MOUNTAIN VIEW, Calif., March 20, 2018 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), today announced that it … Read More → "Synopsys Named a Leader in the Gartner Magic Quadrant for Application Security Testing for Second Consecutive Year"
Henderson, NV – March 19, 2017 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the VT817 and VT819 chassis. The VT817 is a convenient low-cost MicroTCA.4 PCIe Gen3 Expansion solution, providing a flexible and effective method of incorporating MTCA.4 acquisition and control hardware into a PC processing environment. The shelf offers two AMC slots and an integrated MCH. The front panel ports accept PCIe Gen3 inputs from VadaTech’s PCI123 PCIe Gen3 board. In use with the PCI123, the VT817 can link x16 PCIe Gen3 to an Industrial PC. There are options for … Read More → "VadaTech Announces New Compact MTCA.4 Chassis"
MOUNTAIN VIEW, Calif., March 20, 2018 /PRNewswire/ — Continuing a decade-long tradition established by Black Duck Software, Synopsys, Inc.</ … Read More → "Synopsys Announces 2018 Open Source Rookies of the Year"
Munich and Waldenburg, Germany – 19 March 2018 – Under the name 760308EMP-WPT-200W, Würth Elektronik eiSos and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) are offering a 200-watt development system for wireless power transfer. What makes the development kit special is that the link between the transmitter and receiver coils can be used to transfer not only power but also data.
The 760308EMP-WPT-200W development kit comprises a power supply, a transmitter unit and a receiver unit, and is an innovative and powerful solution … Read More → "New 200-watt development system: Combining wireless power and data transmission"
MOUNTAIN VIEW, Calif., March 20, 2018 /PRNewswire/ —
Highlights:
GRENOBLE, France – March 20, 2018 – CEA-Leti, a French technology research institute of the CEA and Inac, a joint fundamental research institute between the CEA and the University Grenoble Alpes, today announced a breakthrough towards large-scale fabrication of quantum bits, or qubits, the elementary bricks of future quantum processors. They demonstrated on a 300 mm pre-industrial platform a new level of isotopic purification in a film deposited by chemical vapor deposition (CVD). This enables creating qubits in thin layers of silicon using a very high purity silicon isotope, 28Si, which produces a crystalline quality comparable to thin films usually … Read More → "CEA Shows Path to Creating Building Blocks of Quantum Processors with 28Si Isotope in a CMOS Fab Line"
San Jose, Calif. – [March 20, 2018] – At the Open Compute U.S. Summit 2018 today, four leading suppliers of power solutions announced a new alliance, the Power Stamp Alliance, to create collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters. These 48V direct conversion DC-DC modules – or ‘power stamps’ – primarily target high-performance computers and … Read More → "Power Industry Leaders Create Alliance for 48V Direct-Conversion Applications"
Waterloo, Ontario — Mar 20, 2018 – Pixus Technologies, a provider of embedded computing and enclosure solutions, offers OpenVPX platforms with a mix of card guides that allow IEEE 1101.10 air cooled and IEEE 1101.2 conduction cooled boards to be tested in the same enclosure.
The Pixus OpenVPX Development Chassis allows the use of Rear Transition Modules (RTMs) and up to 8 backplane slots at a 1” pitch. The open frame design provides a convenient approach to … Read More → "New OpenVPX Development Platform from Pixus Features Mix of Conduction and Air Cooled Card Guides"
Santa Clara, Calif. (March 20, 2018) – Marvell (NASDAQ:MRVL), a leader in storage, networking and connectivity semiconductor solutions, today announced that it is launching innovative NVM Express® (NVMe™)-based chipset solutions that will accelerate the time to market for application-optimized data center SSD implementations. These new, highly-versatile building blocks can optimally address current and emerging workload storage requirements, spanning capacity, latency, performance, power and cost, to enable tailored SSD solutions for specific cloud and enterprise workloads.
The proliferation of cloud services and new technologies, such as artificial intelligence and machine learning, is driving … Read More → "Marvell Introduces Industry’s First NVMe Chipset Solutions to Address Emerging Data Center SSD Requirements"
