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Samtec Releases Flyover™ QSFP28 Cable System

New Albany, IN: Samtec, a privately held $713MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the Flyover™ QSFP28 Cable System. This new system can support 28G NRZ/56G PAM 4 data rates per channel, and it provides system design flexibility.

Samtec’s Flyover™ QSFP28 Cable System allows sideband signaling via press-fit contacts to improve airflow, reduce loss, and mitigate skew. This system can provide aggregate data rates of 100Gbps NRZ/200 Gbps PAM4, and is compatible with all MSA QSFP pluggables. A variety of heat sink options are available and allow a heat dissipation … Read More → "Samtec Releases Flyover™ QSFP28 Cable System"

Rudolph Technologies Launches Second-Generation Dragonfly Inspection and Metrology System for Advanced Packaging

Wilmington, Mass. (August 29, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced its new Dragonfly™ G2 platform, which incorporates many of the benefits of the Firefly™ system onto the Dragonfly platform, including higher sensitivity and throughput and the proprietary Clearfind™ Technology. The new system increases the options for advanced packaging customers to meet their wafer-based application challenges on a single platform. To date, customer evaluations have reported throughput increases greater than 50 percent over the first-generation Dragonfly system. The new Dragonfly G2 systems are scheduled to begin shipment in the latter part of the fourth quarter and … Read More → "Rudolph Technologies Launches Second-Generation Dragonfly Inspection and Metrology System for Advanced Packaging"

EpiGaN Showcases GaN Epiwafer Solutions for 5G

Hasselt, Belgium, August 29, 2018 — EpiGaN, a leading European
supplier of GaN (Gallium Nitride) technology solutions for power
switching, RF (radio frequency) and sensor applications, will exhibit
and highlight its latest GaN epiwafer developments tailored to 5G
applications at the Semicon Taiwan show in Taipeh (Sept 5-7), and at the
European Microwave Week in Madrid/Spain (EuMW, Sept 23-28).

EpiGaN, headquartered in Hasselt/Belgium, is a global supplier of
GaN-on-Si and GaN-on-SiC product solutions for next-generation
semiconductor technology devices. GaN enables smaller, lighter and
higher-performance systems with added functionality for power … Read More → "EpiGaN Showcases GaN Epiwafer Solutions for 5G"

Peratech’s force sensitive sensor brings extra functionality to mobile devices

Touch Taiwan, Taipei  – 29 August, 2018. Peratech, a world leader in force-sensing technology has introduced a new force touch sensor for use with mobile devices.  The distributed force array (DFA) sensor uses Peratech’s proprietary quantum tunnelling composite (QTC) technology to provide an array of single point sensors that can be used in conjunction with a position sensor (such as capacitive) to measure force and correlate it with position.

The DFA sensor’s variable input force allows for additional, or new, functionality, such as the ability to navigate device menus and perform other operations via single-finger touch. The DFA … Read More → "Peratech’s force sensitive sensor brings extra functionality to mobile devices"

Honeywell IHM Series Aerospace Proximity Sensors reduce downtime and maintenance costs – now at TTI

August 2018 – Honeywell’s IHM Series Aerospace Proximity Sensors for commercial and military aircraft are now available at TTI, Inc., a world leading specialist distributor of electronic components.  Honeywell has over thirty years’ experience designing accurate and reliable aircraft proximity sensors for extreme environments, and its IHM Series reduces downtime and maintenance costs by obviating the need for unnecessary preventative maintenance and troubleshooting.  The IHM Series has a unique circuit that can detect any internal failure modes and display a fault output, instead of a false positive or false negative.  The patented technology of the IHM Series is … Read More → "Honeywell IHM Series Aerospace Proximity Sensors reduce downtime and maintenance costs – now at TTI"

Rutronik24’s Latest Feature: CAD Visualization of Components

Plano, TX (August 29, 2018) – The e-commerce platform www.rutronik24.com has launched a new feature enabling developers to choose between different CAD models of the components available on the site and download them for use in their own design programs. To achieve this, Rutronik24 has partnered with Ultra Librarian.

Rutronik24 is working with Ultra Librarian, a platform that offers development engineers access to an extensive library of various CAD formats to display the components in 3D. To implement the feature on Rutronik24, a button that is visible to logged-in users and labeled “CAD Models” was added to each … Read More → "Rutronik24’s Latest Feature: CAD Visualization of Components"

IoT development kit available from RS Components connects out of the box to advanced Cloud-services platform

LONDON, UK, 28 August, 2018 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), a global multi-channel distributor, has introduced a Cloud-enabled development kit that kick-starts IoT-sensing projects by allowing users to collect and analyse data on a dashboard within minutes after unboxing.

The UrsaLeo UL-NXP1S2R2 kit (https://uk.rs-online.com/web/p/sensor-development-kits/1750395/</ … Read More → "IoT development kit available from RS Components connects out of the box to advanced Cloud-services platform"

Microsemi RTG4 FPGAs Become Industry’s First High-Speed Signal Processing Radiation-Tolerant FPGAs to Achieve QML Class V Qualification

ALISO VIEJO, Calif.—Aug. 28, 2018—Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), today announced its RTG4™ high-speed signal processing radiation-tolerant field programmable gate arrays (FPGAs) have achieved Qualified Manufacturers List (QML) Class V qualification by the Defense Logistics Agency (DLA). The designation, the highest level of qualification for Read More → "Microsemi RTG4 FPGAs Become Industry’s First High-Speed Signal Processing Radiation-Tolerant FPGAs to Achieve QML Class V Qualification"

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