Brewer Science’s New OptiLign™ DSA Product Family Provides a Cost-Effective Alternative for Advanced-Node Wafer Patterning
Rolla, Missouri – Feb. 27, 2018 – Brewer Science, Inc., today from SPIE Advanced Lithography 2018 introduced its OptiLign™ commercial-quality directed self-assembly (DSA) material set developed in collaboration with Arkema. The OptiLign … Read More → "Brewer Science’s New OptiLign™ DSA Product Family Provides a Cost-Effective Alternative for Advanced-Node Wafer Patterning"
Coventor Adds Device Analysis Capabilities to SEMulator3D 7.0
CARY, NC– February 26, 2018 – Coventor, Inc., a Lam Research Company, the leading supplier of design automation solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced the availability of SEMulator3D® 7.0 – the newest version of its semiconductor virtual fabrication platform. With added features, performance improvements, and a new Device Analysis capability, SEMulator3D 7.0 addresses both process and device simulation while lowering the barriers to advanced semiconductor technology development. The new Device Analysis capability enables seamless understanding of how process changes, process … Read More → "Coventor Adds Device Analysis Capabilities to SEMulator3D 7.0"
GreenWaves Technologies Unveils GAP8, the Industry’s Lowest Power IoT Application Processor, Enabling Groundbreaking Embedded Artificial Intelligence at the Very Edge
Grenoble, France, Feb. 26, 2018 – GreenWaves Technologies, a fabless semiconductor startup designing disruptive ultra-low power embedded solutions for image, sound and vibration AI processing in sensing devices, today announced its GAP8 IoT application processor and the availability of the GAP8 Software Development Kit. GAP8 evaluation boards can be pre-ordered at Read More → "GreenWaves Technologies Unveils GAP8, the Industry’s Lowest Power IoT Application Processor, Enabling Groundbreaking Embedded Artificial Intelligence at the Very Edge"
Imec and Cadence Tape Out Industry’s First 3nm Test Chip
LEUVEN, Belgium and SAN JOSE, Calif., February 28, 2018—The world-leading research and innovation hub in nanoelectronics and digital technologies, imec, and Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its extensive, long-standing collaboration has resulted in the industry’s first 3nm test chip tapeout. The tapeout project, geared toward advancing 3nm chip design, was completed using extreme ultraviolet (EUV) and 193 immersion (193i) lithography-oriented design rules and the Cadence® Innovus™ Implementation System and Genus™ Synthesis Solution. Imec utilized a common industry 64-bit CPU for the test chip with a … Read More → "Imec and Cadence Tape Out Industry’s First 3nm Test Chip"
PoLTE Collaborates with Sequans to Develop Next Generation Location Positioning Solution for IoT
DALLAS, February 22, 2018 – PoLTE Corporation today announced a new initiative with Read More → "PoLTE Collaborates with Sequans to Develop Next Generation Location Positioning Solution for IoT"
Altium Showcases TASKING Toolset and LAPACK Performance Libraries for Infineon at Embedded World
San Diego, Calif. – 27 February 2018 – Altium, a global provider of embedded software tools for automotive technology, is excited to showcase the full TASKING Toolset at Embedded World this month in Nuremberg, Germany. TASKING focuses on providing a full set of embedded software development tools for safety-critical, real-time, multicore applications in the automotive, agricultural and industrial markets.
TASKING has expanded its development toolset to meet customers’ needs with tools that improve code generation, enhance use of multicore hardware, and most importantly, fulfill safety requirements. From the compiler and … Read More → "Altium Showcases TASKING Toolset and LAPACK Performance Libraries for Infineon at Embedded World"
Low-Cost Debugging and Programming is Now Faster and More Feature Rich with MPLAB® PICkit™ 4 Development Tool
CHANDLER, Ariz., Feb 27, 2018 — The debugging process remains an important area where many embedded design engineers would like to see improvements, according to AspenCore’s 2017 Embedded Market Study. To address these needs and enhance the development experience, Microchip Technology Inc. (NASDAQ: MCHP) introduces the MPLAB® PICkitTM 4 In-Circuit Debugger. The low-cost PICkit 4 in-circuit programming and debugging development tool is … Read More → "Low-Cost Debugging and Programming is Now Faster and More Feature Rich with MPLAB® PICkit™ 4 Development Tool"
New modular 10GbE micro server carrier board from congatec in the Mini-STX form factor
Renesas Synergy™ Strengthens Chip-to-Cloud IoT Connectivity with New Enterprise Cloud Toolbox
TOKYO, Japan, February 27, 2018 — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the new Renesas Synergy™ Enterprise Cloud Toolbox v1.1 — a software Application Project that together with the Synergy AE-CLOUD1 kit provides a reference design and starting point for users to connectin 10 minutes or less to enterprise clouds such as Microsoft Azure™, Amazon Web Services™, … Read More → "Renesas Synergy™ Strengthens Chip-to-Cloud IoT Connectivity with New Enterprise Cloud Toolbox"
