TUALATIN, Ore. — September 4, 2018 — CUI’s Power Group today announced a new line of compact, chassis mount ac-dc power supplies housed in an enclosed metal case. The VGS‑B series ( https://www.cui.com/metal-encl
Rolla, Missouri – Sept. 4, 2018 – Brewer Science, Inc. today from SEMICON Taiwan introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials, as well as the first product in its new BrewerBUILD™ line of thin spin-on packaging materials. BrewerBUILD delivers an industry-first solution to address manufacturers’ evolving wafer-level packaging challenges.
The BrewerBOND T1100 and BrewerBOND C1300 series combine … Read More → "Brewer Science Unveils BrewerBOND® Dual-Layer Temporary Bonding System and BrewerBUILD™ Material for RDL-First Fan-Out Packaging"
SAN JOSE, Calif., Sept 4, 2018—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it has launched a broad ecosystem with nine initial printed circuit board (PCB) manufacturing partners to enable customers to easily get the partners’ technology files they need to ensure PCB design manufacturability early in the design process. This reduces rework, shortens design cycles, and accelerates new product introduction. Customers have received savings from half to two-thirds fewer technical queries (TQs) from manufacturers when they’ve used the Cadence® DesignTrue DFM (design for manufacturability) technology due to using tailor-made spacing, annular ring, copper features and mask rules … Read More → "Cadence DesignTrue DFM Ecosystem Connects Manufacturers with Customers to Ensure PCB Design Manufacturability Early in the Design Process"
A billion MEMS timing solutions from SiTime enable synchronization and connectivity of electronic devices
SANTA CLARA, Calif., September 4, 2018 – Read More → "SiTime and Bosch Accelerate Innovation in MEMS Timing for 5G and IoT"
Zurich, 18th July 2018 – At the heart of the high-end Mercury+ AA1 SoC module from Enclustra is the Intel Arria 10 SoC, which features 20 nm technology and comes with an integrated dual-core ARM processor. Up to 286 user I/Os are available for communication with the outside world, including 12 multi-gigabit transceivers, each offering a data transfer rate of up to 12.5 Gbit/sec. Featuring interfaces for USB 3.0, PCIe Gen3 x8 and Gigabit Ethernet, the connectivity requirements of almost every application can be easily met. The module’s up to 4 GByte large DDR4 SDRAM with ECC also allows for immense data throughput with guaranteed … Read More → "Intel® Arria® 10 module, smaller than a credit card"
Uppsala, Sweden—September 3, 2018—IAR Systems®, the future-proof supplier of software tools and services for embedded development, started off its global developers conference series IAR DevCon in North America in May of 2018. Now, the industry leader continues the successful developers conference in several locations across Europe, targeting developers and designers with content on security, IoT, industrial, automotive, medical and general embedded development.
IAR DevCon comes in a compact half-day format, lasting from 9:00 to 14:00. The conference begins with a keynote from one of IAR Systems’ representatives, giving insights to key industries and the latest market updates. Following the keynote, … Read More → "IAR Systems brings its successful developers conference IAR DevCon to Europe"
Västerås, Sweden, 3th September 2018 * * * Percepio, the leader in software trace visualization for embedded systems and IoT, announces the immediate availability of free Tracealyzer site licensesfor higher engineering education.
Percepio has long supported both technical universities and their students with heavily discounted licenses for our tracing and visualisation tool Tracealyzer, but today we are taking this to the next level.
“The embedded community has been very helpful and supportive of us these past several years as we were just starting out. Now it’s our turn to give something back to the … Read More → "Free Tracealyzer licenses for education"
GREENSBORO, NC – August 30, 2018 – Qorvo® (Nasdaq:QRVO), a leading provider of innovative RF solutions that connect the world, and LEEDARSON, a world-class lighting and IoT solutions company, have partnered to create a family of smart home lighting products that operate concurrently with Zigbee® 3.0 and Bluetooth Low Energy (BLE) 5.0 protocols – offering compatibility with the most popular IoT standards. The first of these solutions is a new LEEDARSON smart light bulb and light switch that integrates Qorvo’s QPG6095 system-on-chip (SoC), a multi-protocol/multi-channel smart home communications controller for ultra-low-power wireless applications.
… Read More → "Qorvo® and LEEDARSON Launch Multi-Standard Smart Lighting Solutions for IoT"
Tessenderlo, Belgium – August 30, 2018 — X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry group, today announced plans to double their 6-inch Silicon Carbide (SiC) process capacity at its fab in Lubbock, Texas in response to increased customer demand for high efficiency power semiconductor devices.
In preparation for doubling capacity, X-FAB Texas has purchased a second heated ion implanter for use in manufacturing 6-inch SiC wafers. Delivery of this heated ion implanter is expected by the end of 2018, and production release is planned during the first quarter of 2019 in time to meet projected near-term demand.
… Read More → "X-FAB Doubles 6-Inch SiC Foundry Capacity in Response to Customer Demand"
August 31, 2018 – Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, is now stocking the Read More → "NXP’s Rapid IoT Prototyping Kit Now Available from Mouser for Accelerating Edge Node Proof-of-Concept Development"
