Optical Fiber) – now provide their optical connectivity technology for Integrated Smart Antenna (ISA) Modules. An ISA consists of several antennas for signal reception, an Antenna Hub, and an Ethernet connection to the consumers of the antenna signals such as a radio device. If each of the several antennas in a car is routed to its respective ECU with its own cable, soon the complexity will be unacceptable. The Antenna Hub routes all signals from each antenna to an Ethernet network connected to all receptors of the … Read More → "KDPOF Provides Optical Connectivity for Smart Antenna Modules"

Accellera Systems Initiative advances the SystemC ecosystem with a new core language library

Elk Grove, Calif., October 16, 2017 – Accellera Systems Initiative announces a new library release for the SystemC core language (SystemC 2.3.2, including TLM 2.0.4). Ratified as IEEE Std. 1666-2011 “Standard SystemC Language Reference Manual,” SystemC is a high-level language used in the design and development of electronic and embedded systems. The SystemC 2.3.2 proof of concept library is an update to the standard that was released in 2011 which included transaction-level modeling.  The new library is fully compatible with IEEE Std. 1666-2011 and is available at Read More → "Accellera Systems Initiative advances the SystemC ecosystem with a new core language library"

featured blogs
Apr 2, 2026
Build, code, and explore with your own AI-powered Mars rover kit, inspired by NASA's Perseverance mission....