News – Page 1108 – EEJournal

Synopsys Introduces Breakthrough Fusion Technology to Transform the RTL-to-GDSII Flow

Fusion of Best-in-Class Optimization and Industry-golden Signoff Tools Delivers Best Full-flow Quality-of-Results and Fastest Time-to-Results

March 20, 2018

MOUNTAIN VIEW, Calif., March 19, 2018 /PRNewswire/ —

Highlights:

Fusion Technology redefines conventional design tool boundaries, sharing engines across the industry’s premier digital design tools, and using a unique, Fusion data model for both logical and physical representation
Design Fusion, ECO Fusion, Signoff Fusion, and … Read More → "Synopsys Introduces Breakthrough Fusion Technology to Transform the RTL-to-GDSII Flow"

Synopsys Enables Robust Design Optimization for Next-generation High-performance Computing, Mobile and Automotive Products with IC Compiler II and RedHawk Analysis Fusion

First Product Available from Exclusive Partnership with ANSYS that Brings Power Integrity and Reliability Signoff Technology Earlier in the Design Flow

March 20, 2018

MOUNTAIN VIEW, Calif., March 19, 2018 /PRNewswire/ —

Highlights:

Production capability delivered on schedule per partnership announcement in June 2017
Analysis/optimization of voltage drop and electromigration reduces ECOs and cycle time
Seamless integration enhances ease-of-use with virtually no learning curve

CG360 develops first of kind SMM tool to market; “bigger than SIEM”

March 19, 2018

WILTON, CT and LARCHMONT, NY–CyberGuard 360 (Read More → "CG360 develops first of kind SMM tool to market; “bigger than SIEM”"

Accellera Announces Proposed Working Group to Define an IP Security Assurance Specification

Seeks Industry Input on Need for a Standards Development Project

March 19, 2018

Elk Grove, Calif., March 19th, 2018 — Accellera Systems Initiative (Accellera), the electronics industry organization focused on the creation and adoption of electronic design automation (EDA) and intellectual property (IP) standards, announced today the formation of a Proposed Working Group (PWG) to focus on defining security assurance requirements for IP.

“Our mission at Accellera is to provide a platform in which the electronics industry can collaborate to innovate and deliver global standards that improve design and verification productivity for electronics products,” stated Lu Dai, Chair of Accellera. “The new IP Security … Read More → "Accellera Announces Proposed Working Group to Define an IP Security Assurance Specification"

ByteSnap Design kick-starts two-year Vehicle-to-Grid Intelligent Control (VIGIL) project

March 19, 2018

Longbridge, 19 March 2018. Award-winning electronics design consultancy ByteSnap Design and a consortium of partners (Aston University, Nortech Management and Grid Edge) have been awarded a two-year collaborative project VIGIL (Vehicle-to-Grid Intelligent Control) under a Vehicle-to-Grid (V2G) competition, funded by the Office for Low Emission Vehicles (OLEV) and the Department for Business Energy and Industrial Strategy (BEIS).

The VIGIL project is focussed on developing a new communication and control platform for Vehicle-to-Grid/Building (V2G/V2B) systems: an off-vehicle system that controls how, when and the … Read More → "ByteSnap Design kick-starts two-year Vehicle-to-Grid Intelligent Control (VIGIL) project"

Xilinx Unveils Revolutionary Adaptable Computing Product Category

March 19, 2018

SAN JOSE, Calif., March 19, 2018 – Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive and intelligent computing, today announced a new breakthrough product category called Adaptive Compute Acceleration Platform (ACAP) that goes far beyond the capabilities of an FPGA. An ACAP is a highly integrated multi-core heterogeneous compute platform that can be changed at the hardware level to adapt to the needs of a wide range of applications and workloads. An ACAP’s adaptability, which can be done dynamically during operation, delivers levels of performance and performance per-watt that is … Read More → "Xilinx Unveils Revolutionary Adaptable Computing Product Category"

50 to 1000V Surface Mount Rectifier Diodes now available from JPR Electronics

March 19, 2018

Specialist distributor JPR Electronics can now offer from stock the HY Electronic SMA 1A series of rectifier diodes. Seven devices are available with reverse voltages of 50V, 100V, 200V, 400V, 600V, 800V and 1000V, all rated at 1A forward current.

STMicroelectronics’ Products Complete Alibaba IoT Validation, Enabling Better Time to Market for Customers

March 19, 2018

Shanghai, March 19, 2018 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced the validation of its LSM6DSL 6-axis inertial sensor and LPS22HB pressure sensor for Alibaba IoT’s ecosystem, which enables users to create complete IoT (Internet-of-Things) nodes and gateway solutions with better time to market.

Announced last year, AliOS Things is a light-weight embedded operating system for Internet of Things, developed … Read More →

ZF Switches & Sensors ZF Presents Wireless Energy Harvesting KNX Light Switch Module

March 19, 2018

Launching at Light+Building 2018 in Frankfurt
Module already available in serial production

At Light+Building 2018 in Frankfurt from 18th to 23rd March, ZF Friedrichshafen AG, Business Unit Electronic Systems, presents the world’s first wireless energy harvesting KNX light switch module that is configurable via ETS (from ETS5). Visitors can experience the new device at ZF’s stand in Hall 9.0 B54 and at the KNX stand in Hall 8.0 F98

Regardless of whether it’s being used as a light … Read More → "ZF Switches & Sensors ZF Presents Wireless Energy Harvesting KNX Light Switch Module"

Cadence Sigrity PowerDC Technology Supports Future Facilities’ New Open Neutral File Format for Thermal Interoperability

Format adoption expands Sigrity PowerDC thermal component model base

March 19, 2018

SAN JOSE, Calif., March 19, 2018—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Cadence® Sigrity™ PowerDC™ technology supports Future Facilities’ new open neutral file format, which solves the challenge of sharing design models between different thermal simulation toolsets. The PowerDC technology’s adoption of the single, open-model file format streamlines the thermal supply chain, promotes interoperability and data exchange, and enables customers to improve their thermal and electrical designs while also accelerating their schedule. With easy access to thermal models, design teams using PowerDC technology can shorten design … Read More → "Cadence Sigrity PowerDC Technology Supports Future Facilities’ New Open Neutral File Format for Thermal Interoperability"