News – Page 1044 – EEJournal

Industry’s first 200-W and 100-W USB Type-C™ and USB Power Delivery controllers with fully integrated power paths simplify designs

TI controllers enable higher power in dual- and single-port applications

September 20, 2018

DALLAS (Sept. 18, 2018) –Texas Instruments (TI) (NASDAQ: TXN) today introduced two new USB Type-C™ and USB Power Delivery (PD) controllers, with fully integrated power paths to simplify designs, minimize solution size and speed time to market. The TPS65987D and TPS65988 offer system designers the industry’s highest level of integration which can reduce design complexity and overall cost. For more information, see Read More → "Industry’s first 200-W and 100-W USB Type-C™ and USB Power Delivery controllers with fully integrated power paths simplify designs"

Newark element14 Adds New High-Performance Solutions to Test & Tool Product Range

High value products underline commitment to quality, affordability and innovation

September 20, 2018

Chicago, September 17, 2018: Newark element14, the Development Distributor, has added a new wave of innovative tools to their test & tool product range, including solutions developed by industry-leading suppliers Flir, Fluke, Pico Technology and Weller.

This latest expansion demonstrates element14’s commitment to offering the broadest range of test and tool equipment in the high-service distribution market – an achievement that has won recognition … Read More → "Newark element14 Adds New High-Performance Solutions to Test & Tool Product Range"

Rohde & Schwarz to present world’s first Bluetooth® LE signaling test solution at Bluetooth World 2018

September 20, 2018

Many manufacturers of Bluetooth® Low Energy components find it challenging to test modules and sensors in compliance with the standard. These devices often have no port or interface to connect to a control line for testing them in direct test mode (DTM) as stipulated by the Bluetooth® LE standard. The R&S CMW test platform from Rohde & Schwarz now enables over-the-air (OTA) tests as well as conducted measurements on these devices.

Munich, September 18, 2018 — Rohde & Schwarz will present its Bluetooth Low Energy (BLE) signaling test solution for signaling RF tests under realistic conditions at Bluetooth … Read More → "Rohde & Schwarz to present world’s first Bluetooth® LE signaling test solution at Bluetooth World 2018"

IAR Systems enables high-quality automotive applications with major updates in Renesas RH850 tools

IAR Embedded Workbench for Renesas RH850 strengthens stability and reliability in automotive embedded applications through C11 and C++14 support, stack protection, support for Renesas Smart Configurator and more

September 20, 2018

Uppsala, Sweden – September 19, 2018 – IAR Systems®, the future-proof supplier of software tools and services for embedded development, presents a major update of its development tools for Renesas automotive-focused RH850 microcontrollers (MCUs). The latest version of the complete C/C++ compiler and debugger toolchain IAR Embedded Workbench® for Renesas RH850 offers boosted user experience and extended capabilities through a number of new features.

IAR Embedded Workbench for Renesas RH850 incorporates a compiler, a debugger, an assembler and a linker in one integrated development environment. It is available in several editions to suit different company needs, including a functional safety … Read More → "IAR Systems enables high-quality automotive applications with major updates in Renesas RH850 tools"

eSilicon to demonstrate silicon performance of its 7nm 56G long-reach SerDes at ECOC, September 24-26, 2018

Join us in Anritsu’s Booth, #408

September 20, 2018

San Jose, Calif.

eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will demonstrate the silicon performance of its 7nm 56G long-reach SerDes during ECOC in Rome, Italy on September 24-26.

What
7nm 56G long-reach SerDes demonstration
Read More → "eSilicon to demonstrate silicon performance of its 7nm 56G long-reach SerDes at ECOC, September 24-26, 2018"

ASSET’s fast test and programming tools for NXP i.MX6 application processors accelerate design and production

September 20, 2018

In development, ScanWorks automates complex DDR tuning to optimize memory performance

– In manufacturing, faster flash programming with ScanWorks enhances throughput

– In repair, ScanWorks’ automated functional test at processor speeds finds the toughest faults quickly

Richardson, TX (September 19, 2018) – Faster test and programming tools from ASSET® InterTech will accelerate development and production cycles for designs based on i.MX 6 application processors from NXP. These new tools, which join the ScanWorks® platform for fast test and programming, take advantage of a target agent running out of a small … Read More → "ASSET’s fast test and programming tools for NXP i.MX6 application processors accelerate design and production"

Cadence Launches New Tensilica DNA 100 Processor IP Delivering Industry-Leading Performance and Power Efficiency for On-Device AI Applications

DNA 100 processor easily scales from 0.5 to 100s of TMACs for neural network inferencing in automotive, surveillance, robotics, drones, AR/VR, smartphone, smart home and IoT products

September 20, 2018

SAN JOSE, Calif., September 19, 2018—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the Cadence® Tensilica® DNA 100 Processor IP, the first deep neural-network accelerator (DNA) AI processor IP to deliver both high performance and power efficiency across a full range of compute from 0.5 TeraMAC (TMAC) to 100s of TMACs. As a result, the DNA 100 processor is well suited for on-device neural network inference applications spanning autonomous vehicles (AVs), ADAS, surveillance, robotics, drones, augmented reality (AR) /virtual reality (VR), smartphones, smart home and IoT. The DNA 100 processor delivers up to 4.7X better performance and up to 2.3X more performance per watt … Read More → "Cadence Launches New Tensilica DNA 100 Processor IP Delivering Industry-Leading Performance and Power Efficiency for On-Device AI Applications"

Cadence Achieves Amazon Web Services Industrial Software Competency Status for Its Cloud-Hosted Design Solution

Cadence also achieves Advanced Technology Partner status in the Amazon Web Services Partner Network for demonstrating cloud leadership in the electronic systems and semiconductor space

September 19, 2018

SAN JOSE, Calif., September 18, 2018—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its Cloud-Hosted Design Solution has undergone rigorous technical validation and achieved Amazon Web Services (AWS) Industrial Software Competency status. This recognizes the Cadence® solution has demonstrated technical proficiency and proven customer success with electronic systems and semiconductor companies. The Cadence Cloud-Hosted Design Solution enables customers to increase the pace of product innovation while decreasing production and operational overhead by providing a turnkey cloud solution optimized for systems and semiconductor projects.

Achieving the AWS Industrial Software Competency differentiates Cadence as an AWS Partner Network (APN) … Read More → "Cadence Achieves Amazon Web Services Industrial Software Competency Status for Its Cloud-Hosted Design Solution"

Rohde & Schwarz presents solutions for optimizing power electronics

September 19, 2018

High voltage differential broadband probes allow analysis of switching behavior in fast switching semiconductors. High-sensitivity oscilloscopes with fast FFT functionality combined with near-field probes help developers minimize unwanted EMC emissions in switched-mode power supplies. All-in-one power analyzers enable characterization of energy consumption from µW to kW. Rohde & Schwarz is presenting this portfolio for today’s development requirements in power electronics at the EPE Conference in Riga from September 17 to 21, 2018.

Munich, September 17, 20118 — The Rohde & Schwarz range of innovative test and measurement solutions meets the increasing high T&M requirements for power electronics. Large measurement bandwidths … Read More → "Rohde & Schwarz presents solutions for optimizing power electronics"

GOWIN Semiconductor Unveils the Latest Embedded Memory Products for Their Families of Programmable Logic Devices

September 19, 2018

GUANGZHOU, China, Sept. 17, 2018 (GLOBE NEWSWIRE) — GOWIN Semiconductor Corp., the world’s leading innovator of programmable logic devices, announces 2 new additions to the current families of embedded memory FPGA devices, the GW1NR-LV4MG81 and GW1NSR-LX2CQN48. As computing functions are being distributed to edge locations, the need for silicon to adapt to these new uses is becoming prevalent. The 2 new embedded FPGA devices were designed with low power, small package size, and low cost in mind.

Adopting an edge to cloud infrastructure is challenging. Each portion of the chain has its own unique characteristics in design. … Read More → "GOWIN Semiconductor Unveils the Latest Embedded Memory Products for Their Families of Programmable Logic Devices"

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