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MaxLinear Strengthens Wireless Transport Product Portfolio with 5Gbps, 16K QAM-based Microwave Modem SoC

The MxL85670 supports the highest throughput bit rates for microwave point-to-point wireless transport products
February 26, 2018

BARCELONA – MOBILE WORLD CONGRESS – Feb. 26, 2018 – MaxLinear, Inc. (NYSE:MXL), a leading provider of radio frequency (RF), analog and mixed-signal integrated circuits for the connected home, wired and wireless infrastructure, and industrial and multimarket applications, today announced the MxL85670 baseband system on-chip (SoC) for wireless microwave transmission systems.

With its exceptional 5Gbps wireless throughput, the MxL85670 sets a new microwave industry bar for high capacity and provides a flexible solution that meets the evolving demands of backhaul and fronthaul for 5G networks.

Read More → "MaxLinear Strengthens Wireless Transport Product Portfolio with 5Gbps, 16K QAM-based Microwave Modem SoC"

DoD-compliant Removable Storage Module Added to Aitech’s Low Power, High Performance Rugged Compact PC (RCP)

New A172 also incorporates expanded data protection features, additional customization options
February 26, 2018

Technical Specifications

  • Removable mass storage offers quick/secure erase (DoD 5220.22-M) and unrecoverable data destruct
  • SWaP-optimized at less than 5 lbs (2.25 kg) in compact, low-profile housing
  • Added reliability features include TPM and 50 ms power holdup options
  • Available in standard models or cost-effectively customized for specific applications

Chatsworth, Calif. February 2018 – Aitech Defense Systems Inc. now offers its A172, a Read More → "DoD-compliant Removable Storage Module Added to Aitech’s Low Power, High Performance Rugged Compact PC (RCP)"

STMicroelectronics and USound Demonstrate Immersive Listening Experiences with Advanced Micro-Speakers in 3D-Sound Headphones at MWC 2018

February 26, 2018

 

  • MEMS speakers developed by USound and manufactured by STMicroelectronics combine minuscule size, low profile, and high efficiency enabling multiple speakers in wearable form factors
  • Headphone demonstration shows how hardware-based 3D-audio, enabled by these tiny speaker units, boosts augmented/virtual reality
Geneva, Switzerland, and Graz, Austria, February 26, 2018 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is to host USound, … Read More → "STMicroelectronics and USound Demonstrate Immersive Listening Experiences with Advanced Micro-Speakers in 3D-Sound Headphones at MWC 2018"

STMicroelectronics Powers Next-Generation IoT Devices with Higher-Performing Multiprotocol Bluetooth® & 802.15.4 System-on-Chip

February 23, 2018
  • Fusion of 32-bit ultra-low-power microcontroller and highly integrated Bluetooth 5 (BLE) and IEEE 802.15.4 radio creates high-performing wireless platform for feature-rich smart connected objects
  • Dual Arm® Cortex®-M cores individually dedicated to device operation and wireless communication ensure smoother user experience
  • Compatibility with proven STM32 ecosystem brings developer advantages and faster time to market

CEVA Introduces PentaG™ – A Comprehensive 5G New Radio Enhanced Mobile Broadband IP Platform for Smartphones, Fixed Wireless Access and Embedded Devices

February 23, 2018
  • 3GPP Rel-15 compliant platform lowers high entry barriers for 5G modem design, with fast time-to-market and minimal risk
  • Composed of combination of special purpose DSPs and specialized acceleration co-processors, delivering up to 8x performance improvement for 5G functions compared to conventional approaches
  • Incorporates an innovative AI processor using machine learning techniques to achieve optimal modem throughput
  • Modular platform architecture allows customers to combine incumbent technologies together with PentaG modules, to tailor design to their specific enhanced mobile broadband (eMBB) use case

Ellisys Increases Support for Bluetooth® Mesh Networking on Protocol Solutions

Newest Advancement in Bluetooth Technology Targets IoT
February 23, 2018

GENEVA, Feb. 22, 2018 (GLOBE NEWSWIRE) — Ellisys, a leading worldwide provider of Bluetooth®, Wi-Fi®, and Universal Serial Bus (USB) protocol test, analysis, and qualification solutions, today announced a major addition to its feature support for the recently released Bluetooth Mesh Networking specifications on its industry-leading Bluetooth all-in-one protocol analysis platforms.  This added support provides timely updates to the company’s widely deployed Bluetooth Explorer™ and Bluetooth Tracker™ products and includes specialized analytical and performance characterizations of mesh network profiles, properties, security and privacy mechanisms, and system operation.  Mesh networking is a many-to-many (m:m) range extension … Read More → "Ellisys Increases Support for Bluetooth® Mesh Networking on Protocol Solutions"

Industry’s smallest 36-V, 1-A DC/DC step-down power module shrinks board space by up to 58 percent

Modules from Texas Instruments feature tiny MicroSiP packaging and achieve up to 92 percent efficiency
February 23, 2018

DALLAS (Feb. 23, 2018) – Texas Instruments (TI) (NASDAQ: TXN) today introduced two new 4-V to 36-V power modules that measure just 3.0 mm by 3.8 mm and require only two external components for operation. The 0.5-A LMZM23600 and 1-A LMZM23601 DC/DC step-down converters achieve up to 92 percent efficiency, which minimizes energy loss, and feature tiny MicroSiP™ packaging that shrinks board space by up to 58 percent. The converters expand TI’s power module portfolio to address up to 1-A performance-driven, space-constrained … Read More → "Industry’s smallest 36-V, 1-A DC/DC step-down power module shrinks board space by up to 58 percent"

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