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New Silicon Labs Wi-Fi Devices for the IoT Slash Power Consumption in Half

NUREMBERG, Germany (Embedded World) – Feb. 27, 2018 – Silicon Labs (NASDAQ: SLAB) has introduced a new Wi-Fi® portfolio to simplify the design of power-sensitive, battery-operated Wi-Fi products including IP security cameras, point-of-sale (PoS) terminals and consumer health care devices. Optimized for exceptional energy efficiency, the WF200 transceivers and WFM200 modules support 2.4 GHz 802.11 b/g/n Wi-Fi while delivering the high performance and reliable connectivity … Read More → "New Silicon Labs Wi-Fi Devices for the IoT Slash Power Consumption in Half"

Riot Micro and Amarisoft Demonstrate NB-IoT/LTE-M Module Reference Design at Mobile World Congress

MOBILE WORLD CONGRESS, Barcelona, Spain – February 26, 2018 – Riot Micro, a start-up providing purpose-built silicon for IoT systems, and telecom software vendor Amarisoft will demonstrate a low-power dual-mode NB-IoT and LTE-M module reference design at Mobile World Congress in Barcelona this week (booth H5-K13). The demonstration will feature Riot’s RM1000 module design and Amarisoft’s AMARI LTE 100 software running on a compact software defined radio (SDR) platform.

Riot’s module reference design is based on the RM1000 NB-IoT baseband modem and integrates all of the circuitry required to implement NB-IoT and LTE-M into … Read More → "Riot Micro and Amarisoft Demonstrate NB-IoT/LTE-M Module Reference Design at Mobile World Congress"

Renesas Electronics Shortens Evaluation Time of Industrial Networking Applications with RZ/N1L Solution Kit for Remote IO and Communication Modules

TOKYO, Japan, February 26, 2018 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced its latest solution kit based on the RZ/N1L Group of microprocessors (MPUs). In addition to theRead More → "Renesas Electronics Shortens Evaluation Time of Industrial Networking Applications with RZ/N1L Solution Kit for Remote IO and Communication Modules"

Intel Ships Industry’s First 58G PAM4-Capable FPGA Built for Multi-Terabit Network Infrastructure and NFV

Intel today announced it has begun shipping its Intel® Stratix® 10 TX FPGAs, the industry’s only field programmable gate array (FPGA) with 58G PAM4 transceiver technology. By integrating the FPGA with 58G PAM4 technology, Intel Stratix 10 TX FPGAs can double the transceiver bandwidth performance when compared to traditional solutions. This exceptional bandwidth performance makes the Intel Stratix 10 TX FPGAs the essential connectivity solution for next-generation use cases: optical transport networks, network function virtualization (NFV), enterprise networking, cloud service providers and 5G networks applications where high bandwidth is paramount.

To facilitate the future of networking, NFV and optical … Read More → "Intel Ships Industry’s First 58G PAM4-Capable FPGA Built for Multi-Terabit Network Infrastructure and NFV"

Suprema to showcase AI based in-display fingerprint algorithm and 3D facial recognition solution at MWC 2018

– BioSign 3.0, now supports in-display fingerprint sensors
– LookSign, 3D facial recognition solution for smartphones

Feb 22, 2018 – (ACN Newswire) – Suprema, a global leader in biometrics and ID solutions, announced that the company will showcase BioSign 3.0, an AI based in-display fingerprint authentication algorithm and LookSign, a 3D facial recognition solution at Mobile World Congress 2018 in Barcelona on February 26.

Featured in Samsung Galaxy J5 2017 smartphones, Suprema BioSign is now far enhanced leveraging Suprema’s proprietary AI technology. Coupled with LookSign, the company’s latest 3D facial recognition solution, Suprema plans to penetrate next generation premium smartphone market.

Read More → "Suprema to showcase AI based in-display fingerprint algorithm and 3D facial recognition solution at MWC 2018"

Express Logic’s X-Ware IoT Platform® Delivers Seamless Connectivity to Alibaba, Amazon Web Services (AWS), Baidu, Google Cloud Platform, IBM Cloud, Microsoft Azure, Oracle Cloud, Tencent, and Xively

Nuremberg, Germany,  February 26, 2018 — Express Logic, provider of the comprehensive X-Ware IoT Platform® powered by the industry leading ThreadX® RTOS, announced today turnkey support for all the leading cloud providers. Among this group are Alibaba, Amazon Web Services (AWS), Baidu, Google Cloud Platform, IBM Cloud, Microsoft Azure, Oracle Cloud, Tencent, and Xively. Designed from the ground up to be industrial grade, and developed entirely in-house by Express Logic engineers, the X-Ware IoT Platform leverages its size, performance, safety, security, ease of use, and other advanced … Read More → "Express Logic’s X-Ware IoT Platform® Delivers Seamless Connectivity to Alibaba, Amazon Web Services (AWS), Baidu, Google Cloud Platform, IBM Cloud, Microsoft Azure, Oracle Cloud, Tencent, and Xively"

Irresistible Materials Ramps Up Production of Breakthrough EUV Photo-Resist and Spin-on-Carbon Materials

BIRMINGHAM, UK and Westwood, Mass. — Feb. 26, 2018 — Irresistible Materials (IM), a UK based materials technology company, announced today that it has increased production capacity by 10 fold in readiness for the commercial launch of its EUV photo-resist and spin-on-carbon materials.  First launched at SPIE 2017, IM’s breakthrough Multi-Trigger Resist delivers high performance for Resolution, Sensitivity and Line Edge Roughness, as validated by recent tests on NXE exposure tools at IMEC.

“Due to intense customer interest in 2017, IM has shifted its focus to pilot-scale production to provide samples for pre-production … Read More → "Irresistible Materials Ramps Up Production of Breakthrough EUV Photo-Resist and Spin-on-Carbon Materials"

Rohde & Schwarz and CommSolid present world’s first test solution for 3GPP Release 14 location services for NB-IoT

Rohde & Schwarz and CommSolid have successfully completed the verification of 3GPP Release 14 location services (LCS), which is one of the new positioning technologies for NarrowBand-IoT (NB-IoT). The Cat-NB2 verification was performed with CommSolid’s NB-IoT modem solution against the R&S CMW500 mobile communication tester. The R&S Location Based Services (LBS) solution based on R&S CMWcards GUI, a subset of TS-LBS, allows the verification of chipsets and mobile devices for mobile manufacturers, chipset manufacturers, test houses and network operators with the target to get permission to operate them in a particular network.

< … Read More → "Rohde & Schwarz and CommSolid present world’s first test solution for 3GPP Release 14 location services for NB-IoT"

Synopsys Delivers Industry’s First Complete UFS 3.0 IP Solution for High-Performance Embedded and Removable Storage

MOUNTAIN VIEW, Calif., Feb. 26, 2018 /PRNewswire/ —

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