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Rafael Micro Licenses Cadence Tensilica Fusion F1 DSP for Low-Power NB-IoT Modem IC

Fusion F1 DSP provides a low-power, cost-effective solution for cellular NB-IoT modems
July 3, 2018

SAN JOSE, Calif., June 27, 2018—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Rafael Micro, a leading global provider of silicon tuners, has licensed the Cadence® Tensilica® Fusion F1 DSP for its RT580 narrowband (NB) internet of things (IoT) modem IC, which integrates RF radio and includes necessary firmware support. The Fusion F1 DSP allowed Rafael Micro to implement its modem with 36 percent lower power and 45 percent smaller code size compared to a competitive processor they also evaluated. In addition, … Read More → "Rafael Micro Licenses Cadence Tensilica Fusion F1 DSP for Low-Power NB-IoT Modem IC"

Sophia Antipolis presents The International Summit of Artificial Intelligence

July 3, 2018

Europe’s first science and technology park and digital cradle, Sophia Antipolis, will host, from Nov. 7th to 9th, 2018, the top Artificial Intelligence specialists for a summit dedicated to researchers, businesses, economical partners, students and the general public.

Comprising key players like INRIA alongside an exceptional ecosystem composed of historical digital players, Sophia Antipolis is a world-renowned location for AI development. Sophia Antipolis is the rightful place to organize this event in the context of the French Pre- sident announcement and the Villani report defining AI as a key issue for the future.

Scientific conferences, … Read More → "Sophia Antipolis presents The International Summit of Artificial Intelligence"

DSP Group’s Ultra-Low-Power Development Kit Boosts Far-Field Speech Accuracy for Amazon Alexa Voice Service

HDClear 3-Microphone Development Kit Enables Superior Performance for AVS in Smart Speakers, Tablets, and Smart Home Products
July 2, 2018

Milpitas, Calif., June 28, 2018 – DSP Group, Inc. (NASDAQ: DSPG), a leading global provider of wireless chipset solutions for converged communications, today announced the availability of its HDClear™ 3-Mic Development Kit for Amazon Alexa Voice Service (AVS). Featuring DBMD5, DSP Group’s advanced audio/voice processor, and its best-in-class HDClear™ voice enhancement processing technology, the new DSP Group Development Kit is a low-power solution for developers who … Read More → "DSP Group’s Ultra-Low-Power Development Kit Boosts Far-Field Speech Accuracy for Amazon Alexa Voice Service"

Increase Functionality in Sensor Nodes with New 8-bit tinyAVR® MCUs

ATtiny3217 and ATtiny3216 join Microchip’s tinyAVR family with largest memory in the series
July 2, 2018

CHANDLER, Ariz., June 28, 2018 — AVR® microcontrollers (MCUs) have long been used to create highly responsive sensor nodes because of their cost effectiveness and ease of implementation. To enhance the capability and responsiveness of applications in these settings, Microchip Technology Inc. (NASDAQ: MCHP) has expanded its tinyAVR MCU series to include two new devices with advanced analog features and the largest memory variant in the family. Designed for reliable operation in harsh environments, the devices come with built-in safety functions to help designers create robust and safe systems.

Ideal for sensor … Read More → "Increase Functionality in Sensor Nodes with New 8-bit tinyAVR® MCUs"

Renesas Electronics’ R-Car Virtualization Software Package Paves Way for Integrated Cockpit and Connected Car Devices with Hypervisor for R-Car System-on-Chips

July 2, 2018

MILPITAS, Calif., June 28, 2018 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the “R-Car virtualization support package” that enables easier development of hypervisors for the R-Car automotive system-on-chips (SoCs). The R-Car virtualization support package includes, at no charge, both the R-Car hypervisor development guide document and sample software for use as reference in such development for software vendors who develop the embedded hypervisors that are required for integrated cockpits and connected car applications. A hypervisor is a virtualization operating system (OS) that allows multiple guest OS, such as Linux, Android™, and various real-time … Read More → "Renesas Electronics’ R-Car Virtualization Software Package Paves Way for Integrated Cockpit and Connected Car Devices with Hypervisor for R-Car System-on-Chips"

Saelig Introduces Economical SVA1015X 1.5GHz Spectrum & Vector Network Analyzer

The SVA1015X is an economical tool for measuring signal distortion, modulation, spectrum purity, frequency stability, and crosstalk distortion signal parameters, for locating cable fault, and characterizing antenna networks and filters.
July 2, 2018
Fairport, NY, USA: Saelig Company, Inc. has introduced the Siglent SVA1015X Spectrum / Vector Network Analyzer – a powerful tool for measuring the performance of RF circuits and networks such as amplifiers, filters, attenuators, cables, and antennas. With a wide frequency range from 9kHz to 1.5GHz, the SVA1015X analyzer delivers reliable automatic measurements with its built-in tracking generator and multiple modes of operation. With the optional VNA package, this swept super-heterodyne spectrum analyzer can operate as a vector network analyzer, a frequency domain reflectometer for distance-to-fault location, and a modulation analyzer. User-friendly operation is enhanced by the … Read More → "Saelig Introduces Economical SVA1015X 1.5GHz Spectrum & Vector Network Analyzer"

IAR Systems updates industry-leading development tools for Renesas RX MCUs

Users of IAR Embedded Workbench for Renesas RX can now benefit from C11/C++14 support, stack protection functionality and support for the advanced on-chip debugging E2 emulator from Renesas Electronics
July 2, 2018

Uppsala, Sweden—July 2, 2018—IAR Systems®, the future-proof supplier of software tools and services for embedded development, presents version 4.10 of the development toolchain IAR Embedded Workbench® for Renesas RX. The new version includes several capabilities which enable developers to further ensure code quality and make debugging more efficient for embedded applications based on Renesas RX microcontrollers (MCUs).

IAR Embedded Workbench for Renesas RX is widely used among companies all over the world as it provides everything developers need in one single integrated development environment. The included IAR C/C++ Compiler™ offers Renesas RX ABI compliance. With version 4.10, … Read More → "IAR Systems updates industry-leading development tools for Renesas RX MCUs"

Symmetry Electronics Distributes New Development Kit for Amazon Alexa-Enabled Devices

June 29, 2018

Los Angeles, CA (June 28, 2018) – Symmetry Electronics, a leading global distributor of wireless, IoT and video technologies, today announced the available distribution of DSP Group’s HDClear™ 3-Mic Development Kit for Amazon Alexa Voice Service (AVS). The HDClear 3-Mic Development Kit for Amazon AVS enables OEMs to integrate Amazon Alexa into a number of IoT products, including smart speakers, smart home devices, wearable devices, and remote sensors. Symmetry is stocking, selling and supporting the HDClear 3-Mic Development Kit for its global customer base, available for purchase Read More → "Symmetry Electronics Distributes New Development Kit for Amazon Alexa-Enabled Devices"

Saelig Introduces Teledyne LeCroy Mercury T2C/T2P USB2.0 Protocol and Power Analyzers

June 29, 2018

Fairport, NY: Saelig Company, Inc. has announced the availability of the new Teledyne LeCroy Mercury T2P and T2C USB2.0 Analyzers, low cost, robust USB Type-C Protocol Analyzers with upgraded VBUS (power) analysis and optional support for DisplayPort™ Auxiliary channel message decoding. They offer full support for USB 2.0 protocol testing and adds advanced USB Type-C analysis capabilities. There are two base models: the Mercury T2C and the new Mercury T2P, which adds the Power Tracker™ graphical analysis of VBUS and CC voltages.These pocket-sized analyzers capture and decode the widest range of USB 2.0 device classes plus … Read More → "Saelig Introduces Teledyne LeCroy Mercury T2C/T2P USB2.0 Protocol and Power Analyzers"

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