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Bosch launches new generation of smart sensor hubs BHI260 and BHA260 for wearables, hearables, AR/VR and other mobile devices

  • Enables sophisticated always-on sensor applications, while significantly reducing the system power consumption in mobile, battery-operated devices
  • Updated MEMS sensors and a new, powerful MCU integrated in a single, small package, with a wide variety of interfaces to connect external devices
  • Software Development Kit for full customization available, creating an open and flexible development environment for sensor applications
  • Bosch to exhibit at Sensors Expo, June 27-28, McEnery Convention Center, MEMS Pavilion, Booth 542

San Jose, USA/Reutlingen, Germany – Today, at Sensors … Read More → "Bosch launches new generation of smart sensor hubs BHI260 and BHA260 for wearables, hearables, AR/VR and other mobile devices"

Synopsys and Siemens Team Up to Expand and Extend Electronic Design Automation Collaboration

MOUNTAIN VIEW, Calif., July 3, 2018 /PRNewswire/ — Synopsys, Inc. (NASDAQ: SNPS) and Siemens PLM Software today announced that they have agreed to collaborate on a wide range of electronic design automation (EDA) product interoperability projects for the benefit of their mutual customers. The collaboration spans a number of EDA domains from design to verification.

“With the increasing complexity in electronics driven … Read More → "Synopsys and Siemens Team Up to Expand and Extend Electronic Design Automation Collaboration"

Qorvo® Powers New Commercial 802.11ax Carrier Gateway

GREENSBORO, NC – July 2, 2018 – Qorvo® (Nasdaq:QRVO), a leading provider of innovative RF solutions that connect the world, today announced that its high efficiency 5GHz front end module (FEM) QPF4528  is part of a new, commercially available … Read More → "Qorvo® Powers New Commercial 802.11ax Carrier Gateway"

RS Components, MikroElektronika, Cypress Semiconductor co-create flexible platform for faster IoT-device development

LONDON, UK, 26 February, 2018 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, has worked with Cypress Semiconductor Corp. ( https://uk.rs-online.com/web/b/cypress-semiconductor/ ) and MikroElektronika ( Read More → "RS Components, MikroElektronika, Cypress Semiconductor co-create flexible platform for faster IoT-device development"

Cadence JasperGold Formal Verification Platform Enables Hitachi to Develop Measures for Fault Avoidance to Comply with IEC 61508 Series SIL 4 Requirements

SAN JOSE, Calif., July 5, 2018—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Hitachi, Ltd. has used the Cadence JasperGold Formal Verification Platform to developνCOSS S-zero, an industrial facilities functional safety controller that has been certified for Safety Integrity Level (SIL) 3 in accordance with the International Electrotechnical Commission (IEC) 61508 Series functional safety standard. Through use of the Cadence technologies, Hitachi successfully developed measures for fault avoidance to comply with IEC 61508 Series SIL 4 requirements, ensuring that its functional safety controller operates correctly in response to its inputs and … Read More → "Cadence JasperGold Formal Verification Platform Enables Hitachi to Develop Measures for Fault Avoidance to Comply with IEC 61508 Series SIL 4 Requirements"

Cadence Full-Flow Digital and Signoff Tools Certified on Samsung Foundry’s 7LPP Process Technology

SAN JOSE, Calif., July 2, 2018—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its full-flow digital and signoff tools have achieved certification for Samsung Foundry’s 7-nanometer (nm) Low Power Plus (LPP) process technology. The Cadence® tools were certified for the Process Design Kit (PDK) and foundation library on the 7LPP process and confirmed to meet Samsung Foundry’s accuracy requirements, enabling systems and semiconductor companies to accelerate the delivery of 7LPP designs.

The Cadence RTL-to-GDSII design flow that has been certified for the 7LPP process … Read More → "Cadence Full-Flow Digital and Signoff Tools Certified on Samsung Foundry’s 7LPP Process Technology"

ams launches new sensors for smart home devices that optimize brightness in any lighting condition

Premstaetten, Austria (27 June, 2018) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today introduced a new family of ambient light and proximity sensors which offer high sensitivity, low-power, and small package size required for use in display/LED brightness control in consumer electronics devices. The family includes the TSL2540 and TSL2541 ambient light sensors and the TSL2740, a combined ambient light and proximity sensor.

The new family delivers very high sensitivity when detecting ambient light at an intensity as low as a few millilux – the equivalent of a clear night … Read More → "ams launches new sensors for smart home devices that optimize brightness in any lighting condition"

CUI Partners with SnapEDA to Offer Free PCB Footprint Files

TUALATIN, Ore. — June 27, 2018 — CUI today announced that it has teamed up with SnapEDA, ( https://www.snapeda.com/ ) the market-leading parts library for circuit board design, to provide designers with a catalog of free, ready-to-download PCB footprints and symbols for CUI’s range of board mount electromechanical components.

Circuit board design has historically been a time-consuming and challenging process due to the … Read More → "CUI Partners with SnapEDA to Offer Free PCB Footprint Files"

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